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Toshio Sasaki

dblp:273/9612 · DBLP profile ↗
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2ranked-venue papers
0as first author
0since 2021 · last 1993
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Graphics, computer vision, multimedia, augmented reality and games · 1Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Hardware reliability and fault tolerance · 67% Electronic design automation · 33%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Hardware reliability and fault tolerance › aging
hot-carrier effect
0.011993
VLSI reliability challenges: from device physics to wafer scale systems · Proc. IEEE 1993
Hardware reliability and fault tolerance › reliability analysis
VLSI reliability
0.011993
VLSI reliability challenges: from device physics to wafer scale systems · Proc. IEEE 1993
Electronic design automation › hardware verification and test › VLSI testing
wafer testing
0.011993
VLSI reliability challenges: from device physics to wafer scale systems · Proc. IEEE 1993

Methods — techniques the papers use, named apart from their topics

failure analysis · 0.0device physics modeling · 0.0
YearPublicationVenuePosition
1993 VLSI reliability challenges: from device physics to wafer scale systems
abstract
The philosophical and practical differences between Japanese and US IC industries in regard to VLSI reliability, as well as recent research topics and new analysis methods such as wafer scale testing, are discussed. It is suggested that a new approach to VLSI reliability is needed in response to the paradigm shift being brought about by simple scaling limitations, increased process complexity and application of VLSI to advanced systems. An example of this shift is the movement from simple failure analysis by sampling the output of a manufacturing line to the building-in-reliability approach. To introduce and expand on the building-in reliability approach in VLSIs, the authors discuss the required deeper physical understanding of such important processes as hot-carrier effects, dielectrics and metallization.>
Eiji Takeda, Kunihiko Ikuzaki, Hisao Katto, Yuzuru Ohji, Kenji Hinode, Akemi Hamada, Toshiyuki Sakuta, Takahiro Funabiki, Toshio Sasaki
Proc. IEEE9
1986 Generalized Lanczos method for signal smoothing
abstract
This paper proposes a new signal smoothing method which is applicable to any type of signal. This method is a direct extension of the Lanczos signal smoothing method for the truncated Fourier series. The method coincides with the classical Lanczos method if basis functions of a signal space are trigonometric functions. The proposed method is applied to the smoothing for the truncated series of the Hermite functions which are the eigenfunctions of the Fourier transformation.
Atsushi Imiya, Toshio Sasaki, Hidemitu Ogawa
ICASSP2