Demonstration venue · read-only. Every page can be browsed; the buttons that would change it are switched off. Create an account to run TaxoReview on your own data. A simulation from public publication records: the people listed were not invited and did not agree to review.
? Tutorial for this page

Rishikesh Ranade

dblp:265/6324 · DBLP profile ↗
← Back
3ranked-venue papers
1as first author
3since 2021 · last 2023
0000-0002-7692-7502ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 2 · 1 first-author · 2 since 2021Systems, architecture and hardware · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Artificial intelligence
1 paper
Efficient and distributed learning · 77% Representation and self-supervised learning · 23%
Interdisciplinary, comprehensive, and emerging computing
1 paper
Computational science and engineering · 100%

Topics — the 1 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Computational science and engineering › partial differential equations
partial differential equation simulation
0.612022
A composable machine-learning approach for steady-state simulations on high-resolution grids · NeurIPS 2022

Methods — techniques the papers use, named apart from their topics

low-dimensional manifold · 1.1local learning · 1.1iterative inference · 1.1
YearPublicationVenuePosition
2023 Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization
abstract
Static chip thermal analysis provides detailed and accurate thermal profile on chip. The chip power map, commonly modeled as rectangular regions of distinct heat sources, significantly impacts the chip thermal profile. Since the heat sources result from numerous cells in functional blocks, the design space of chip power map is prohibitively enormous. Numerical simulations can be reliable for solving complex power maps; however, it could be very time-consuming when simulating a large SoC and/or 3DIC designs. Thus, there is an urgent need for speeding up the static chip thermal analysis to tackle various power maps. In this paper, we propose an approach of integrating our developed machine learning thermal solver [1] and decay curve characterization for solving static chip thermal with diverse power maps. The machine learning thermal solver would first solve the power maps on a coarse level (e.g., 200 um). The thermal results are further enhanced using the decay curve algorithm which would fine tune the solution locally provided by the machine learning thermal solver and calculate the local temperature variations at a finer level (e.g., 10 um). The deep learning models are trained on augmented artificial power maps and tested on realistic chip power maps. Experimental results validate the effectiveness of the proposed approach of offering fast and accurate chip thermal profile.
Norman Chang, Jie Yang 0023, Wenbo Xia, Lang Lin, Rishikesh Ranade
ICCAD7
2022 A composable machine-learning approach for steady-state simulations on high-resolution grids
abstract
In this paper we show that our Machine Learning (ML) approach, CoMLSim (Composable Machine Learning Simulator), can simulate PDEs on highly-resolved grids with higher accuracy and generalization to out-of-distribution source terms and geometries than traditional ML baselines. Our unique approach combines key principles of traditional PDE solvers with local-learning and low-dimensional manifold techniques to iteratively simulate PDEs on large computational domains. The proposed approach is validated on more than 5 steady-state PDEs across different PDE conditions on highly-resolved grids and comparisons are made with the commercial solver, Ansys Fluent as well as 4 other state-of-the-art ML methods. The numerical experiments show that our approach outperforms ML baselines in terms of 1) accuracy across quantitative metrics and 2) generalization to out-of-distribution conditions as well as domain sizes. Additionally, we provide results for a large number of ablations experiments conducted to highlight components of our approach that strongly influence the results. We conclude that our local-learning and iterative-inferencing approach reduces the challenge of generalization that most ML models face.
Rishikesh Ranade, Chris Hill, Lalit Ghule, Jay Pathak
NeurIPS1
2021 Algorithmically-consistent deep learning frameworks for structural topology optimization
Jaydeep Rade, Aditya Balu, Ethan Herron, Jay Pathak, Rishikesh Ranade, Soumik Sarkar, Adarsh Krishnamurthy
Eng. Appl. Artif. Intell.5