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Mu Ku Chen

dblp:320/0518 · DBLP profile ↗
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2ranked-venue papers
0as first author
2since 2021 · last 2025
0000-0002-6697-0398ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 1 · 1 since 2021Graphics, computer vision, multimedia, augmented reality and games · 1 · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Interdisciplinary, comprehensive, and emerging computing
1 paper
Medical and health informatics · 100%
Computer graphics and multimedia
1 paper
Computational fabrication · 77% Computational photography and imaging · 23%
Computer networks
1 paper
Physical-layer communications · 100%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Hardware accelerators and domain-specific architectures · 100%

Topics — the 5 heaviest of 6, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Medical and health informatics › medical imaging
endoscopic imaging
0.912025
Metascope: Optics-Driven Neural Network for Ultra-Micro Metalens Endoscopy · ICCV 2025
Medical and health informatics
medical imaging
0.912025
Metascope: Optics-Driven Neural Network for Ultra-Micro Metalens Endoscopy · ICCV 2025
Computational fabrication
additive manufacturing
0.812024
3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications · Proc. IEEE 2024
Physical-layer communications
antenna design
0.812024
3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications · Proc. IEEE 2024
Computational photography and imaging › image acquisition
terahertz imaging
0.212024
3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications · Proc. IEEE 2024

Methods — techniques the papers use, named apart from their topics

optics-driven neural network · 1.73d printing · 1.5
YearPublicationVenuePosition
2025 Metascope: Optics-Driven Neural Network for Ultra-Micro Metalens Endoscopy
Wuyang Li, Wentao Pan 0001, Zhendong Luo, Chenxin Li, Hengyu Liu 0007, Din Ping Tsai, Mu Ku Chen, Yixuan Yuan
ICCV8
2024 3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications
abstract
Three-dimensional (3-D) printing, also known as additive manufacturing, provides a novel and cost-effective approach for implementing microwave devices. With the rapid advancement and improved manufacturing resolution of the 3-D printing technology, additive manufacturing has enabled the design and fabrication of electronic devices in higher terahertz (THz) frequency bands, contributing to bridging the gap between microwaves and photonics. Simultaneously, metalenses have garnered significant attention due to their ability to shape electromagnetic (EM) wavefronts. Metalens technology offers a promising solution for wave focusing, surpassing traditional dielectric lenses with advantages such as reduced weight and low loss, particularly at THz frequencies. In this article, we present an overview of the development of 3-D-printed THz metalenses, ranging from single metalenses to dual-layer and trilayer configurations. The functionality of the metalenses becomes more powerful, from replacing conventional light-focusing dielectric lenses for single-layer metalenses, achieving 2-D beam scanning, holographic imaging, and reconfigurable orbital angular momentum (OAM) for dual-layer metalenses, to enabling 3-D focus scanning for trilayer metalenses. We also discuss practical measurement technologies for THz metalenses and briefly outline the prospective to propel the 3-D-printed metalens technology forward.
Geng-Bo Wu, Chenfeng Yang, Ka Fai Chan, Mu Ku Chen, Din Ping Tsai, Chi Hou Chan
Proc. IEEE5