EDBT 2026 Demo / reviewers in the wild / expert
Serkan Ozdemir
dblp:24/5700
· DBLP profile ↗
10ranked-venue papers
3as first author
0since 2021 · last 2012
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 10 · 3 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
6 papers |
Memory systems · 36% Hardware reliability and fault tolerance · 19% Processor architecture and microarchitecture · 17% |
Topics — the 11 heaviest of 14, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Memory systems
cache design |
0.2 | 3 | 2009 | Selective wordline voltage boosting for caches to manage yield under process variations · DAC 2009 Variable latency caches for nanoscale processor · SC 2007 Yield-Aware Cache Architectures · MICRO 2006 |
Memory systems
cache |
0.1 | 2 | 2008 | Evaluating the effects of cache redundancy on profit · MICRO 2008 Variable latency caches for nanoscale processor · SC 2007 |
Hardware reliability and fault tolerance › process variation
process variation tolerance |
0.1 | 1 | 2009 | Selective wordline voltage boosting for caches to manage yield under process variations · DAC 2009 |
Electronic design automation
yield management |
0.1 | 1 | 2009 | Selective wordline voltage boosting for caches to manage yield under process variations · DAC 2009 |
Processor architecture and microarchitecture
pipelining |
0.1 | 1 | 2007 | Variable latency caches for nanoscale processor · SC 2007 |
Electronic design automation › yield analysis
parametric yield |
0.1 | 1 | 2006 | Yield-Aware Cache Architectures · MICRO 2006 |
Memory systems › cache
on-chip cache |
0.1 | 1 | 2005 | Thermal Management of On-Chip Caches Through Power Density Minimization · MICRO 2005 |
Energy-efficient computing
thermal management |
0.1 | 1 | 2005 | Thermal Management of On-Chip Caches Through Power Density Minimization · MICRO 2005 |
Energy-efficient computing › power management › memory power management
cache energy reduction |
0.0 | 1 | 2009 | Selective wordline voltage boosting for caches to manage yield under process variations · DAC 2009 |
Energy-efficient computing
power management |
0.0 | 1 | 2009 | Selective wordline voltage boosting for caches to manage yield under process variations · DAC 2009 |
Energy-efficient computing
leakage power reduction |
0.0 | 1 | 2005 | Thermal Management of On-Chip Caches Through Power Density Minimization · MICRO 2005 |
Methods — techniques the papers use, named apart from their topics
simulation · 0.1layer-to-layer variation exploitation · 0.1neural network · 0.1linear regression · 0.1SPICE modeling · 0.1row-level power gating · 0.1block permutation · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2012 | Fine-Grain Voltage Tuned Cache Architecture for Yield Management Under Process VariationsabstractProcess variations cause large fluctuations in performance and power consumption in the manufactured chips, which eventually results in yield losses. In this paper, to mitigate access time failures and excessive leakage in caches, we propose a novel selective wordline boosting mechanism combined with SRAM cell arrays voltage lowering. Based on our evaluation, the proposed approach recovers up to 83.1% of the yield losses. Joonho Kong, Yan Pan 0010, Serkan Ozdemir, Anitha Mohan, Gokhan Memik, Sung Woo Chung |
IEEE Trans. Very Large Scale Integr. Syst. | 3 |
| 2010 | Quantifying and coping with parametric variations in 3D-stacked microarchitecturesabstractVariability in device characteristics, i.e., parametric variations, is an important problem for shrinking process technologies. They manifest themselves as variations in performance, power consumption, and reduction in reliability in the manufactured chips as well as low yield levels. Their implications on performance and yield are particularly profound on 3D architectures: a defect on even a single layer can render the entire stack useless. In this paper, we show that instead of causing increased yield losses, we can actually exploit 3D technology to reduce yield losses by intelligently devising the architectures. We take advantage of the layer-to-layer variations to reduce yield losses by splitting critical components among multiple layers. Our results indicate that our proposed method achieves a 30.6% lower yield loss rate compared to the same pipeline implemented on a 2D architecture. Serkan Ozdemir, Yan Pan 0003, Gokhan Memik, Gabriel H. Loh, Alok N. Choudhary |
DAC | 1 |
| 2009 | Selective wordline voltage boosting for caches to manage yield under process variationsabstractOne of the most important hurdles of technology scaling is process variations, i.e., variations in device characteristics. Process variations cause large fluctuations in performance and power consumption in the manufactured chips. In addition, these fluctuations cause reductions in the chip yields. In this work, we present an analysis of a representative high-performance processor architecture and show that the caches have the highest probability of causing yield losses under process variations. We then propose a novel selective wordline voltage boosting mechanism that aims at reducing the latency of the cache lines that are affected by process variations. We show that our approach can eliminate over 80% of the yield losses under medium level of variations, while incurring less than 1% per-access energy overhead on average and less than 4.5% area overhead. Yan Pan 0010, Joonho Kong, Serkan Ozdemir, Gokhan Memik, Sung Woo Chung |
DAC | 3 |
| 2008 | Evaluating the effects of cache redundancy on profitabstractPrevious works in computer architecture have mostly neglected revenue and/or profit, key factors driving any design decision. In this paper, we evaluate architectural techniques to optimize for revenue/profit. The continual trend of technology scaling and sub-wavelength lithography has caused transistor feature sizes to shrink into the nanoscale range. As a result, the effects of process variations on critical path delay and chip yields have amplified. A common concept to remedy the effects of variations is speed-binning, by which chips from a single batch are rated by a discrete range of frequencies and sold at different prices. An efficient binning distribution thus decides the profitability of the chip manufacturer. We propose and evaluate a cache-redundancy scheme called substitute cache, which allows the chip manufacturers to modify the number of chips in different bins. Particularly, this technique introduces a small fully associative array associated with each cache way to replicate the data elements that will be stored in the high latency lines, and hence can be effectively used to boost up the overall chip yield and also shift the chip binning distribution towards higher frequencies. We also develop models based on linear regression and neural networks to accurately estimate the chip prices from their architectural configurations. Using these estimation models, we find that our substitute cache scheme can potentially increase the revenue for the batch of chips by as much as 13.1%. Berkin Özisikyilmaz, Serkan Ozdemir, Gokhan Memik, Joseph Zambreno, Alok N. Choudhary |
MICRO | 3 |
| 2007 | Evaluating voltage islands in CMPs under process variationsabstractParameter variations are a major factor causing power-performance asymmetry in chip multiprocessors. In this paper, we analyze the effects of with-in-die (WID) process variations on chip multicore processors and then apply a variable voltage island scheme to minimize power dissipation. Our idea is based on the observation that due to process variations, the critical paths in each core are likely to have a different latencies resulting in core-to-core (C2C) variations. As a result, each core can operate correctly under different supply voltage levels, achieving an optimal power consumption level. Particularly, we analyze voltage islands at different granularities ranging from a single core to a group of cores. We show that the dynamic power consumption can be reduced by up to 36.2% when each core can set its individual supply voltage level. In addition, for most manufacturing technologies, significant power savings can be achieved with only a few voltage islands on the whole chip: a single customized voltage setting can reduce the power consumption by up to 31.5%. Since the nominal operating frequency remains unchanged after the modifications, our scheme incurs no performance overhead. Serkan Ozdemir, Gokhan Memik, Alok N. Choudhary |
ICCD | 2 |
| 2007 | Variable latency caches for nanoscale processorabstractVariability is one of the important issues in nanoscale processors. Due to increasing importance of interconnect structures in submicron technologies, the physical location and phenomena such as coupling have an increasing impact on the latency of operations. Therefore, traditional view of rigid access latencies to components wil result in suboptimal architectures. In this paper, we devise a cache architecture with variable access latency. Particularly, we a) develop a non-uniform access level 1 data-cache, b) study the impact of coupling and physical location on level 1 data cache access latencies, and c) develop and study an architecture where the variable latency cache can be accessed while the rest of the pipeline remains synchronous. To find the access latency with different input address transitions and environmental conditions, we first build a SPICE model at a 45nm technology for a cache similar to that of the level 1 data cache of the Intel Prescott architecture. Motivated by the large difference between the worst and best case latencies and the shape of the distribution curve, we change the cache architecture to allow variable latency accesses. Since the latency of the cache is not known at the time of instruction scheduling, we also modify the functional units with the addition of special queues that will temporarily store the dependent instructions and allow the data to be forwarded from the cache to the functional units correctly. Simulations based on SPEC2000 benchmarks show that our variable access latency cache structure can reduce the execution time by as much as 19.4% and 10.7% on average compared to a conventional cache architecture. Serkan Ozdemir, Arindam Mallik, Ja Chun Ku, Gokhan Memik, Yehea I. Ismail |
SC | 1 |
| 2007 | Thermal Management of On-Chip Caches Through Power Density MinimizationabstractVarious architectural power reduction techniques have been proposed for on-chip caches in the last decade. In this paper, we first show that these power reduction techniques can be suboptimal when thermal effects are considered. Then, we propose a thermal-aware cache power-down technique that minimizes the power density of the active parts by turning off alternating rows of memory cells instead of entire banks. The decrease in the power density lowers the temperature, which then exponentially reduces the leakage. Thus, leakage power of the active parts is reduced in addition to the power eliminated from the parts that are turned off. Simulations based on SPEC2000, NetBench, and MediaBench applications in a 70-nm technology show that the proposed thermal-aware architecture can reduce the total energy consumption by 53% compared to a conventional cache, and 14% compared to a cache architecture with thermal-unaware power reduction scheme. Second, we show a block permutation scheme that can be used during the design of the caches to maximize the distance between blocks with consecutive addresses. Because of spatial locality, blocks with consecutive addresses are likely to be accessed within a short time interval. By maximizing the distance between such blocks, we minimize the power density of the hot spots in the cache, and hence reduce the peak temperature. This, in return, results in an average leakage power reduction of 8.7% compared to a conventional cache without affecting the dynamic power and the latency. Overall, both of our architectures add no extra run-time penalty compared to the thermal-unaware power reduction schemes, yet they result in a significant reduction in the total energy consumption of a cache Ja Chun Ku, Serkan Ozdemir, Gokhan Memik, Yehea I. Ismail |
IEEE Trans. Very Large Scale Integr. Syst. | 2 |
| 2006 | Power density minimization for highly-associative caches in embedded processorsabstractCaches are essential components in embedded processors, taking up a significant fraction of the chip area and power. As a result of the relatively large size and infrequent activity, leakage power of caches is becoming an important problem. There exist a number of power density minimization schemes that distribute the activity evenly among computational entities, thereby lowering the temperature to reduce the leakage power. In this paper, we first present various power density minimization schemes for highly-associative caches in embedded processors via access distribution. It is then suggested that they should be used in conjunction with other power-down techniques to be more effective. We show that conventional power-down techniques for on-chip caches can be suboptimal if thermal effects are ignored, and propose a thermal-aware power-down technique that minimizes power density of the active parts. Simulations based on MediaBench, NetBench, and MiBench applications in a 70nm technology show that the proposed thermal-aware schemes can improve leakage power savings of a conventional power-down technique by 8.5% on average, and up to 23%. Ja Chun Ku, Serkan Ozdemir, Gokhan Memik, Yehea I. Ismail |
ACM Great Lakes Symposium on VLSI | 2 |
| 2006 | Yield-Aware Cache ArchitecturesabstractOne of the major issues faced by the semiconductor industry today is that of reducing chip yields. As the process technologies have scaled to smaller feature sizes, chip yields have dropped to around 50% or less. This figure is expected to decrease even further in future technologies. To attack this growing problem, we develop four yield-aware micro architecture schemes for data caches. The first one is called yield-aware power-down (YAPD). YAPD turns off cache ways that cause delay violation and/or have excessive leakage. We also modify this approach to achieve better yields. This new method is called horizontal YAPD (H-YAPD), which turns off horizontal regions of the cache instead of ways. A third approach targets delay violation in data caches. Particularly, we develop a variable-latency cache architecture (VACA). VACA allows different load accesses to be completed with varying latencies. This is enabled by augmenting the functional units with special buffers that allow the dependants of a load operation to stall for a cycle if the load operation is delayed. As a result, if some accesses take longer than the predefined number of cycles, the execution can still be performed correctly, albeit with some performance degradation. A fourth scheme we devise is called the hybrid mechanism, which combines the YAPD and the VACA. As a result of these schemes, chips that may be tossed away due to parametric yield loss can be saved. Experimental results demonstrate that the yield losses can be reduced by 68.1% and 72.4% with YAPD and H-YAPD schemes and by 33.3% and 81.1% with VACA and Hybrid mechanisms, respectively, improving the overall yield to as much as 97.0% Serkan Ozdemir, Debjit Sinha, Gokhan Memik, Hai Zhou 0001 |
MICRO | 1 |
| 2005 | Thermal Management of On-Chip Caches Through Power Density MinimizationabstractVarious architectural power reduction techniques have been proposed for on-chip caches in the last decade. However, these techniques mostly ignore the effects of temperature on the power consumption. In this paper, first we show that these power reduction techniques can be suboptimal when thermal effects are considered. Particularly, we propose a thermal-aware cache power-down technique that minimizes the power density of the active parts by turning off alternating rows of memory cells instead of entire banks. The decrease in the power density lowers the temperature, which in return, reduces the leakage of the active parts. Simulations based on SPEC2000 benchmarks in a 70nm technology show that the proposed thermal-aware architecture can reduce the total energy consumption by 53% compared to a conventional cache, and 14% compared to a cache architecture with thermal-unaware power reduction scheme. Second, we show a block permutation scheme that can be used during the design of caches to maximize the distance between blocks with consecutive addresses. By maximizing the distance between consecutively accessed blocks, we minimize the power density of the hot spots in the cache, and hence reduce the peak temperature. This, in return, results in an average leakage power reduction of 8.7% compared to a conventional cache without affecting the dynamic power and the latency. Overall, both of our architectures add no extra run-time penalty compared to the thermal-unaware power reduction schemes, yet they reduce the total energy consumption of a conventional cache by 53% and 5.6% on average, respectively. Ja Chun Ku, Serkan Ozdemir, Gokhan Memik, Yehea I. Ismail |
MICRO | 2 |