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EDBT 2026 Demo / reviewers in the wild / expert

Dhawal Mahajan

dblp:250/0823 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 2020
0000-0003-1076-0495ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Hardware reliability and fault tolerance · 54% Integrated circuit design · 46%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Hardware reliability and fault tolerance
aging and degradation		 0.412020
An Analytical Model for Hot Carrier Induced Long-Term Degradation in Power Amplifiers · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020
Integrated circuit design
analog and mixed-signal circuits		 0.412020
An Analytical Model for Hot Carrier Induced Long-Term Degradation in Power Amplifiers · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020
Hardware reliability and fault tolerance › aging
hot-carrier effect		 0.412020
An Analytical Model for Hot Carrier Induced Long-Term Degradation in Power Amplifiers · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020
Integrated circuit design › analog and mixed-signal circuits › amplifier design
power amplifier design		 0.412020
An Analytical Model for Hot Carrier Induced Long-Term Degradation in Power Amplifiers · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020
Hardware reliability and fault tolerance
design for reliability		 0.112020
An Analytical Model for Hot Carrier Induced Long-Term Degradation in Power Amplifiers · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020

Methods — techniques the papers use, named apart from their topics

substrate current analysis · 0.4relxpert simulation · 0.4analytical reliability modeling · 0.4
YearPublicationVenuePosition
2020 An Analytical Model for Hot Carrier Induced Long-Term Degradation in Power Amplifiers
abstract
Degradation of power amplifier (PA), being a main part of a transceiver chain, affects the overall performance of a transceiver. This article reports, for the first time, an analytical reliability model of the hot-carrier injection (HCI) induced degradation in silicon-based PAs. HCI causes substrate current which is used to develop the proposed model. This model fits very well the simulation results of RelXpert, which is a well-established reliability simulation tool. This model predicts circuit degradation as a function of conduction angle and is valid for the different classes of PAs. With this model, a new approach for “reliability aware design” for PA design is developed and a tradeoff between PA performance and reliability is introduced.
Hossein Eslahi, Sayed Ali Albahrani, Dhawal Mahajan, Sourabh Khandelwal
 IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3