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Zehua Hu

dblp:289/8308 · DBLP profile ↗
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6ranked-venue papers
2as first author
6since 2021 · last 2025
—ORCID · conflict

Domains — the database's venue-derived domains; a paper can count in several

Databases, data management, data science and information retrieval · 2 · 1 first-author · 2 since 2021Artificial intelligence and machine learning · 1 · 1 first-author · 1 since 2021Systems, architecture and hardware · 1 · 1 since 2021Computer networks · 1 · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
emerging device technologies
0.812024
Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024
Integrated circuit design › semiconductor devices › semiconductor device design
transistor design
0.812024
Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024
Integrated circuit design
heterogeneous integration
0.212024
Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024
Integrated circuit design › 3d integration
monolithic 3d integration
0.212024
Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024

Methods — techniques the papers use, named apart from their topics

machine learning for material growth · 0.8
YearPublicationVenuePosition
2025 MSTFCAN: Multiscale sparse temporal-frequency cross attention network for traffic prediction
Haopeng Ma, Ke Ruan, Zehua Hu
Comput. Networks4
2024 Two-dimensional materials for future information technology: status and prospects
abstract
Abstract Over the past 70 years, the semiconductor industry has undergone transformative changes, largely driven by the miniaturization of devices and the integration of innovative structures and materials. Two-dimensional (2D) materials like transition metal dichalcogenides (TMDs) and graphene are pivotal in overcoming the limitations of silicon-based technologies, offering innovative approaches in transistor design and functionality, enabling atomic-thin channel transistors and monolithic 3D integration. We review the important progress in the application of 2D materials in future information technology, focusing in particular on microelectronics and optoelectronics. We comprehensively summarize the key advancements across material production, characterization metrology, electronic devices, optoelectronic devices, and heterogeneous integration on silicon. A strategic roadmap and key challenges for the transition of 2D materials from basic research to industrial development are outlined. To facilitate such a transition, key technologies and tools dedicated to 2D materials must be developed to meet industrial standards, and the employment of AI in material growth, characterizations, and circuit design will be essential. It is time for academia to actively engage with industry to drive the next 10 years of 2D material research.
Hao Qiu 0001, Zhihao Yu, Tiange Zhao, Mingsheng Xu, Taotao Li, Wenzhong Bao, Yang Chai, Shula Chen, Hui-Ming Cheng, Daoxin Dai, Zengfeng Di, Zhuo Dong, Xidong Duan, Yuhan Feng, Jingshu Guo, Pengwen Guo, Yue Hao 0001, Jingyi Hu, Weida Hu, Zehua Hu, Ali Imran 0004, Ziqiang Kong, Bilu Liu, Chunsen Liu, Guanyu Liu, Kaihui Liu, Donglin Lu, Likuan Ma, Feng Miao, Zhenhua Ni, Anlian Pan, Haowen Shu, Quanyang Tao, Ziao Tian, Haomin Wang 0005, Yeliang Wang, Haidi Wu, Hongzhao Wu, Jiangbin Wu, Yanqing Wu, Longfei Xia, Baixu Xiang, Luwen Xing, Qihua Xiong, Jeffrey Xu, Yang Xu 0035, Yuekun Yang, Jincheng Zhang 0001, Tao Zhang 0090, Xinbo Zhang, Chunsong Zhao, Yuda Zhao, Ting Zheng, Peng Zhou 0021, Shaohua Kevin Zhou, Deren Yang
Sci. China Inf. Sci.26
2023 Enhanced edge convolution-based spatial-temporal network for network traffic prediction
Zehua Hu, Ke Ruan, Weihao Yu 0002, Siyuan Chen 0005
Appl. Intell.1
2022 Data-driven bending fatigue life forecasting and optimization via grinding Top-Rem tool parameters for spiral bevel gears
Han Ding 0003, Yuntai Zhang, Xiannian Kong, Yingjie Shi, Zehua Hu
Adv. Eng. Informatics5
2021 A Semi-supervised Framework with Efficient Feature Extraction and Network Alignment for User Identity Linkage
Zehua Hu, Jiahai Wang, Siyuan Chen 0005
DASFAA (2)1
2021 DUET: A Compiler-Runtime Subgraph Scheduling Approach for Tensor Programs on a Coupled CPU-GPU Architecture
abstract
Deep neural networks (DNNs) are currently the foundation for many artificial intelligence tasks. Existing DL frameworks and compilers often focus on optimizing DL inference speed against CPUs and GPUs in isolation while missing the opportunities to reap the benefits of aggregated computation power from both CPU and GPU. We show that there are DNNs that exhibit complex computation patterns, and different components might be suitable for executing on different types of devices to maximize performance gains. Based on this observation, we present a DNN inference engine, called DUET, that explores potential concurrent execution opportunities on heterogeneous CPU-GPU architecture for DNN inference. In particular, we introduce (i) a coarse-grained partitioning strategy that divides a DNN computation graph into subgraphs that retain high computational granularity with relatively low communication volume, (ii) a compiler-aware profiling method to include DL compiler optimization into the loop to improve scheduling decisions, and (iii) a greedy-correction subgraph scheduling algorithm that automatically maps the DNN computation to CPU and GPU without input from model developers. We evaluate DUET against several DNNs that exhibit complex model structures and compare its performance against existing DL frameworks and the state-of-the-art DNN compiler. The experiment results show that DUET is much faster than existing DL frameworks and obtains 1.5-2.3 times and 1.3-6.4 times speed-ups against the optimized code by the state-of-the-art DNN compiler on GPU and CPU alone, respectively.
Minjia Zhang, Zehua Hu, Mingqin Li
IPDPS2