Demo Data from EDBT 2026 / reviewers in the wild / expert
Mu Ku Chen
dblp:320/0518
· DBLP profile ↗
2ranked-venue papers
0as first author
2since 2021 · last 2025
0000-0002-6697-0398ORCID · corroborated
Domains — the database's venue-derived domains; a paper can count in several
Artificial intelligence and machine learning · 1 · 1 since 2021Graphics, computer vision, multimedia, augmented reality and games · 1 · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Interdisciplinary, comprehensive, and emerging computing
1 paper |
Medical and health informatics · 100% | |
| Computer graphics and multimedia
1 paper |
Computational fabrication · 77% Computational photography and imaging · 23% | |
| Computer networks
1 paper |
Physical-layer communications · 100% | |
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Hardware accelerators and domain-specific architectures · 100% |
Topics — the 5 heaviest of 6, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Medical and health informatics › medical imaging
endoscopic imaging |
0.9 | 1 | 2025 | Metascope: Optics-Driven Neural Network for Ultra-Micro Metalens Endoscopy · ICCV 2025 |
Medical and health informatics
medical imaging |
0.9 | 1 | 2025 | Metascope: Optics-Driven Neural Network for Ultra-Micro Metalens Endoscopy · ICCV 2025 |
Computational fabrication
additive manufacturing |
0.8 | 1 | 2024 | 3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications · Proc. IEEE 2024 |
Physical-layer communications
antenna design |
0.8 | 1 | 2024 | 3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications · Proc. IEEE 2024 |
Computational photography and imaging › image acquisition
terahertz imaging |
0.2 | 1 | 2024 | 3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications · Proc. IEEE 2024 |
Methods — techniques the papers use, named apart from their topics
optics-driven neural network · 1.73d printing · 1.5
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2025 | Metascope: Optics-Driven Neural Network for Ultra-Micro Metalens Endoscopy
Wuyang Li, Wentao Pan 0001, Zhendong Luo, Chenxin Li, Hengyu Liu 0007, Din Ping Tsai, Mu Ku Chen, Yixuan Yuan |
ICCV | 8 |
| 2024 | 3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging ApplicationsabstractThree-dimensional (3-D) printing, also known as additive manufacturing, provides a novel and cost-effective approach for implementing microwave devices. With the rapid advancement and improved manufacturing resolution of the 3-D printing technology, additive manufacturing has enabled the design and fabrication of electronic devices in higher terahertz (THz) frequency bands, contributing to bridging the gap between microwaves and photonics. Simultaneously, metalenses have garnered significant attention due to their ability to shape electromagnetic (EM) wavefronts. Metalens technology offers a promising solution for wave focusing, surpassing traditional dielectric lenses with advantages such as reduced weight and low loss, particularly at THz frequencies. In this article, we present an overview of the development of 3-D-printed THz metalenses, ranging from single metalenses to dual-layer and trilayer configurations. The functionality of the metalenses becomes more powerful, from replacing conventional light-focusing dielectric lenses for single-layer metalenses, achieving 2-D beam scanning, holographic imaging, and reconfigurable orbital angular momentum (OAM) for dual-layer metalenses, to enabling 3-D focus scanning for trilayer metalenses. We also discuss practical measurement technologies for THz metalenses and briefly outline the prospective to propel the 3-D-printed metalens technology forward. Geng-Bo Wu, Chenfeng Yang, Ka Fai Chan, Mu Ku Chen, Din Ping Tsai, Chi Hou Chan |
Proc. IEEE | 5 |