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Tristan Lopez

dblp:302/0709 · DBLP profile ↗
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1ranked-venue papers
0as first author
1since 2021 · last 2021
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 100%
Computer graphics and multimedia
1 paper
Visual content generation and editing · 100%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › design optimization
area optimization
0.512021
Reducing Microfluidic Very Large-Scale Integration (mVLSI) Chip Area by Seam Carving · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2021
Electronic design automation
physical design
0.512021
Reducing Microfluidic Very Large-Scale Integration (mVLSI) Chip Area by Seam Carving · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2021
Visual content generation and editing › image retargeting
seam carving
0.112021
Reducing Microfluidic Very Large-Scale Integration (mVLSI) Chip Area by Seam Carving · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2021

Methods — techniques the papers use, named apart from their topics

seam carving · 1.0
YearPublicationVenuePosition
2021 Reducing Microfluidic Very Large-Scale Integration (mVLSI) Chip Area by Seam Carving
abstract
Seam carving is an algorithm that analyzes image content and can be used for size reduction in a manner that avoids direct compression or downscaling. Seam carving iteratively identifies horizontal and/or vertical paths of least visual importance and removes them from the image; each path removal reduces the length or width of the image by one row or column of pixels. This article adapts seam carving to reduce excess area of flow-based microfluidic chips that have been drawn by hand or by computer-aided heuristics without negatively impacting their functionality. The proposed approach leverages domain knowledge, wherein the image to be carved consists of I/O ports, components, and fluid channels, with known and understood fluidic behavior. Three different variants of seam carving are presented: 1) linear; 2) nonlinear; and 3) nonrectilinear; experimental results show that nonrectilinear, which is the most general of the three, yields the best results: it improves area utilization by 8.6× and reduces fluid routing channel length by 73% across a set of benchmark microfluidic designs.
Brian Crites, Cody Falzone, Tristan Lopez, Karen Kong, Philip Brisk
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.3