Solid-state drive (SSD) gradually dominates in the high-performance storage scenarios. Three-dimension (3D) NAND flash memory owning high-storage capacity is becoming a mainstream storage component of SSD. However, the interferences of the new 3D charge-trap (CT) NAND flash are getting unprecedentedly complicated, yielding to many problems regarding reliability and performance. Alleviating these problems needs to understand the characteristics of 3D CT NAND flash memory deeply. To facilitate such understanding, in this article, we delve into characterizing the performance, reliability, and threshold voltage ( V th ) distribution of 3D CT NAND flash memory. We make a summary of these characteristics with multiple interferences and variations and give several new insights and a characterization methodology. Especially, we characterize the skewed ( V th ) distribution, ( V th ) shift laws, and the exclusive layer variation in 3D NAND flash memory. The characterization is the backbone of designing more reliable and efficient flash-based storage solutions.

3D charge trap (CT) triple-level cell (TLC) NAND flash gradually becomes a mainstream storage component due to high storage capacity and performance, but introducing a concern about reliability. Fault tolerance and data management schemes are capable of improving reliability. Designing a more efficient solution, however, needs to understand the reliability characteristics of 3D CT TLC NAND flash. To facilitate such understanding, by exploiting a real-world testing platform, we investigate the reliability characteristics including the raw bit error rate (RBER) and the threshold voltage (Vth) shifting features after suffering from variable disturbances. We give analyses of why these characteristics exist in 3D CT TLC NAND flash. We hope these observations can guide the designers to propose high efficient solutions to the reliability problem.