Analog in-memory computing (AIMC) cores offers significant performance and energy benefits for neural network inference with respect to digital logic (e.g., CPUs). AIMCs accelerate matrix-vector multiplications, which dominate these applications' run-time. However, AIMC-centric platforms lack the flexibility of general-purpose systems, as they often have hard-coded data flows and can only support a limited set of processing functions. With the goal of bridging this gap in flexibility, we present a novel system architecture that tightly integrates analog in-memory computing accelerators into multi-core CPUs in general-purpose systems. We developed a powerful gem5-based full system-level simulation framework into the gem5-X simulator, ALPINE, which enables an in-depth characterization of the proposed architecture. ALPINE allows the simulation of the entire computer architecture stack from major hardware components to their interactions with the Linux OS. Within ALPINE, we have defined a custom ISA extension and a software library to facilitate the deployment of inference models. We showcase and analyze a variety of mappings of different neural network types, and demonstrate up to 20.5x/20.8x performance/energy gains with respect to a SIMD-enabled ARM CPU implementation for convolutional neural networks, multi-layer perceptrons, and recurrent neural networks.

This paper presents the research directions pursued by the WiPLASH European project, pioneering on-chip wireless communications as a disruptive enabler towards next-generation computing systems for artificial intelligence (AI). We illustrate the holistic approach driving our research efforts, which encompass expertises and abstraction levels ranging from physical design of embedded graphene antennas to system-level evaluation of wirelessly-communicating heterogeneous systems.

In-memory computing is an emerging computing paradigm enabling deep-learning inference at significantly higher energy-efficiency and reduced latency. The essential idea is mapping the synaptic weights of each layer to one or more in-memory computing (IMC) cores. During inference, these cores perform the associated matrix-vector multiplications in place with O(1) time complexity, obviating the need to move the synaptic weights to additional processing units. Moreover, this architecture enables the execution of these networks in a highly pipelined fashion. However, a key challenge is designing an efficient communication fabric for the IMC cores. In this work, we present one such communication fabric based on a graph topology that is well-suited for the widely successful convolutional neural networks (CNNs). We show that this communication fabric facilitates the pipelined execution of all state-of-the-art CNNs by proving the existence of a homomorphism between the graph representations of these networks and that corresponding to the proposed communication fabric. We then present a quantitative comparison with established communication topologies and show that our proposed topology achieves the lowest bandwidth requirements per communication channel. Finally, we present one hardware implementation and show a concrete example of mapping ResNet-32 onto an IMC core array interconnected via the proposed communication fabric.

The increasing complexity of Internet-of-Things (IoT) applications and near-sensor processing algorithms is pushing the computational power of low-power, battery-operated end-node systems. This trend also reveals growing demands for high-speed and energy-efficient inter-chip communications to manage the increasing amount of data coming from off-chip sensors and memories. While traditional microcontroller interfaces such as SPIs cannot cope with tight energy and large bandwidth requirements, low-voltage swing transceivers can tackle this challenge, thanks to their capability to achieve several Gbps of the communication speed at milliwatt power levels. However, recent research on high-speed serial links focused on high-performance systems, with a power consumption significantly larger than the one of low-power IoT end-nodes, or on stand-alone designs not integrated at a system level. This article presents a low-swing transceiver for the energy-efficient and low-power chip-to-chip communication fully integrated within an IoT end-node system-on-chip, fabricated in CMOS 65-nm technology. The transceiver can be easily controlled via a software interface; thus, we can consider realistic scenarios for the data communication, which cannot be assessed in stand-alone prototypes. Chip measurements show that the transceiver achieves$8.46\times $higher energy efficiency at$15.9\times $higher performance than a traditional microcontroller interface such as a single-SPI.

We report on the design of the physical layer of a high-speed serial interface for chip-to-chip communication, targeting low cost and ultra-low power (mW) IoT end-nodes. Two differential lanes (one pair per direction) are used to transmit/receive NRZ symbols at 1Gpbs with embedded clock. The energy-per-bit is lower than 1pJ/bit, thanks to a careful selection of termination impedance and voltage swing, tuned for moderate speed and short distance (2cm). The transceiver is designed to tolerate significant clock jitter, so that it can work with a half-rate clock shared with the rest of the chip, thereby minimizing area and power of supporting circuitry.