Computing-in-memory (CIM), as a novel computing architecture for the future, effectively overcomes the bottlenecks in the von Neumann architecture. The CIM architecture embeds logic into the memory array to reduce the data transfer between the processor and memory. However, embedding logic into the memory array increases the test complexity. In this study, we offer a comprehensive examination of the challenges associated with CIM and introduce a novel March-like test algorithm, named March CC, tailored for CIM chips. Computational elements are added to the read/write operation sequences, combining the tests in memory mode and computing mode into one step, which significantly improves the test efficiency. In comparison to the traditional March C− test algorithm, the proposed March CC test algorithm, with a complexity of only 10 N , enhances the fault coverage from 66.7% to 79.8% for six common single-cell fault (SCF) models and nine common double-cell fault (DCF) models. Furthermore, the March CC algorithm demonstrates good compatibility and is applicable to various memory configurations, such as SRAM, RRAM, and MRAM CIM architectures.

Linear interpolation is widely used in algorithms such as image segmentation, but the existing compute-in-memory (CIM) architectures cannot satisfy the needs of linear interpolation. This paper proposes a CIM macro based on static random-access memory (SRAM) that implements linear interpolation for the first time. Swing multiplication and accumulation are proposed in this paper for linear interpolation operations. In addition, the proposed circuit can be used for multiply-and-accumulate (MAC) operation and supports parallel updating and computing. A new adder tree by reused the adders inside the multiplier to implement the accumulation operation. The proposed circuit can improve the area efficiency as no additional adder tree circuit is required. The design is implemented in a 28 nm process and area efficiency can achieve 0.059 TOPS/mm2for MAC operation. When operating with an 8-bit linear interpolation, this CIM macro achieves access times of 6−9 ns and energy efficiencies of 11.13−17.72 TOPS/W. Under MAC operation with 8-bit inputs and weights, this CIM macro achieves access time of 6.36−9.47 ns and energy efficiency of 4.61−8.36 TOPS/W for 19-bit outputs.

Silicon-based semiconductor transistors are approaching their physical limits due to shrinking feature sizes. Simultaneously, traditional silicon-based von Neumann architectures exhibit significant latency and power consumption issues in data-centric applications, such as the Internet of Things and artificial intelligence. To tackle these challenges, this study introduces a novel approach: Magnetoresistance Random Access Memory (MRAM) computing in-memory (CIM) using gate-all-around carbon nanotube field-effect transistors (GAA-CNTFET). The proposed MRAM array comprised three transistors and one perpendicular magnetic anisotropy spin-orbit torque magnetic tunnel junction (p-SOT-MTJ) (3T1M) cell and achieves full-array Boolean logic operations and half/full-adder operations. The calculated results can be stored in-situ during the computing phase without requiring additional peripheral circuits. A 16 Kb MRAM was simulated in both GAA-CNTFET/p-SOT-MTJ and 14-nm FinFET/p-SOT-MTJ technologies to examine the effectiveness of the proposed design. Compared to its 14-nm FinFET/p-SOT-MTJ counterparts, the write and computing latencies of the GAA-CNTFET/p-SOT-MTJ CIM macro were reduced by approximately 21% and 20.6%, respectively, while the read and computing energy consumption by approximately 45.3% and 24.7%, respectively. Moreover, the proposed in-memory Boolean logic throughput was 8192 GOPS, which was approximately 160–250 times higher than that of existing CIM solutions, in which only two rows of word lines can be activated.

This article proposes an exceptionally reliable and low-cost quadruple node upset tolerant latch ($LC$-QNUTL) suitable for the 65 nm CMOS technology. The innovative$LC$-QNUTL latch is primarily composed of three soft-error-immune (SEI) static random-access memory (SRAM) cells and a triple-level C-element (CE) unit, which includes five two-input CE and a clock-gating (CG)-based two-input CE. The SEI SRAM cell utilizes polarity hardening technology and source-isolation technology, significantly reducing the number of sensitive nodes and enhancing the latch’s stability. By using the high-speed transmission gate (TG) technology and stacked structures, the proposed latch offers minimal overhead in terms of delay and power consumption, yielding an improved power delay area product (PDAP). When compared to contemporary quadruple node upset (QNU)-tolerant latch designs (including HLMR, 4NUHL, and LDAVPM), the new design offers substantial improvements—29.53% less delay, 80.09% reduced power consumption, 58.52% smaller silicon area, and 433.43% improved comprehensive PDAP on average. Furthermore, simulation results demonstrate that the$LC$-QNUTL latch exhibits reduced sensitivity to process, voltage, and temperature (PVT) variations, thus providing superior reliability, which makes it an ideal choice for safety-critical applications.