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Tom Tong Jing

dblp:30/5255 · DBLP profile ↗
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7ranked-venue papers
2as first author
0since 2021 · last 2010
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 7 · 2 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
4 papers
Electronic design automation · 90% Energy-efficient computing · 10%

Topics — the 6 heaviest of 7, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
physical design
0.342009
Substrate Topological Routing for High-Density Packages · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Dual-Vdd Buffer Insertion for Power Reduction · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2008
Topological routing to maximize routability for package substrate · DAC 2008
Electronic design automation › physical design › routing › package routing
substrate routing
0.222009
Substrate Topological Routing for High-Density Packages · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Topological routing to maximize routability for package substrate · DAC 2008
Electronic design automation › physical design
routing
0.132009
Substrate Topological Routing for High-Density Packages · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Topological routing to maximize routability for package substrate · DAC 2008
lambda-OAT: lambda-Geometry Obstacle-Avoiding Tree Construction With O(nlog n) Complexity · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2007
Electronic design automation › physical design
buffer insertion
0.112008
Dual-Vdd Buffer Insertion for Power Reduction · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2008
Energy-efficient computing › low-power design
power optimization
0.112008
Dual-Vdd Buffer Insertion for Power Reduction · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2008
Electronic design automation › physical design › routing › routability
routability optimization
0.012008
Topological routing to maximize routability for package substrate · DAC 2008

Methods — techniques the papers use, named apart from their topics

dynamic pushing · 0.2reordering and rerouting · 0.1planar routing · 0.1van ginneken algorithm · 0.1sampling · 0.1rip-up and reroute · 0.1pruning · 0.1zonal combination · 0.1delaunay triangulation · 0.1
YearPublicationVenuePosition
2010 Effective congestion reduction for IC package substrate routing
abstract
Off-chip substrate routing for high-density packages is challenging due to requirements such as high density, lack of vertical detour, non-Manhattan routing, and primarily planar routing. The existing substrate routing algorithms often result in a large number of unrouted nets that have to be routed manually. This article develops an effective yet efficient diffusion-driven method D-Router to reduce congestion. Starting with an initial routing, we develop an effective diffusion-based congestion reduction. We iteratively find a congested window and spread out connections to reduce congestion inside the window by a simulated diffusion process based on the duality between congestion and concentration. The window is released after the congestion is eliminated. Compared with the state-of-the-art substrate routing method that leads to 480 nets unrouted for ten industrial designs with a total of 6415 nets, the D-Router reduces the amount of unrouted nets to 104, a reduction to the 4.6 multiple. In addition, the D-Router obtains a similar reduction on unrouted nets but runs up to 94 times faster when compared with a negotiation-based substrate routing.
Shenghua Liu, Tom Tong Jing, Lei He 0001, Robi Dutta, Xianlong Hong
ACM Trans. Design Autom. Electr. Syst.3
2009 Diffusion-driven congestion reduction for substrate topological routing
abstract
O-chip substrate routing for high density packages is chal-lenging, and the existing substrate routing algorithms often result in a large number of unrouted nets that have to be routed manually. This paper develops an eective yet e-cient diusion-driven method D-Router to improve routabil-ity by a simulated diusion process based on the duality between congestion and concentration. Compared with a recently published A*-based algorithm used in a state of the art commercial tool and with similar routability and run-time as the negotiation based routing, D-Router reduces the number of unrouted nets by 4.6x with up to 94x runtime reduction.
Shenghua Liu, Tom Tong Jing, Lei He 0001, Robi Dutta, Xianlong Hong
ISPD3
2009 Substrate Topological Routing for High-Density Packages
abstract
Off-chip substrate routing for high-density packages is on the critical path for time to market. Compared with on-chip routers, existing commercial tools for off-chip routing have lower routability and often result in a large number of unrouted nets for manual routing. In this paper, we explain why planar routing is still required with multiple routing layers for substrate routing and then propose a flexible via-staggering technique to improve routability. In addition, we develop an efficient yet effective substrate routing algorithm, applying dynamic pushing to tackle the net ordering problem and reordering and rerouting to further reduce wire length and congestion. Compared with an industrial design tool that leaves 936 nets unrouted for nine industrial designs with a total of 6100 nets, our algorithm reduces the unrouted nets to 212, a 4.5-times net number reduction, which translates to design time reduction.
Shenghua Liu, Tom Tong Jing, Lei He 0001, Tianpei Zhang, Robi Dutta, Xianlong Hong
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3
2008 Topological routing to maximize routability for package substrate
abstract
Compared with on-chip routers, the existing commercial tools for off-chip routing have a much lower routability and often result in a large number of unrouted nets for manual routing. In this paper, we develop an effective, yet efficient, substrate routing algorithm, applying dynamic pushing to alleviate the net ordering problem and reordering and rerouting for further wire length and congestion reduction. Compared with an industrial design tool that leaves 936 nets unrouted for nine industrial designs with a total of 6100 nets, our algorithm reduces the unrouted nets to 212, a 4.5-times net number reduction and practically more design time reduction.
Shenghua Liu, Tom Tong Jing, Lei He 0001, Tianpei Zhang, Robi Dutta, Xianlong Hong
DAC3
2008 A full-scale solution to the rectilinear obstacle-avoiding Steiner problem
Tom Tong Jing, Yu Hu 0002, Zhe Feng 0002, Xianlong Hong, Xiao-Dong Hu 0001, Guiying Yan
Integr.1
2008 Dual-Vdd Buffer Insertion for Power Reduction
abstract
This paper presents the first in-depth study on dual-Vddbuffer insertion for power minimization under delay constraint. Compared with delay-optimal singleVddbuffer insertion, the dual-Vddbuffer insertion reduces power by 16%. Such power reduction increases when the delay specification is relaxed. Whereas the van Ginneken algorithm can be extended to handle the new problem formulation optimally, its time complexity increases from quadratic time (O(|B|n2)) to pseudopolynomial time (O(|B|n3cmax2log(ncmax)), where |B| is the size of buffer library,nis the number of buffer stations, andcmaxis proportional to the number of all possible subtrees of the net. To improve the time complexity, we propose an approximation technique by sampling subsolutions (i.e., options) and apply predictive min-delay and prebuffer slack pruning rules from a related work. Experiments show that sampling is most effective to reduce run time, whereas the two pruning rules further improve efficiency and accuracy loss due to sampling. We show that our proposed algorithm has linear time complexity with respect to the tree size. It runs over 1000 times faster at a cost of less than 2% delay and power increase over the extended van Ginneken algorithm.
King Ho Tam, Yu Hu 0002, Lei He 0001, Tom Tong Jing
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.4
2007 lambda-OAT: lambda-Geometry Obstacle-Avoiding Tree Construction With O(nlog n) Complexity
abstract
Obstacle-avoiding rectilinear Steiner minimal tree (OARSMT) construction is an essential part of routing. Recently, IC routing and related researches have been extended from Manhattan architecture (lambda2-geometry) to Y-/X-architecture (lambda3-lambda4-geometry) to improve the chip performance. This paper presents an O(n log n) heuristic, lambda-OAT, for obstacle-avoiding Steiner minimal tree construction in the lambda-geometry plane (lambda-OASMT). In this paper, based on obstacle-avoiding constrained Delaunay triangulation, a full connected tree is constructed and then embedded into lambda-OASMT by zonal combination. To the best of our knowledge, this is the first work addressing the lambda-OASMT problem. Compared with most recent works on OARSMT problem, lambda-OAT obtains up to 30-Kx speedup with quality solution. We have tested randomly generated cases with up to 10 K terminals and 10-K rectilinear obstacles within 4 seconds on a Sun V880 workstation (755-MHz CPU and 4-GB memory). The high efficiency and accuracy of lambda-OAT make it extremely practical and useful in the routing phase.
Tom Tong Jing, Zhe Feng 0002, Yu Hu 0002, Xianlong Hong, Xiao-Dong Hu 0001, Guiying Yan
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1