Demo Data from EDBT 2026 / reviewers in the wild / expert
Xinghai Zhang
dblp:268/1567
· DBLP profile ↗
3ranked-venue papers
2as first author
2since 2021 · last 2022
0000-0001-5519-1201ORCID · corroborated
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 2 · 1 first-author · 1 since 2021Artificial intelligence and machine learning · 1 · 1 first-author · 1 since 2021Software engineering, systems software and programming languages · 1 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 93% Interconnection networks and networks-on-chip · 7% |
Topics — the 5 heaviest of 5, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › physical design › routing › multilayer routing
layer assignment |
0.6 | 1 | 2022 | Timing-Aware Layer Assignment for Advanced Process Technologies Considering via Pillars · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022 |
Electronic design automation
physical design |
0.6 | 1 | 2022 | Timing-Aware Layer Assignment for Advanced Process Technologies Considering via Pillars · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022 |
Electronic design automation › physical design
routing |
0.6 | 1 | 2022 | Timing-Aware Layer Assignment for Advanced Process Technologies Considering via Pillars · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022 |
Electronic design automation › physical design › routing
timing-driven routing |
0.6 | 1 | 2022 | Timing-Aware Layer Assignment for Advanced Process Technologies Considering via Pillars · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022 |
Interconnection networks and networks-on-chip
interconnect delay |
0.2 | 1 | 2022 | Timing-Aware Layer Assignment for Advanced Process Technologies Considering via Pillars · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022 |
Methods — techniques the papers use, named apart from their topics
via pillar · 0.6nondefault-rule wire · 0.6
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2022 | Timing-Aware Layer Assignment for Advanced Process Technologies Considering via PillarsabstractInterconnect delay is a key factor that affects the chip performance in layer assignment. Particularly in the advanced process technologies of 5 nm and beyond, interconnect delay has grown significantly due to the increase of circuit scale. Moreover, coupling effect existed in wires reduces the accuracy of delay evaluation. On the other hand, the size of vias is often ignored in layer assignment, which enlarges the mismatch between global routing and detailed routing. To solve these problems, we proposeVPT, a timing-aware layer assignment algorithm considering via pillars, which includes the following five key techniques: 1) via pillar structure combined with nondefault-rule (NDR) wires is adopted to form a net delay optimization system for advanced process technologies; 2) a synthetical model that can adapt to varying types and sizes of both vias and wires is designed to evaluate overflow effectively; 3) a sorting strategy is devised to reduce uncertainty of layer assignment flow and improve stability of the proposed algorithm; 4) an awareness strategy based on multiaspect congestion assessment is designed to reduce overflow significantly; and 5) a net scalpel algorithm is devised to minimize the maximum delay of nets, so that the timing behaviors can be improved systematically. The experimental results on multiple benchmarks confirm that the proposed algorithm leads to lower delay and less overflow, while achieving the best solution quality among the existing algorithms with the shortest runtime. Genggeng Liu, Xinghai Zhang, Wenzhong Guo, Xing Huang 0001, Wen-Hao Liu 0001, Kai-Yuan Chao, Ting-Chi Wang |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |
| 2021 | Occlusion-Aware Facial Expression Recognition Based Region Re-weight Network
Xinghai Zhang, Xingming Zhang 0001, Jinzhao Zhou, Yubei Lin |
PRICAI (3) | 1 |
| 2020 | MiniDelay: Multi-Strategy Timing-Aware Layer Assignment for Advanced Technology NodesabstractLayer assignment, a major step in global routing of integrated circuits, is usually performed to assign segments of nets to multiple layers. Besides the traditional optimization goals such as overflow and via count, interconnect delay plays an important role in determining chip performance and has been attracting much attention in recent years. Accordingly, in this paper, we propose MiniDelay, a timing-aware layer assignment algorithm to minimize delay for advanced technology nodes, taking both wire congestion and coupling effect into account. MiniDelay consists of the following three key techniques: 1) a non-default-rule routing technique is adopted to reduce the delay of timing critical nets, 2) an effective congestion assessment method is proposed to optimize delay of nets and via count simultaneously, and 3) a net scalpel technique is proposed to further reduce the maximum delay of nets, so that the chip performance can be improved in a global manner. Experimental results on multiple benchmarks confirm that the proposed algorithm leads to lower delay and few vias, while achieving the best solution quality among the existing algorithms with the shortest runtime. Xinghai Zhang, Zhen Zhuang, Genggeng Liu, Xing Huang 0001, Wen-Hao Liu 0001, Wenzhong Guo, Ting-Chi Wang |
DATE | 1 |