Backscatter communication is an emerging paradigm for pervasive connectivity of low-power communication devices. Wirelessly powered backscattering wireless sensor networks (WSNs) become particularly important to meet the upcoming era of the Internet of Things (IoT), which requires the massive deployment of self-sustainable and maintenance-free low-cost sensing and communication devices. This article will introduce the state-of-the-art antenna design and radio frequency (RF) system integration for wirelessly powered backscatter communications, covering both the node and the base unit. We capture the latest development in ultralow-power RF front ends and coding schemes for$\mu \text{W}$-level backscatter modulators, as well as the latest progress in wireless power transfer (WPT) and energy harvesting (EH) techniques. Newly emerged rectenna system, waveform design, and channel optimization are reviewed in light of the opportunities for adaptively optimizing the WPT/EH efficiency for low-power signals with varying conditions. In addition, advanced device packaging and integration technologies in, e.g., additively manufactured RF components and modules for microwave and millimeter-wave ubiquitous sensing and backscattering energy-autonomous RF structures are reported. Inkjet printing for the sustainable and ultralow-cost fabrication of flexible RF devices and sensors will be reviewed to provide a prospective insight into the future packaging of backscatter communications from the chip-level design to complete system integration. Finally, this article will also address the challenges in fully wireless powered backscatter radio networks and discuss the future directions of backscatter communication in terms of “Green IoT” and “Low Carbon” smart home, smart city, smart skin, and machine-to-machine (M2M) applications.

We present Surface++, which leverages our previous work SATURN, a self-powered flexible acoustic sensor, and ZEUSSS, a passive wireless sound communication technique using analog backscatter, to create a scalable and self-sustainable wireless sound sensing surface. Our new prototype allows for large area acoustic sensing using modular fabrication techniques with the promise of being fully printable. A single small Surface++ patch can be used to extend voice and gesture input for everyday surfaces, while our more sensitive Surface++ modular array allows for large-area context sensing and localization.

In this review, the particular importance and associated opportunities of additively manufactured radiofrequency (RF) components and modules for Internet of Things (IoT) and millimeter-wave ubiquitous sensing applications is thoroughly discussed. First, the current advances and capabilities of additive manufacturing (AM) tools are presented. Then, completely printed chipless radio-frequency identification (RFID) systems, and their current capabilities and limitations are reported. The focus is then shifted toward more complex backscattering energy autonomous RF structures. For each of the essential components of these structures, that encompass energy harvesting and storage, backscattering front ends, passive components, interconnects, packaging, shape-chaging (4-D printed) topologies and sensing elements, current trends are described and representative stateof- the-art examples reported. Finally, the results of this analysis are used to argue for the unique appeal of AM RF components and systems toward empowering a technological revolution of costefficient dense and ubiquitous IoT implementations.