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Zekang Cheng

dblp:263/9089 · DBLP profile ↗
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2ranked-venue papers
0as first author
2since 2021 · last 2025
0009-0001-9047-1783ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 2 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Hardware accelerators and domain-specific architectures · 40% Integrated circuit design · 20% Interconnection networks and networks-on-chip · 20%

Topics — the 3 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
design space exploration
0.912025
Theseus: Exploring Efficient Wafer-Scale Chip Design for Large Language Models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025
Integrated circuit design
digital circuit design
0.912025
MHE-TPE: Multi-Operand High-Radix Encoder for Mixed-Precision Fixed-Point Tensor Processing Engines · MICRO 2025
Interconnection networks and networks-on-chip
network-on-chip design
0.912025
Theseus: Exploring Efficient Wafer-Scale Chip Design for Large Language Models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025

Methods — techniques the papers use, named apart from their topics

multi-fidelity bayesian optimization · 0.9
YearPublicationVenuePosition
2025 MHE-TPE: Multi-Operand High-Radix Encoder for Mixed-Precision Fixed-Point Tensor Processing Engines
Qizhe Wu, Jinyi Zhou, Zhanhe Hu, Zhichen Zeng 0002, Huawen Liang, Jiuru Zhu, Linfeng Tao, Xin Zhang 0176, Zekang Cheng, Letian Zhao, Wei Yuan 0006, Xi Jin 0002
MICRO9
2025 Theseus: Exploring Efficient Wafer-Scale Chip Design for Large Language Models
abstract
The emergence of the large language model (LLM) poses an exponential growth of demand for computation throughput, memory capacity, and communication bandwidth. Such a demand growth has significantly surpassed the improvement of corresponding chip designs. With the advancement of fabrication and integration technologies, designers have been developing Wafer-Scale Chips (WSCs) to scale up and exploit the limits of computation density, memory capacity, and communication bandwidth at the level of a single chip. Existing solutions have demonstrated the significant advantages of WSCs over traditional designs, showing potential to effectively support LLM workloads. Despite the benefits, exploring the early-stage design space of WSCs for LLMs is a crucial yet challenging task due to the enormous and complicated design space, time-consuming evaluation methods, and inefficient exploration strategies. To address these challenges, we propose Theseus, an efficient WSC design space exploration framework for LLMs. We construct the design space of WSCs with various constraints considering the unique characteristics of WSCs. We propose efficient evaluation methodologies for large-scale NoC-based WSCs and introduce multi-fidelity Bayesian optimization to efficiently explore the design space. Evaluation results demonstrate the efficiency of Theseus that the searched Pareto optimal results outperform GPU cluster and existing WSC designs by up to 62.8%/73.7% in performance (with the same or lower power) and 38.6%/42.4% in power consumption (with the same or higher performance) for LLM training, while improving up to 23.2× and 15.7× for the performance and power of inference tasks. Furthermore, we conduct case studies to address the design tradeoffs in WSCs and provide insights to facilitate WSC designs for LLMs.
Jingchen Zhu, Chenhao Xue, Chen Zhang 0001, Yu Shen 0003, Zekang Cheng, Yibo Lin, Wei Hu 0003, Bin Cui 0001, Runsheng Wang, Yun Liang 0001, Guangyu Sun 0003
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.8