Nanosheet FETs (NSFETs) are attracting attention as promising devices that can replace FinFETs beyond the 5-nm node. Despite the importance of the devices, few studies analyze the impact of NSFETs at the block-level. In this article, we introduce NS3K, the first 3-nm NSFET standard cell library, and examine the results on a block-level scale. In addition to the overall process of designing a full library, we extended the scope of the buried power rail (BPR) to better layout designs. We showed that BPR, originally proposed to overcome power delivery problems, is also an effective solution for standard cell hegith reductions. Using BPR, we highlight that 4-track height standard cell designs have a negligible impact on power delivery and signal routing. Overall chip results show that the 3-nm NSFET outperforms the 5-nm FinFET by −27.4% in power, −25.8% in total wirelength, −8.5% in the number of cells, −47.6% in area, and 34.7% performance, respectively, owing to better device performance and interconnect scaling. However, careful device/layout designs and new interconnect structures must be applied to continue the scaling trend and maximize the advantages of 3-nm technology.

In recent decades, the performance of binary computers has escalated through transistor scaling. However, due to the impotent forecasts of transistor scaling, ternary systems are regaining attention. Among many ternary device candidates, a passive device called memristor that is based on resistance switching is considered a good candidate when integrated with MOSFETs. Therefore, in this paper, we design various terna-ry logic based on memristors and MOSFETs from primitive logic to sequential logic and perform a thorough diagnosis for circuit design. We highlight design issues that should be resolved (e.g., signal distortion and high static current) and present practical solutions such as “Strength Design.” Then, we report a proper design methodology of sequential circuits considering the spike phenomena of memristor-based gates. We present 16 novel ternary logic cells and circuitry, including the design of the first balanced ternary full-adder (TFA) and memristor-based ternary pulsed-latch (MTPL). By our TFA, we emphasize that it is possible to design the most practical ternary circuits using memristors and MOSFETs. Our TFA uses 97 transistors and 87 memristors, which is the most reasonable TFA design that has the highest potential to be implemented in the near future. Besides, the proposed MTPL uses 16 transistors and 10 memristors, and it occupies only 72.7% of the silicon area, compared to the master-slave ternary flip-flop.

Nanosheet FETs (NSFETs) are expected as future devices that replace FinFETs beyond the 5nm node. Despite the importance of the devices, few studies report the impact of NSFETs in the full-chip level. Therefore, this paper presents NS3K, the first 3nm NSFET library, and presents the results in a full-chip scale. Based on our results, 3nm NSFET reduces power by -27.4%, total wirelength by -25.8%, number of cells by -8.5%, and area by -47.6% over 5nm FinFET, respectively, due to better devices and interconnect scaling. However, careful device/layout designs followed by routing-resource considering standard cells are required to maximize the advantages of 3nm technology.