Demo Data from EDBT 2026 / reviewers in the wild / expert
Yingkun Liu
dblp:307/8806
· DBLP profile ↗
3ranked-venue papers
0as first author
3since 2021 · last 2026
—ORCID · conflict
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 2 · 2 since 2021Computer networks · 1 · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Memory systems · 61% Energy-efficient computing · 30% Hardware accelerators and domain-specific architectures · 9% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Memory systems
3d-stacked memory |
1.0 | 1 | 2026 | Leveraging Tensor Dataflow for Improved Thermal Performance on 3D-Stacked SRAM Architecture · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 |
Memory systems › 3d-stacked memory
3-D-stacked SRAM |
1.0 | 1 | 2026 | Leveraging Tensor Dataflow for Improved Thermal Performance on 3D-Stacked SRAM Architecture · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 |
Energy-efficient computing
thermal management |
1.0 | 1 | 2026 | Leveraging Tensor Dataflow for Improved Thermal Performance on 3D-Stacked SRAM Architecture · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 |
Hardware accelerators and domain-specific architectures
tensor accelerator |
0.3 | 1 | 2026 | Leveraging Tensor Dataflow for Improved Thermal Performance on 3D-Stacked SRAM Architecture · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 |
Methods — techniques the papers use, named apart from their topics
thermal-aware floorplanning · 1.0tensor dataflow · 1.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | Leveraging Tensor Dataflow for Improved Thermal Performance on 3D-Stacked SRAM ArchitectureabstractWhile 3D-stacked SRAM architectures have demonstrated prominent performance speedup for tensor computing by exploiting higher bandwidth, larger buffer and reduced latency, they suffer from thermal challenges owing to vertical stacking nature of chips. In this paper, we identify that tensor dataflow may further exacerbate the thermal issues, so we propose T3D, the first thermal-aware tensor framework for 3D-stacked SRAM architectures, leveraging tensor dataflow characteristics to significantly enhance thermal performance. Specifically, we first perform a quantitative formulation to identify the most energy-efficient tensor dataflow with given 3D constraints, effectively reducing heat generation without performance loss. Then, we develop a thermal-aware 3D architectural floorplan to improve heat spreading by optimizing the spatial arrangement of multiple SRAM macros with varying power overheads, which is caused by mismatched data access rates of tensor computing. Experimental results show that, our proposed T3D can reduce the peak chip temperature by 12.9°C on certain LLM and DNN workloads over the state-of-the-art 3D solutions. Pengyu Liu 0004, Zelong Yuan, Yingkun Liu, Jianfei Jiang 0001, Qin Wang 0009, Zhigang Mao, Naifeng Jing |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 4 |
| 2025 | CrossModal-CLIP: A novel multimodal contrastive learning framework for robust network traffic anomaly detection
Yingkun Liu, Shenglin Teng, Mingrui Yin |
Comput. Networks | 2 |
| 2021 | ac2SLAM: FPGA Accelerated High-Accuracy SLAM with Heapsort and Parallel Keypoint ExtractorabstractIn order to fulfill the rich functions of the application layer, robust and accurate Simultaneous Localization and Mapping (SLAM) technique is very critical for robotics. However, due to the lack of sufficient computing power and storage capacity, it is challenging to delpoy high-accuracy SLAM in embedded devices efficiently. In this work, we propose a complete acceleration scheme, termed ac2SLAM, based on the ORB-SLAM2 algorithm including both front and back ends, and implement it on an FPGA platform. Specifically, the proposed ac2SLAM features with: 1) a scalable and parallel ORB extractor to extract sufficient keypoints and scores for throughput matching with 4% error, 2) a PingPong heapsort component (pp-heapsort) to select the significant keypoints, that could achieve single-cycle initiation interval to reduce the amount of data transfer between accelerator and the host CPU, and 3) the potential parallel acceleration strategies for the back-end optimization. Compared with running ORB-SLAM2 on the ARM processor, ac2SLAM achieves 2.1 × and 2.7 × faster in the TUM and KITTI datasets, while maintaining 10% error of SOTA eSLAM. In addition, the FPGA accelerated front-end achieves 4.55 × and 40 × faster than eSLAM and ARM. The ac2SLAM is fully open-sourced at https://github.com/SLAM-Hardware/acSLAM. Cheng Wang 0045, Yingkun Liu, Kedai Zuo, Jianming Tong, Pengju Ren |
FPT | 2 |