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Dingwei Li

dblp:255/0924 · DBLP profile ↗
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2ranked-venue papers
0as first author
2since 2021 · last 2026
—ORCID · unresolved

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 1 · 1 since 2021Graphics, computer vision, multimedia, augmented reality and games · 1 · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Artificial intelligence
1 paper
Efficient and distributed learning · 100%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Emerging computing paradigms · 50% Hardware accelerators and domain-specific architectures · 50%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Hardware accelerators and domain-specific architectures
in-sensor computing
1.012026
An optoelectronic artificial spiking neuron array with biomimetic spike-temporal pattern for in-sensor visual prediction · Sci. China Inf. Sci. 2026
Emerging computing paradigms
neuromorphic computing
1.012026
An optoelectronic artificial spiking neuron array with biomimetic spike-temporal pattern for in-sensor visual prediction · Sci. China Inf. Sci. 2026
Machine learning › Efficient and distributed learning › model reuse
learnware
0.912025
Slice-and-Pack: Tailoring Deep Models for Customized Requirements · AAAI 2025
Machine learning › Efficient and distributed learning
model compression
0.912025
Slice-and-Pack: Tailoring Deep Models for Customized Requirements · AAAI 2025
Machine learning › Efficient and distributed learning
model reuse
0.912025
Slice-and-Pack: Tailoring Deep Models for Customized Requirements · AAAI 2025

Methods — techniques the papers use, named apart from their topics

spike-timing-dependent plasticity · 1.0optoelectronic devices · 1.0layer-wise unit extraction · 0.9encoder-decoder assembly · 0.9
YearPublicationVenuePosition
2026 An optoelectronic artificial spiking neuron array with biomimetic spike-temporal pattern for in-sensor visual prediction
Rui Wang 0153, Guolei Liu, Dingwei Li, Xiaotao Jing, Fanfan Li, Zhixian Wu, Zhongfang Zhang, Huihui Ren, Saisai Wang, Hong Wang 0008
Sci. China Inf. Sci.3
2025 Slice-and-Pack: Tailoring Deep Models for Customized Requirements
abstract
The learnware paradigm aims to establish a learnware market such that users can build their own models by reusing appropriate existing models in the market without starting from scratch. It is often the case that a single model is insufficient to fully satisfy the user's requirement. Meanwhile, offering multiple models can lead to higher costs for users alongside an increase in hardware resource demands. To address this challenge, this paper proposes the ''Slice-and-Pack'' (S&P) framework to empower the market to provide users with only the required model fragments without having to offer entire abilities of all involved models. Our framework first slices a set of models into small fragments and subsequently packs selected fragments according to user's specific requirement. In the slicing stage, we extract units layer by layer and connect these units to create numerous fragments. In the packing stage, an encoder-decoder mechanism is employed to assemble these fragments. These processes are conducted within data-limited constraints due to privacy concerns. Extensive experiments validate the effectiveness of our framework.
Ruice Rao, Dingwei Li
AAAI2