This paper presents the first multiobjective microarchitectural floorplanning algorithm for high-performance processors implemented in two-dimensional (2-D) and three-dimensional (3-D) ICs. The floorplanner takes a microarchitectural netlist and determines the dimension as well as the placement of the functional modules into single- or multiple-device layers while simultaneously achieving high performance and thermal reliability. The traditional design objectives such as area and wirelength are also considered. The 3-D floorplanning algorithm considers the following 3-D-specific issues: vertical overlap optimization and bonding-aware layer partitioning. The hybrid floorplanning approach combines linear programming and simulated annealing, which is shown to be very effective in obtaining high-quality solutions in a short runtime under multiobjective goals. This paper provides comprehensive experimental results on making tradeoffs among performance, thermal, area, and wirelength for both 2-D and 3-D ICs

In this paper, we present the first multi-objective microarchitectural floorplanning algorithm for designing highperformance, high-reliability processors in the early design phase. Our floorplanner takes a microarchitectural netlist and determines the placement of the functional modules while simultaneously optimizing for performance and thermal reliability. The traditional design objectives such as area and wirelength are also considered. Our multi-objective hybrid floorplanning approach combining Linear Programming and Simulated Annealing is shown to be fast and effective in obtaining high-quality solutions. We evaluate the trade-off of performance, temperature, area, and wirelength and provide comprehensive experimental results.