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Hangning Shi

dblp:330/8487 · DBLP profile ↗
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2ranked-venue papers
1as first author
2since 2021 · last 2023
0000-0003-0739-9002ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 2 · 1 first-author · 2 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Integrated circuit design · 100%

Topics — the 2 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
heterogeneous integration
1.222023
Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology · Sci. China Inf. Sci. 2023
Efficient heterogeneous integration of InP/Si and GaSb/Si templates with ultra-smooth surfaces · Sci. China Inf. Sci. 2022
Integrated circuit design › semiconductor technology
semiconductor materials
0.212022
Efficient heterogeneous integration of InP/Si and GaSb/Si templates with ultra-smooth surfaces · Sci. China Inf. Sci. 2022

Methods — techniques the papers use, named apart from their topics

ion-cutting · 0.7heterogeneous integration · 0.6
YearPublicationVenuePosition
2023 Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology
Hangning Shi, Ailun Yi, Qingcheng Qin, Juemin Yi, Demin Cai, Fengwen Mu, Tadatomo Suga, René Heller, Shengqiang Zhou, Tiangui You, Xin Ou
Sci. China Inf. Sci.1
2022 Efficient heterogeneous integration of InP/Si and GaSb/Si templates with ultra-smooth surfaces
Tingting Jin, Jiajie Lin, Tiangui You, Hangning Shi, Chaodan Chi, Robert Kudrawiec, Xin Ou
Sci. China Inf. Sci.8