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Michael R. Seacrist

dblp:28/11358 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 2012
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 50% Integrated circuit design · 50%
Interdisciplinary, comprehensive, and emerging computing
1 paper
Energy systems and smart grids · 100%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
semiconductor manufacturing
0.112012
Silicon Crystal Growth and Wafer Technologies · Proc. IEEE 2012
Integrated circuit design › semiconductor devices
silicon-on-insulator
0.112012
Silicon Crystal Growth and Wafer Technologies · Proc. IEEE 2012
Energy systems and smart grids
photovoltaics
0.012012
Silicon Crystal Growth and Wafer Technologies · Proc. IEEE 2012
YearPublicationVenuePosition
2012 Silicon Crystal Growth and Wafer Technologies
abstract
Silicon substrates form the foundation of modern microelectronics. Whereas the first 50 years of silicon wafer technology were primarily driven by the microelectronics industry, applications in photovoltaics (PV) also promise to drive new advances in silicon wafer technology over the next ten years. In the first part, we review the historical development of semiconductor silicon wafer technology and highlight recent technical advances in bulk crystal growth and wafering technologies, including the development of silicon-on-insulator (SOI) technologies and ultrathin wafers. We then discuss technologies that could take us beyond the current capabilities of complementary metal-oxide-semiconductor (CMOS) devices. In the second part, we review silicon manufacturing for PV applications and some unique wafering technology challenges in that field. Finally, we summarize industry roadmaps and product needs highlighting key technical areas which promise to shape the future of silicon wafer technologies in the coming decades.
Graham Fisher, Michael R. Seacrist, Robert W. Standley
Proc. IEEE2