Demo Data from EDBT 2026 / reviewers in the wild / expert
Philip Garrou
dblp:322/3415
· DBLP profile ↗
1ranked-venue papers
1as first author
0since 2021 · last 1992
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Integrated circuit design · 77% Electronic design automation · 23% |
Topics — the 1 heaviest of 2, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design › packaging
multichip module |
0.0 | 1 | 1992 | Polymer dielectrics for multichip module packaging · Proc. IEEE 1992 |
Methods — techniques the papers use, named apart from their topics
material property comparison · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1992 | Polymer dielectrics for multichip module packagingabstractThe polymer dielectrics used to fabricate multichip modules are discussed. Numerous relevant properties of the dielectrics are compared and contrasted. It is shown that the suitability of a specific material is highly dependent on the process chosen to fabricate the structure and the intended application of the module. The material properties of the polymer dielectric must be taken into account when designing the fabrication process in order to exploit the advantages and control the disadvantages that all imperfect materials are bound to have.> Philip Garrou |
Proc. IEEE | 1 |