This article describes sensors and radio frequency (RF) components manufactured by applying selective-metallization processes (metal foil tape, liquid metal filling, electro and electroless plating, and surface embossing) to 3-D-printed and flexible dielectric substrates. All these technologies can be implemented at room temperature, thus enabling the adoption of unconventional materials and biopolymers with low glass transition temperatures. In this article, we also describe how the above technologies are used to manufacture wireless transponders for tracking and sensing applications. Several examples of RF components are reported, including antennas, beamforming networks, Doppler radars, and wireless passive transponders based on backscatter radio. Innovative circuit design approaches (such as the via-less approach) are presented and their impact on circuit manufacturing and recyclability is discussed.