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Srikant Bharadwaj

dblp:232/0137 · DBLP profile ↗
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4ranked-venue papers
4as first author
2since 2021 · last 2023
0000-0002-0422-5210ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 4 · 4 first-author · 2 since 2021Software engineering, systems software and programming languages · 1 · 1 first-author · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
3 papers
Interconnection networks and networks-on-chip · 36% Energy-efficient computing · 33% GPUs and heterogeneous computing · 14%

Topics — the 10 heaviest of 11, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Energy-efficient computing › power management
dynamic voltage and frequency scaling
0.712023
Predict; Don't React for Enabling Efficient Fine-Grain DVFS in GPUs · ASPLOS (4) 2023
Energy-efficient computing › power management › dynamic voltage and frequency scaling
fine-grain DVFS
0.712023
Predict; Don't React for Enabling Efficient Fine-Grain DVFS in GPUs · ASPLOS (4) 2023
GPUs and heterogeneous computing
GPU power management
0.712023
Predict; Don't React for Enabling Efficient Fine-Grain DVFS in GPUs · ASPLOS (4) 2023
Interconnection networks and networks-on-chip
die-to-die interconnect
0.412020
Kite: A Family of Heterogeneous Interposer Topologies Enabled via Accurate Interconnect Modeling · DAC 2020
Interconnection networks and networks-on-chip › network-on-chip design
interposer-based noc
0.412020
Kite: A Family of Heterogeneous Interposer Topologies Enabled via Accurate Interconnect Modeling · DAC 2020
Interconnection networks and networks-on-chip › network topology › network topology design
network-on-chip topology
0.412020
Kite: A Family of Heterogeneous Interposer Topologies Enabled via Accurate Interconnect Modeling · DAC 2020
Interconnection networks and networks-on-chip › interconnect architecture
low-latency interconnect
0.312018
Scalable Distributed Last-Level TLBs Using Low-Latency Interconnects · MICRO 2018
Memory systems › memory management › virtual memory › address translation
TLB
0.312018
Scalable Distributed Last-Level TLBs Using Low-Latency Interconnects · MICRO 2018
Memory systems › memory management
virtual memory
0.312018
Scalable Distributed Last-Level TLBs Using Low-Latency Interconnects · MICRO 2018
Energy-efficient computing › power delivery
integrated voltage regulator
0.212023
Predict; Don't React for Enabling Efficient Fine-Grain DVFS in GPUs · ASPLOS (4) 2023

Methods — techniques the papers use, named apart from their topics

prediction · 0.7DVFS · 0.7single-cycle interconnect design · 0.3
YearPublicationVenuePosition
2023 Predict; Don't React for Enabling Efficient Fine-Grain DVFS in GPUs
abstract
With the continuous improvement of on-chip integrated voltage regulators (IVRs) and fast, adaptive frequency control, dynamic voltage-frequency scaling (DVFS) transition times have shrunk from the microsecond to the nanosecond regime, providing immense opportunity to improve energy efficiency. The key to unlocking the continued improvement in V/f circuit technology is the creation of new, smarter DVFS mechanisms that better adapt to rapid fluctuations in workload demand.
Srikant Bharadwaj, Shomit Das, Kaushik Mazumdar, Bradford M. Beckmann, Stephen V. Kosonocky
ASPLOS (4)1
2021 DUB: dynamic underclocking and bypassing in nocs for heterogeneous GPU workloads
abstract
The performance of graphics processing units (GPU) workloads can be sensitive to the various clock domains which are dynamically tunable in modern GPUs. In this work, we observe that GPU application performance is sensitive towards NoC clock frequencies and the sensitivity varies during the execution of GPU kernels. We note that this heterogeneity is not adapted well by traditional dynamic voltage frequency scaling (DVFS) techniques. To that end, we introduce DUB, Dynamic Underclocking and Bypassing technique, for such heterogeneous GPU workloads. We enable bypassing re-timer flops and routers while underclocking the NoC frequency thus enabling high power savings at minimal performance loss. Compared to baseline we observe a 26% improvement in power savings with only 3% degradation in performance beating oracular DVFS techniques.
Srikant Bharadwaj, Shomit Das, Yasuko Eckert, Mark Oskin, Tushar Krishna
NOCS1
2020 Kite: A Family of Heterogeneous Interposer Topologies Enabled via Accurate Interconnect Modeling
abstract
Recent advances in die-stacking and 2.5D chip integration technologies introduce in-package network heterogeneities that can complicate the interconnect design. Integrating chiplets over a silicon interposer offers new opportunities of optimizing interposer topologies. However, limited by the capability of existing network-on-chip (NoC) simulators, the full potential of the interposer-based NoCs has not been exploited. In this paper, we address the shortfalls of prior NoC designs and present a new family of chiplet topologies called Kite. Kite topologies better utilize the diverse networking and frequency domains existing in new interposer systems and outperform the prior chiplet topology proposals. Kite decreased synthetic traffic latency by 7% and improved the maximum throughput by 17% on average versus Double Butterfly and Butter Donut, two previous proposals developed using less accurate modeling.
Srikant Bharadwaj, Jieming Yin, Bradford M. Beckmann, Tushar Krishna
DAC1
2018 Scalable Distributed Last-Level TLBs Using Low-Latency Interconnects
abstract
Recent studies have shown the potential of last-level TLBs shared by multiple cores in tackling memory translation performance challenges posed by "big data" workloads. A key stumbling block hindering their effectiveness, however, is their high access time. We present a design methodology to reduce these high access times so as to realize high-performance and scalable shared L2 TLBs. As a first step, we study the benefits of replacing monolithic shared TLBs with a distributed set of small TLB slices. While this approach does reduce TLB lookup latency, it increases interconnect delays in accessing remote slices. Therefore, as a second step, we devise a lightweight single-cycle interconnect among the TLB slices by tailoring wires and switches to the unique communication characteristics of memory translation requests and responses. Our approach, which we dub NOCSTAR (NOCs for scalable TLB architecture), combines the high hit rates of shared TLBs with low access times of private L2 TLBs, enabling significant system performance benefits.
Srikant Bharadwaj, Guilherme Cox, Tushar Krishna, Abhishek Bhattacharjee
MICRO1