In this paper, we talk about the short- and long-term implications of ignoring the relationship between the chip, package and PCB during I/O planning and how these issues will manifest themselves as we move toward 65 and 45nm technology.It also introduces a whole new approach to chip/package I/O planning and optimization. This new approach simultaneously synthesizes the entire interconnect from the I/O driver to the package ball and establishes an interconnect plan that is optimized for both chip and package.

This paper presents a novel application of modular robotic technology. Many researchers expect manufacturing technology will allow robot modules to be built at smaller and smaller scales, but movement and actuation are increasingly difficult as dimensions shrink. We describe an application - a 3D fax machine - which exploits inter-module communication and computation without requiring self-reconfiguration. As a result, this application may be feasible sooner than applications which depend upon modules being able to move themselves. In our new approach to 3D faxing, a large number of submillimeter robot modules form an intelligent "clay" which can be reshaped via the external application of mechanical forces. This clay can act as a novel input device, using intermodule localization techniques to acquire the shape of a 3D object by casting. We describe software for such digital clay. We also describe how, when equipped with simple inter-module latches, such clay can be used as a 3D output device. Finally, we evaluate results from simulations which test how well our approach can replicate particular objects