Outsourced PCB fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on AOI have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward ML solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FPIC dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our dataset.

For successful printed circuit board (PCB) reverse engineering (RE), the resulting device must retain the physical characteristics and functionality of the original. Although the applications of RE are within the discretion of the executing party, establishing a viable, non-destructive framework for analysis is vital for any stakeholder in the PCB industry. A widely regarded approach in PCB RE uses non-destructive x-ray computed tomography (CT) to produce three-dimensional volumes with several slices of data corresponding to multi-layered PCBs. However, the noise sources specific to x-ray CT and variability from designers hampers the thorough acquisition of features necessary for successful RE. This article investigates a deep learning approach as a successor to the current state-of-the-art for detecting vias on PCB x-ray CT images; vias are a key building block of PCB designs. During RE, vias offer an understanding of the PCB’s electrical connections across multiple layers. Our method is an improvement on an earlier iteration which demonstrates significantly faster runtime with quality of results comparable to or better than the current state-of-the-art, unsupervised iterative Hough-based method. Compared with the Hough-based method, the current framework is 4.5 times faster for the discrete image scenario and 24.1 times faster for the volumetric image scenario. The upgrades to the prior deep learning version include faster feature-based detection for real-world usability and adaptive post-processing methods to improve the quality of detections.

Artificial intelligence (AI) and machine learning (ML) techniques have been increasingly used in several fields to improve performance and the level of automation. In recent years, this use has exponentially increased due to the advancement of high-performance computing and the ever increasing size of data. One of such fields is that of hardware design—specifically the design of digital and analog integrated circuits, where AI/ ML techniques have been extensively used to address ever-increasing design complexity, aggressive time to market, and the growing number of ubiquitous interconnected devices. However, the security concerns and issues related to integrated circuit design have been highly overlooked. In this article, we summarize the state-of-the-art in AI/ML for circuit design/optimization, security and engineering challenges, research in security-aware computer-aided design/electronic design automation, and future research directions and needs for using AI/ML for security-aware circuit design.

Over the past two decades, globalized outsourcing in the semiconductor supply chain has lowered manufacturing costs and shortened the time-to-market for original equipment manufacturers (OEMs). However, such outsourcing has rendered the printed circuit boards (PCBs) vulnerable to malicious activities and alterations on a global scale. In this article, we take an in-depth look into one such attack, called the “Big Hack,” that was recently reported by Bloomberg Buisnessweek. The article provides background on the Big Hack from three perspectives: an attacker, a security investigator, and the societal impacts. This study provides details on vulnerabilities in the modern PCB supply chain, the possible attacks, and the existing and emerging countermeasures. The necessity for novel visual inspection techniques for PCB assurance is emphasized throughout the article. Further, a review of various imaging modalities, image analysis algorithms, and open research challenges are provided for automated visual inspection.

Modern integrated circuits (ICs) possess several countermeasures to safeguard sensitive data and information stored in the device. In recent years, semi-invasive physical attacks based on optical debugging techniques have proven to be capable of easily bypassing these security measures implemented in the chip. Optical attacks can reveal the data stored in memory, cache and register through various methods such as photon emission analysis, laser fault injection, laser voltage probing, and thermal laser stimulation. The above-mentioned methods, which employ laser scanning microscopy and photon emission microscopy, are effective because the silicon substrate is transparent to near-infrared (NIR) photons. Therefore, the most vulnerable part of an IC to optical attacks is the backside, where the chip's transistors can be accessed and probed with a NIR laser beam. Although different optical attack detection and avoidance mechanisms have been proposed, many can be circumvented and none are universal solutions for all types of optical attacks. In this study, we present a taxonomy of the different types of optical attacks and the security threats posed by each type. Then we discuss the existing prevention-detection based solutions to optical probing attacks which will set the future research direction.