Demo Data from EDBT 2026 / reviewers in the wild / expert
Leonard W. Schaper
dblp:322/3350
· DBLP profile ↗
1ranked-venue papers
1as first author
0since 2021 · last 1992
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 56% Integrated circuit design · 44% |
Topics — the 2 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design › packaging
multichip module |
0.0 | 1 | 1992 | Design of multichip modules · Proc. IEEE 1992 |
Electronic design automation › system-level design
system partitioning |
0.0 | 1 | 1992 | Design of multichip modules · Proc. IEEE 1992 |
Methods — techniques the papers use, named apart from their topics
cost-benefit analysis · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1992 | Design of multichip modulesabstractThe process and pitfalls of multichip module (MCM) design, including the constraints, tradeoffs, figures of merit, and considerations which make MCM design a unique interdisciplinary challenge are discussed. The MCM must provide the proper operating environment for the chips it contains. It must also fit the constraints of the system in which it is contained. It must be manufacturable, testable, and repairable. The many aspects of MCM design are described, starting with system benefits, then system and MCM partitioning, chip environment, system constraints, and infrastructure/manufacturing issues.> Leonard W. Schaper |
Proc. IEEE | 1 |