Demo Data from EDBT 2026 / reviewers in the wild / expert
Michael R. Seacrist
dblp:28/11358
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2012
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 50% Integrated circuit design · 50% | |
| Interdisciplinary, comprehensive, and emerging computing
1 paper |
Energy systems and smart grids · 100% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation
semiconductor manufacturing |
0.1 | 1 | 2012 | Silicon Crystal Growth and Wafer Technologies · Proc. IEEE 2012 |
Integrated circuit design › semiconductor devices
silicon-on-insulator |
0.1 | 1 | 2012 | Silicon Crystal Growth and Wafer Technologies · Proc. IEEE 2012 |
Energy systems and smart grids
photovoltaics |
0.0 | 1 | 2012 | Silicon Crystal Growth and Wafer Technologies · Proc. IEEE 2012 |
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2012 | Silicon Crystal Growth and Wafer TechnologiesabstractSilicon substrates form the foundation of modern microelectronics. Whereas the first 50 years of silicon wafer technology were primarily driven by the microelectronics industry, applications in photovoltaics (PV) also promise to drive new advances in silicon wafer technology over the next ten years. In the first part, we review the historical development of semiconductor silicon wafer technology and highlight recent technical advances in bulk crystal growth and wafering technologies, including the development of silicon-on-insulator (SOI) technologies and ultrathin wafers. We then discuss technologies that could take us beyond the current capabilities of complementary metal-oxide-semiconductor (CMOS) devices. In the second part, we review silicon manufacturing for PV applications and some unique wafering technology challenges in that field. Finally, we summarize industry roadmaps and product needs highlighting key technical areas which promise to shape the future of silicon wafer technologies in the coming decades. Graham Fisher, Michael R. Seacrist, Robert W. Standley |
Proc. IEEE | 2 |