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Saravanan Sethuraman

dblp:279/3038 · DBLP profile ↗
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2ranked-venue papers
2as first author
1since 2021 · last 2022
0000-0001-7957-8443ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 2 first-author · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Memory systems · 81% Hardware reliability and fault tolerance · 11% Energy-efficient computing · 8%

Topics — the 8 heaviest of 8, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Memory systems
non-volatile memory
1.022022
Techniques to Improve Write and Retention Reliability of STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Temperature Aware Adaptations for Improved Read Reliability in STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020
Memory systems › non-volatile memory › magnetic random access memory
STT-MRAM
1.022022
Techniques to Improve Write and Retention Reliability of STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Temperature Aware Adaptations for Improved Read Reliability in STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020
Memory systems
memory controller
0.612022
Techniques to Improve Write and Retention Reliability of STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Memory systems › non-volatile memory
write reliability
0.612022
Techniques to Improve Write and Retention Reliability of STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Hardware reliability and fault tolerance › memory reliability
read reliability
0.412020
Temperature Aware Adaptations for Improved Read Reliability in STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020
Energy-efficient computing › power management › memory power management
memory power reduction
0.212022
Techniques to Improve Write and Retention Reliability of STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Energy-efficient computing
power management
0.212022
Techniques to Improve Write and Retention Reliability of STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2022
Memory systems
DRAM
0.112020
Temperature Aware Adaptations for Improved Read Reliability in STT-MRAM Memory Subsystem · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2020

Methods — techniques the papers use, named apart from their topics

simulation · 0.6device architecture techniques · 0.6read disturb analysis · 0.4bit error rate estimation · 0.4
YearPublicationVenuePosition
2022 Techniques to Improve Write and Retention Reliability of STT-MRAM Memory Subsystem
abstract
Spin transfer torque magneto-resistive random-access memory (STT-MRAM) has many advantages, such as scalability, persistence, practically infinite endurance, and fast access speed, that make it a promising and emerging technology for memory. However, this technology has multiple reliability issues, such as read and write reliability, higher write power, and long write latency, etc. At elevated temperatures, these issues exacerbate further. As the temperature increases massively in the latest compute nodes, we need to study and understand the effect of temperature on STT-MRAM memory writes and reliability. In this article, we propose the temperature-aware memory controller (MC) and device architecture techniques specific to STT-MRAM technology, which can improve write reliability, retention reliability, and memory power without sacrificing the performance. Our simulation results show that the proposed techniques cumulatively improve the write bit error rate (BER) on an average by$603\times $, increase retention reliability by 65%, along with 27% power reduction and 5.8% improved system performance over the baseline STT-MRAM-based memory subsystem.
Saravanan Sethuraman, T. Venkata Kalyan, M. B. Srinivas
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
2020 Temperature Aware Adaptations for Improved Read Reliability in STT-MRAM Memory Subsystem
abstract
Spin-transfer torque magneto-resistive random-access memory (STT-MRAM) is an exciting new emerging technology, being considered as a strong candidate to fill the gaps in the existing memory hierarchy between DRAM and the secondary memory. STT-MRAM has adequate endurance. However, unresolved write switching and read reliability issues still exist at the functional operating temperature corners. One biggest challenge is that the read bit error rate (RBER) is not at an acceptable level for system reliability across the wide operating temperature range. We present an STT-MRAM memory subsystem that is fully compatible with existing DDR-based DIMM designs and evaluate read disturb and read sense bit-error rate (BER) under various operating temperature conditions. We propose temperature aware adaptive techniques for reliable reads at the rank level. The proposed temperature adaptation technique improves overall reliability of the DDR4 STT-MRAM-based memory subsystem with an optimal read current considering an acceptable 64-byte cacheline BER. Our full system simulations show 1000× order of improvements toward a cell raw read disturb BER along with 5% reduction in memory power and less than 1% impact on overall system performance.
Saravanan Sethuraman, T. Venkata Kalyan, Karthick Rajamani, Chitra K. Subramanian, Kyu-Hyoun Kim, Hillery C. Hunter, M. B. Srinivas
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1