Byung-Kwon An

dblp:339/0636 · also Byungkwon An · DBLP profile ↗
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4ranked-venue papers
3as first author
4since 2021 · last 2026
0009-0002-8204-1430ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 4 · 3 first-author · 4 since 2021
YearPublicationVenuePosition
2026 Time-Based Sensing With Linear Current-to-Time Conversion for Multi-Level Resistive Memory
abstract
Resistive Random Access Memory (RRAM) is a promising low-power memory candidate because of a large R-ratio (RHRS/RLRS). Multi-level RRAM cells have been investigated to improve memory density and cost-per-bit. However, sensing multi-level becomes challenging due to the smaller R-ratios between stored digital values. This paper introduces a novel time-based sensing (TBS) scheme for enhancing the sensing speed and robustness for single-level cells (SLC) to multi-level cells (MLC). The proposed time-based sensing scheme converts the bit line (BL) current into a time delay using a novel current-to-time converter (CTC). The BL-current-dependent time delays are utilized to generate digital data. In addition, the proposed sensing scheme executes sensing without need for reference current or reference voltage. Comprehensive simulation in 40nm CMOS technology shows that the proposed TBS scheme achieves better linearity and higher read speed by precise cell current replication in CTC compared to the prior TBS schemes. As a result, the proposed TBS reduces sensing latency by 230%~340% compared to the prior TBS schemes. Furthermore, the proposed TBS improves the variation tolerance of read operation by 5%~33% at 1.1 V.
Byung-Kwon An, Xueyong Zhang, Anh-Tuan Do, Tony Tae-Hyoung Kim
IEEE Trans. Circuits Syst. I Regul. Pap.1
2025 A 1Mb RRAM Macro with Bipolar Forming for Improved Programming Yield and Cell-by-cell Write Verification Scheme
abstract
Resistive RAM(RRAM) has emerged as a promising candidate for the next generation non-volatile memories (NVMs) due to its low write voltage, compact area, and CMOS compatibility. In this work, we propose a 1Mb RRAM macro with bipolar forming to reduce the forming voltage and improve the programming yield. Additionally, a cell-by-cell write verification scheme is introduced to protect RRAM cells from overstress and improve RRAM yield. The test chip, fabricated using 40nm CMOS technology, occupies a core area of 2.34 mm2.
Byung-Kwon An, Junjie Mu, Putu Andhita Dananjaya, Weng Hong Lai, Wen Siang Lew, Tony Tae-Hyoung Kim
ISCAS1
2024 Time-based Sensing with Linear Current-to-Time Conversion for Multi-level Resistive Memory
abstract
Resistive Random Access Memory (RRAM) is a promising low-power memory candidate because of a large R-ratio (RHRS/RLRS). Multi-level RRAM cells have been investigated to improve memory density and cost-per-bit. However, sensing multi-level becomes challenging due to the smaller R-ratios between stored digital values. This paper introduces a novel time-based sensing (TBS) scheme for enhancing the robustness and speed of the read operation, supporting from single-level cells (SLC) to multi-level cells (MLC). In the proposed time-based sensing scheme, the current-to-time converter (CTC) converts the bit line (BL) current into a time delay based on the cell states. Different time delays from HRS and LRS values are compared to generate digital data. Unlike conventional current-based sense amplifiers (CSA) or voltage-based sense amplifiers (VSA), the proposed sensing scheme does not require a reference array or generator. Comprehensive simulation in 40nm CMOS technology shows enhanced linearity and higher read speed because of the precise replication of cell current to CTC. As a result, the proposed TBS achieves a sensing latency of < 2ns with an energy consumption of 61fJ/bit for read operations at 1.1 V and also supports MLC sensing through a single read operation.
Byung-Kwon An, Xueyong Zhang, Anh-Tuan Do, Tony Tae-Hyoung Kim
ISCAS1
2023 A Robust Time-Based Multi-Level Sensing Circuit for Resistive Memory
abstract
Resistive random access memory (RRAM) is a promising emerging nonvolatile memory (NVM) due to its large resistance ratio in different switching states. To improve memory density and reduce cost-per-bit, multi-level cell (MLC) RRAM stores multiple bits in a single cell, compared to a single-level cell (SLC). However, random mismatch, process variation, and resistance shift lead to reliability issues, degrade the probability of correct read, and increase the bit error rate (BER). This paper presents a time-based sensing scheme for robust read operation and extends to multi-level sensing for SLC and MLC RRAM arrays. Bit line (BL) voltage is converted into time delay by a voltage-to-time converter (VTC) and compared with the implicit timing reference generated by a delay line. By detecting different states in the time domain, the proposed time-mode sense amplifier (TSA) requires no analog reference voltage or current, which is used in the conventional voltage-mode sense amplifiers (VSA) or current-mode sense amplifiers (CSA). Power gating is employed to enable the time sampling only at the sensing points to suppress the short-circuit current. A charge sharing-induced error compensation (CSEC) circuit is used to eliminate the charge sharing-induced voltage drop and expand the sense margin by$1.56\times $. Monte Carlo simulations in 40nm technology show that the proposed TSA improves read reliability and reduces BER by 3–4 orders of magnitude compared to conventional VSA and CSA. The proposed time-based sensing scheme operates from 0.7-1.2 V supply and consumes 49 fJ/bit for read operation under a nominal 1.2 V supply.
Xueyong Zhang, Byung-Kwon An, Tony Tae-Hyoung Kim
IEEE Trans. Circuits Syst. I Regul. Pap.2