The design of power delivery system plays a crucial role in guaranteeing the proper functionality of many-core processor systems. The power loss suffered on power delivery has become a salient part of total power consumption, and the energy efficiency of a highly dynamic system has been significantly challenged. Being able to achieve a fast response time and multiple voltage domain control, on-chip voltage regulators (VRs) have become popular choices to enable fine-grain power management, which also enlarge the design space of power delivery systems. This paper analytically studies different power delivery system paradigms and power management schemes in terms of energy efficiency, area overhead, and power pin occupation. The analysis shows that compared to the conventional paradigm with off-chip VRs, hybrid paradigms with both on-chip and off-chip VRs are able to maintain high efficiency in a larger range of workloads, though they suffer from low efficiency at light workload. Employed with the quantized power management scheme, the hybrid paradigm can improve the system energy efficiency at light workload by a maximum of 136% compared to the traditional load balanced scheme. Besides this, the in-package (iP) hybrid paradigm further shows its advantage in reducing the physical overheads. The results reveal that at 120 W workload, it occupies only a 10.94% total footprint area or 39.07% power pins of that of the off-chip paradigm. We conclude that the iP hybrid paradigm achieves the best tradeoffs between efficiency, physical overhead, and realization of fine-grain power management.

The number of chip pins is limited due to the cost and reliability issues of sophisticated packages, and it is predicted that the chip pin count will be overstretched to satisfy the requirements of both power delivery and memory access. The gap between the achievable pin count and the demand will increase as the technology scales, due to the increasing computation resources and supply current. Pin reduction techniques are thus required for continued computing performance growth. In this article, we propose a chip pin constraint alleviation strategy, through on/off-chip power delivery system co-design, to effectively reduce the demand for power pins. An analytical model of a power delivery system, consisting of on/off-chip regulators and a power delivery network, is proposed to evaluate the influence of regulator design and package conduction loss. By combining this model with a multi-core processor model of performance and memory bandwidth requirements, we characterize the entire multi-core processor system to investigate the relationship between the chip pin constraint and performance in multi-core processor scaling and the effectiveness of our strategy. Experiments show that with the conventional power delivery system design, the chip pin constraint severely limits the performance growth as the technology scales. Using the on/off-chip power delivery system co-design, our strategy achieves a significant pin count reduction, for example, 31.3% at the 8nm technology node, compared to the conventional design with the same chip performance, while, provided with the same chip pin count, it is able to improve, by 35.0%, the chip performance at 8nm compared to the conventional design. For real applications of different parallelism, our strategy outperforms its counterpart, with a 23.7% performance improvement on average at the 8nm technology node.

Recently, interchip/intrachip optical interconnection networks have been proposed for ultrahigh-bandwidth and low-latency communications. These networks employ the microresonators (MRs) to modulate, direct, or detect the optical signal. However, utilized MRs suffer from intrinsic crosstalk noise and signal power loss, degrading the network efficiency via the signal-to-noise ratio (SNR). The amount of crosstalk noise and signal power loss may differ from network to network. Hence, there exists a need to systematically analyze the effect of the crosstalk noise and the power loss issues. In this paper, we have developed the analytical models considering both coherent and incoherent crosstalk for both the interchip and intrachip optical networks. The interchip/intrachip optical interconnection networks—the$\text{I}^{2}$CON—are analyzed as a case study. The quantitative results on the individual networks have demonstrated that the architectural design determines the impact of crosstalk on the SNR. We have also demonstrated that the optical interconnection networks with interchip/intrachip interconnects result in better bit error rate (BER) compared with that of only intrachip interconnect. Our analyses of the worst case can be utilized as a platform to compare the realistic performance among different optical interconnection networks via the degradation of SNR/BER and data bandwidth.

As transistor density continues to increase with the advent of nanotechnology, reliability issues raised by more frequently appeared soft errors are becoming even more critical to the next-generation multiprocessor systems. In this paper, we present a systematic approach to address the soft-error problem in multiprocessor system-on-chip with the consideration of system performance optimization. To guarantee the system correctness, a hardware-software collaborated approach is proposed to protect the processors from soft errors. Tiny hardware sensors are embedded in the processor cores to detect the soft errors, and the software-based rollback scheduling mechanisms are applied for error recovery. The protection costs on hardware duplication and software redundancy are effectively reduced. To optimize the system performance, a distributed control system is built on top of the on-chip communication network and collaboratively manages the entire chip for application execution. With the cluster-based task migration techniques, an efficient runtime task remapping and rescheduling algorithm is proposed to further mitigate the overheads induced by soft-error protection and to minimize the total performance degradation. The distributed control strategy makes the system more adaptable and flexible to the development of the next-generation hardware and software with larger scales. Extensive performance evaluations using SystemC-based cycle-accurate simulations on a set of real-world applications show that our approach has on average 49% performance improvement and 79.6% energy consumption reduction compared with the related state-of-the-art techniques, and hardware synthesis results show that our approach only introduces 2.9% chip area overheads.

Power gating (PG) is one of the most effective techniques to reduce the leakage power in multiprocessor system-on-chips (MPSoCs). However, the power-mode transition during the PG period of an individual processing unit (PU) will introduce serious power/ground (P/G) noise to the neighboring PUs. As technology scales, the P/G noise problem becomes a severe reliability threat to MPSoCs. At the same time, the increasing manufacturing process variations (PVs) also bring uncertainties to the P/G noise problem and make it difficult to predict and mitigate. To tackle this problem, in this paper, we analyze the PG-induced P/G noise in the presence of PVs and propose a hardware–software collaborated runtime technique to adaptively protect PUs from P/G noise. Sensor network-on-chip is used to gather noise information and coordinate different system components. An online PV-aware algorithm is developed to effectively decide the noise impact range and arrange protections for affected PUs based on the collected noise information. We evaluate the proposed technique through cycle-level Monte Carlo simulations of NoC-based MPSoCs in different scales. The experimental results on various realistic applications show that our technique could achieve comparable reliability to the most reliable static technique while improve on average 3.78%–29.5% the system energy efficiency and reduce 15.7%–70.4% the performance penalty on different MPSoC scales.

With the fast development of inter/intra-chip optical interconnects, the gap between the data rates of electrical interconnects and optical interconnects is continuously increasing. Electrical–optical (E-O) interfaces and optical–electrical (O-E) interfaces are a pair of components that convert data between parallel electrical interconnects and serial optical interconnects. This paper holistically models and analyzes E-O and O-E interfaces in terms of energy consumption, area, and latency. Traditional interfaces, where data are converted between parallel and serial ports by serializers and deserializers (SerDes), are studied. A new type of E-O and O-E interface, which serializes and deserializes data by optical weaving technologies, are proposed alongside. Traditional interfaces will become a bottleneck for the further development of optical interconnects in the near future because of the high energy consumption and large area of SerDes necessitating new technologies. Our analysis shows that optical weaving interfaces have a better overall performance than traditional interfaces. For example, if there are 64 parallel electrical interconnects and four optical wavelengths, optical weaving interfaces can achieve a 81.6% improvement in energy consumption and a 40.8% improvement in area, compared with traditional interfaces.

With the fast development of processor chips, power-efficient, high-bandwidth, and low-latency interchip interconnects become more and more important. Studies show that the bandwidth of traditional parallel interconnects with low I/O clock frequencies will become bottlenecks in the near future. To solve this problem, two types of high-bandwidth interchip interconnects are developed. Low-swing differential electrical interconnects have widely been used in high-speed I/O designs. On the other hand, optical interconnects promise high bandwidth, low latency, and could improve the chip pin performance for manycore processors. They are becoming potential alternatives for electrical interconnects. This paper systematically models these two types of interconnects in terms of crosstalk noises, attenuation, and receiver sensitivities. Based on the proposed models, we developed optical and electrical interfaces and links (OEIL) and an analysis tool for OEIL. The OEIL can be used to analyze the energy consumption, bandwidth density, and latency of interconnects. Analytical models are verified by the results of published experiments. It shows that the optical interconnects have much higher bandwidth densities than the electrical interconnects. With this feature, the optical interconnects can significantly reduce I/O pin count compared with the electrical interconnects. For example, they can save at least 92% signal pins when connecting chips more than 25 cm (10 in) apart. The energy consumption of optical interconnects is comparable with that of electrical interconnects, and the latency of polymer waveguide-based optical interconnects is 18% less than that of electrical interconnect.

Chip I/O pins are an increasingly limited resource and significantly affect the performance, power and cost of multicore processors. Optical interconnects promise low power and high bandwidth, and are potential alternatives to electrical interconnects. This work systematically developed a set of analytical models for electrical and optical interconnects to study their structures, receiver sensitivities, crosstalk noises, and attenuations. We verified the models by published implementation results. The analytical models quantitatively identified the advantages of optical interconnects in terms of bandwidth, energy consumption, and transmission distance. We showed that optical interconnects can significantly reduce chip pin counts. For example, compared to electrical interconnects, optical interconnects can save at least 92% signal pins when connecting chips more than 25 cm (10 inches) apart.

Design of power delivery system has great influence on the power management in many-core processor systems. Moving voltage regulators from off-chip to on-chip gains more and more interest in the power delivery system design, because it is able to provide fine-grained dynamic voltage scaling. Previous works are proposed to implement power efficient on-chip voltage regulators. It is important to analyze the characteristics of the entire power delivery system to explore the tradeoff between the promising properties and costs of employing on-chip voltage regulators, especially the on-chip buck converters. In this paper, we present a novel analysis and design optimization platform of power delivery system called power supply on-chip (PowerSoC). It employs an analytical model to provide an accurate and fast evaluation of important characteristics, e.g., power efficiency, output stability, and dynamic voltage scaling, for the entire power delivery system consisting of on-chip/off-chip buck converters and power delivery network. Based on our model, geometric programming is utilized to find the optimal design for different power delivery systems and explore the tradeoff of using on-chip converters. Compared with SPICE simulations, our model achieves a simulation time reduction of six to seven orders of magnitude within 5% model error for the characteristic evaluation of different power delivery systems. By using PowerSoC, various architectures of power delivery systems are optimized for power efficiency under constraints of output stability, area, etc. Simulation results show that the hybrid architecture, consisting of both on-chip and off-chip converters, achieves 1.0% power efficiency improvement and 66.4% area reduction of converters, compared to the conventional design. We conclude the hybrid architecture has potential for efficient dynamic voltage scaling, small area, and the adaptability of the change of power delivery network parasitic, but careful account for the overhead of on-chip converters is needed.

Optical networks-on-chip (ONoCs) have shown the potential to be substituted for electronic networks-on-chip (NoCs) to bring substantially higher bandwidth and more efficient power consumption in both on- and off-chip communication. However, basic optical devices, which are the key components in constructing ONoCs, experience inevitable crosstalk noise and power loss; the crosstalk noise from the basic devices accumulates in large-scale ONoCs and considerably hurts the signal-to-noise ratio (SNR) as well as restricts the network scalability. For the first time, this paper presents a formal system-level analytical approach to analyze the worst-case crosstalk noise and SNR in arbitrary fat-tree-based ONoCs. The analyses are performed hierarchically at the basic optical device level, then at the optical router level, and finally at the network level. A general 4$\,\times\,$4 optical router model is considered to enable the proposed method to be adaptable to fat-tree-based ONoCs using an arbitrary 4$\,\times\,$4 optical router. Utilizing the proposed general router model, the worst-case SNR link candidates in the network are determined. Moreover, we apply the proposed analyses to a case study of fat-tree-based ONoCs using an optical turnaround router (OTAR). Quantitative simulation results indicate low values of SNR and scalability constraints in large scale fat-tree-based ONoCs, which is due to the high power of crosstalk noise and power loss. For instance, in fat-tree-based ONoCs using the OTAR, when the injection laser power equals 0 dBm, the crosstalk noise power is higher than the signal power when the number of processor cores exceeds 128; when it is equal to 256, the signal power, crosstalk noise power, and SNR are${-}{17.3}$,${-}{11.9}$, and${-}{\rm 5.5}~{\rm dB}$, respectively.

Optical networks-on-chip (ONoCs) using wavelength-division multiplexing (WDM) technology have progressively attracted more and more attention for their use in tackling the high-power consumption and low bandwidth issues in growing metallic interconnection networks in multiprocessor systems-on-chip. However, the basic optical devices employed to construct WDM-based ONoCs are imperfect and suffer from inevitable power loss and crosstalk noise. Furthermore, when employing WDM, optical signals of various wavelengths can interfere with each other through different optical switching elements within the network, creating crosstalk noise. As a result, the crosstalk noise in large-scale WDM-based ONoCs accumulates and causes severe performance degradation, restricts the network scalability, and considerably attenuates the signal-to-noise ratio (SNR). In this paper, we systematically study and compare the worst case as well as the average crosstalk noise and SNR in three well-known optical interconnect architectures, mesh-based, folded-torus-based, and fat-tree-based ONoCs using WDM. The analytical models for the worst case and the average crosstalk noise and SNR in the different architectures are presented. Furthermore, the proposed analytical models are integrated into a newly developed crosstalk noise and loss analysis platform (CLAP) to analyze the crosstalk noise and SNR in WDM-based ONoCs of any network size using an arbitrary optical router. Utilizing CLAP, we compare the worst case as well as the average crosstalk noise and SNR in different WDM-based ONoC architectures. Furthermore, we indicate how the SNR changes in respect to variations in the number of optical wavelengths in use, the free-spectral range, and the microresonators$\boldsymbol {Q}$factor. The analyses’ results demonstrate that the crosstalk noise is of critical concern to WDM-based ONoCs: in the worst case, the crosstalk noise power exceeds the signal power in all three WDM-based ONoC architectures, even when the number of processor cores is small, e.g., 64.

By integrating multiple processing units (PUs) and memories on a single chip, multiprocessor system-on-chip (MPSoC) can provide higher performance per energy and lower cost per function to applications with growing complexity. On the other hand, shrinking feature sizes and reducing power supply voltages also make MPSoCs more susceptible to various reliability threats, such as power/ground (P/G) noises. Power gating is an effective technique to minimize leakage power. However, it also introduces significant P/G noises in MPSoCs. With significant area, power and performance overheads, traditional methods rely on reinforced circuits or fixed protection strategies to reduce P/G noises caused by power gating. In this paper, we propose a systematic approach to actively alleviating P/G noises using the parasitic capacitance of on-chip memories through sensor network on-chip (SENoC). We use the parasitic capacitance of on-chip memories as dynamic decoupling capacitance to suppress P/G noises and develop a detailed HSPICE model for related study. SENoC is developed to not only monitor and report P/G noises, but also coordinate PUs and memories to alleviate such transient threats at run time. Extensive evaluations show that compared with traditional method, our approach saves 12.6%–62.8% energy consumption and achieves 14.3%–69.8% performance improvement for different applications and MPSoCs with different scales. We implement the circuit details of our approach and show its low area and energy consumption overheads.

Manycore processor system is becoming an attractive platform for applications seeking both high performance and high energy efficiency. However, huge communication demands among cores, large power density, and low process yield will be three significant limitations for the scalability of future manycore processors. Breaking a large chip into multiple smaller ones can alleviate the problems of power density and yield, but would worsen the problem of communication efficiency due to the limited off-chip bandwidth. In response, we propose an inter/intra-chip optical network, which will not only fulfill the intra-chip communication requirements but also address the inter-chip communication, by exploiting the advantages of optical links with high bandwidth and energy efficiency. The network is composed of an inter-chip subnetwork and multiple intra-chip subnetworks, and the subnetworks closely coordinate with each other to balance the traffic. The proposed network effectively explores the distinctive properties of optical signals and photonic devices, and dynamically partitions each data channel into multiple sections. Each section can be utilized independently to boost performance as well as reduce energy consumption. Simulation results show that our network can achieve higher throughput with lower power consumption than alternative designs under most of synthetic traffics and real applications.

Design of power delivery system has great influence on the power management in many-core processor systems. Moving voltage regulators from off-chip to on-chip gains more and more interest in the power delivery system design, because it is able to provide fast voltage scaling and multiple power domains. Previous works are proposed to implement power efficient on-chip regulators. It is also important to analyze the characteristics of the entire power delivery system to explore the tradeoff between the promising properties and costs of employing on-chip regulators. In this work, we develop an analytical model to evaluate important characteristics of the power delivery system, including on-chip/off-chip voltage regulators and the passive on-chip/on-board parasitic. Compared with SPICE simulations, our model achieves a fast system-level evaluation with comparable accuracy. Based on the model, geometric programming is utilized to find the optimal power efficiency of different architectures of power delivery systems under constraints of output voltage stability and area. Experiments show that compared with the conventional architecture using off-chip regulators, the hybrid one using both on-chip and off-chip voltage regulators achieves 1.0% power efficiency improvement and 68% area reduction of voltage regulators on average. We conclude that the hybrid architecture has potential for high power efficiency and small area at heavy workload, but careful account for the overhead of on-chip regulators is needed.

As transistor density continues to increase with the advent of nanotechnology, reliability issues raised by the more frequent appearance of soft errors are becoming critical for future embedded multiprocessor systems design. State-of-the-art techniques for soft error protections targeting multiprocessor systems result either high chip cost and area overhead or high performance degradation and energy consumption, and do not fulfill the increasing requirements for high performance and dependability. In this article we present a systematic approach, that is, the Sensor Networks-on-Chip (SENoC), to collaboratively and efficiently manage on-chip applications and overcome reliability threats to Multiprocessor Systems-on-Chip (MPSoC). A hardware-software collaborative approach is proposed to solve soft error problems: a hardware-based on-chip sensor network is built for soft error detection, and a software-based recovery mechanism is applied for soft error correction. A two-step scheduling scheme is presented for reliable application and chip management, combining an off-line static optimization stage for application performance maximization and an online lightweight dynamic adjustment stage to handle runtime variations and exceptions. This strategy introduces only trivial overhead on hardware design and much lower overhead on software control and execution, and hence performance degradation and energy consumption is greatly reduced. We build a cycle-accurate simulator using SystemC, and verify the effectiveness of our technique by comparing performance with related techniques on several real-world applications.

Chip multiprocessor (CMP) is becoming an attractive platform for applications seeking both high performance and high energy efficiency. In large-scale CMPs, the communication efficiency among cores is crucial for the overall system performance and energy consumption. In this article, we propose a ring-based optical network-on-chip, called SUOR, to fulfill the communication requirement of CMPs. SUOR effectively explores the distinctive properties of optical signals and photonic devices, and dynamically partitions each data channel into multiple sections. Each section can be utilized independently to boost performance as well as reduce energy consumption. We develop a set of distributed control protocols and algorithms for SUOR, but physically allocate the corresponding cluster agents close to each other to benefit from the strengths of optical interconnects at long distances as well as electrical interconnects at short distances. Simulation results show that SUOR outperforms the alternative optical networks under a wide range of traffic patterns. For example, compared with MWSR design, SUOR achieves 2.58× throughput as well as saves 64% energy consumption on average in a 256-core CMP. Compared with MWMR design, SUOR achieves 1.52× throughput and reduces 73% energy consumption on average.

Chip multiprocessor (CMP) is becoming increasingly popular in the processor industry. Efficient network-on-chip (NoC) that has similar performance to the processor cores is important in CMP design. Fat-tree-based on-chip network has many advantages over traditional mesh or torus-based networks in terms of throughput, power efficiency, and latency. It has a bright future in the development of CMP. However, the floorplan design of the fat-tree-based NoC is very challenging because of the complexity of topology. There are a large number of crossings and long interconnects, which cause severe performance degradation in the network. In electronic NoCs, the parasitic capacitance and inductance will be significant. In optical ones, large crosstalk noise and power loss will be introduced. The novel contribution of this paper is to propose a method to optimize the fat-tree floorplan, which can effectively reduce the number of crossings and minimize the interconnect length. Two types of floorplans are proposed, which could be applied to fat-tree-based networks of arbitrary size. Compared with the traditional one, our floorplans could reduce more than 87% of the crossings. Since the traversal distance for signals is related to the aspect ratio of the processor cores, we also present a method to calculate the optimum aspect ratio of the processor cores to minimize the traversal distance.

Photonic devices are widely used in optical networks-on-chip (ONoCs) and suffer from crosstalk noise. The accumulative crosstalk noise in large scale ONoCs diminishes the signal-to-noise ratio (SNR), causes severe performance degradation, and constrains the network scalability. For the first time, this paper systematically analyzes and models the worst-case crosstalk noise and SNR in folded-torus-based ONoCs. Formal analytical models for the worst-case crosstalk noise and SNR are presented. The crosstalk noise analysis is hierarchically performed at the basic photonic device level, then at the optical router level, and finally at the network level. We consider a general 5$\,\times\,$5 optical router model to enable crosstalk noise and SNR analyses in folded-torus-based ONoCs using an arbitrary 5$\,\times\,$5 optical router. Using the general optical router model, the worst-case SNR link candidates, which restrict the network scalability, are found. Also, we present a novel crosstalk noise and loss analysis platform, called CLAP, which can analyze the crosstalk noise and SNR of arbitrary ONoCs. Case studies of optimized crossbar and Crux optical routers using recent photonic device parameters are presented. Moreover, we compare the worst-case crosstalk noise and SNR in folded-torus-based and mesh-based ONoCs using optimized crossbar and Crux optical routers. The quantitative simulation results show the critical behavior of crosstalk noise in large scale ONoCs. For example, in folded-torus-based ONoCs using the Crux optical router, the noise power exceeds the signal power for network sizes larger than 12$\,\times\,$12; when the network size is 20$\,\times\,$20 and the injection signal power equals 0 dBm, the signal power and noise power are${-}{\rm 9.4}~{\rm dBm}$and${-}{\rm 6.1}~{\rm dBm}$, respectively.

Multiprocessor systems-on-chip show a trend toward integration of tens and hundreds of processor cores on a single chip. With the development of silicon photonics for short-haul optical communication, wavelength division multiplexing (WDM)-based optical networks-on-chip (ONoCs) are emerging on-chip communication architectures that can potentially offer high bandwidth and power efficiency. Thermal sensitivity of photonic devices is one of the main concerns about the on-chip optical interconnects. We systematically modeled thermal effects in optical links in WDM-based ONoCs. Based on the proposed thermal models, we developed OTemp, an optical thermal effect modeling platform for optical links in both WDM-based ONoCs and single-wavelength ONoCs. OTemp can be used to simulate the power consumption as well as optical power loss for optical links under temperature variations. We use case studies to quantitatively analyze the worst-case power consumption for one wavelength in an eight-wavelength WDM-based optical link under different configurations of low-temperature-dependence techniques. Results show that the worst-case power consumption increases dramatically with on-chip temperature variations. Thermal-based adjustment and optimal device settings can help reduce power consumption under temperature variations. Assume that off-chip vertical-cavity surface-emitting lasers are used as the laser source with WDM channel spacing of 1 nm, if we use thermal-based adjustment with guard rings for channel remapping, the worst-case total power consumption is 6.7 pJ/bit under the maximum temperature variation of 60 °C; larger channel spacing would result in a larger worst-case power consumption in this case. If we use thermal-based adjustment without channel remapping, the worst-case total power consumption is around 9.8 pJ/bit under the maximum temperature variation of 60 °C; in this case, the worst-case power consumption would benefit from a larger channel spacing.

As modern computing systems become increasingly complex, communication efficiency among and inside chips has become as important as the computation speeds of individual processing cores. Traditionally, to maximize design flexibility, interchip and intrachip communication architectures are separately designed under different constraints. Jointly designing communication architectures for both interchip and intrachip communication could, however, potentially yield better solutions. In this paper, we present a unified inter/intrachip optical network, called UNION, for chip multiprocessors (CMPs). UNION is based on recent progresses in nanophotonic technologies. It connects not only cores on a single CMP, but also multiple CMPs in a system. UNION employs a hierarchical optical network to separate interchip communication traffic from intrachip communication traffic. It fully utilizes a single optical network to transmit both payload and control packets. The network controller on each CMP not only manages intrachip communications, but also collaborates with each other to facilitate interchip communications. We compared UNION with a matched electrical counterpart in 45-nm process. Simulation results for eight real CMP applications show that on average UNION improves CMP performance by 3× while reducing 88% of network energy consumption.

By integrating multiple processing units and memories on a single chip, multiprocessor system-on-chip (MPSoC) can provide higher performance per energy and lower cost per function to applications with growing complexity. In order to maintain the power budget, power gating technique is widely used to reduce the leakage power. However, it will introduce significant power/ground (P/G) noises, and threat the reliability of MPSoCs. With significant area, power and performance overheads, traditional methods rely on reinforced circuits or fixed protection strategies to reduce P/G noises caused by power gating. In this paper, we propose a systematic approach to actively alleviating P/G noises using the parasitic capacitance of on-chip memories through sensor network on-chip (SENoC). We utilize the parasitic capacitance of on-chip memories as dynamic decoupling capacitance to suppress P/G noises and develop a detailed Hspice model for related study. SENoC is developed to not only monitor and report P/G noises but also coordinate processing units and memories to alleviate such transient threats at run time. Extensive evaluations show that compared with traditional methods, our approach saves 11.7% to 62.2% energy consumption and achieves 13.3% to 69.3% performance improvement for different applications and MPSoCs with different scales. We implement the circuit details of our approach and show its low area and energy consumption overheads.

Network-on-chip (NoC) can improve the performance, power efficiency, and scalability of multiprocessor system-on-chip (MPSoC). Optical NoCs, which are based on CMOS-compatible optical waveguides and microresonators, have significant bandwidth and power advantages over metallic interconnects. We propose a low-cost mesh-based hybrid optical-electronic NoC, HOME, with non-blocking 5×5, 4×4 and 3×3 optical switching fabrics. We systematically analyzed the key characteristics of HOME for a 64-core MPSoC in 45nm under different traffic conditions. Besides, we quantitatively analyzed the thermal effects in the 64-core HOME under temperature variations.

Optical networks-on-chip (ONoCs) are emerging communication architectures that can potentially offer ultrahigh communication bandwidth and low latency to multiprocessor systems-on-chip (MPSoCs). In addition to ONoC architectures, 3-D integrated technologies offer an opportunity to continue performance improvements with higher integration densities. In this paper, we present a 3-D mesh-based ONoC for MPSoCs, and new low-cost nonblocking 4$\,\times\,$4, 5$\,\times\,$5, 6$\,\times\,$6, and 7$\,\times\,$7 optical routers for dimension-order routing in the 3-D mesh-based ONoC. Besides, we propose an optimized floorplan for the 3-D mesh-based ONoC. The floorplan follows the regular 3-D mesh topology but implements all optical routers in a single optical layer. The floorplan is optimized to minimize the number of extra waveguide crossings caused when merging the 3-D ONoC to one optical layer. Based on a set of real applications and uniform traffic pattern, we develop a SystemC-based cycle-accurate NoC simulator and compare the 3-D mesh-based ONoC with the matched 2-D mesh-based ONoC and 2-D electronic NoC for performance and energy efficiency. Additionally, we quantitatively analyze thermal effects on the 3-D 8$\,\times\,$8$\,\times\,$2 mesh-based ONoC.

Reducing feature sizes and power supply voltage allows integrating more processing units (PUs) on multiprocessor system on chip (MPSoC) to satisfy the increasing demands of applications. However, it also makes MPSoC more susceptible to various reliability threats, such as high temperature and power/ground (P/G) noise. As the scale and complexity of MPSoC continuously increase, monitoring and mitigating reliability threats at runtime could offer better performance, scalability, and flexibility for MPSoC designs. In this paper, we propose a systematic approach, on-chip sensor network (SENoC), to collaboratively predict, detect, report, and alleviate runtime threats in MPSoC. SENoC not only detects reliability threats and shares related information among PUs, but also plans and coordinates the reactions of related PUs in MPSoC. SENoC is used to alleviate the impacts of simultaneous switching noise in MPSoC's P/G network during power gating. Based on the detailed noise behaviors under different scenarios derived by our circuit-level MPSoC P/G noise simulation and analysis platform, simulation results show that SENoC helps to achieve on average 26.2 percent performance improvement compared with the traditional stop-go method with 1.4 percent area overhead in an 8*8-core MPSoC in 45 nm. An architecture-level cycle-accurate simulator based on SystemC is implemented to study the performance of the proposed SENoC. By applying sophisticated scheduling techniques to optimize the total system performance, a higher performance improvement of 43.5 percent is achieved for a set of real-life applications.

Crosstalk noise is an intrinsic characteristic as well as a potential issue of photonic devices. In large scale optical networks-on-chips (ONoCs), crosstalk noise could cause severe performance degradation and prevent ONoC from communicating properly. The novel contribution of this paper is the systematical modeling and analysis of the crosstalk noise and the signal-to-noise ratio (SNR) of optical routers and mesh-based ONoCs using a formal method. Formal analytical models for the worst-case crosstalk noise and minimum SNR in mesh-based ONoCs are presented. The crosstalk analysis is performed at device, router, and network levels. A general 5$\,\times\,$5 optical router model is proposed for router level analysis. The minimum SNR optical link candidates, which constrain the scalability of mesh-based ONoCs, are identified. It is also shown that symmetric mesh-based ONoCs have the best SNR performance. The presented formal analyses can be easily applied to other optical routers and mesh-based ONoCs. Finally, we present case studies of mesh-based ONoCs using the optimized crossbar and Crux optical routers to evaluate the proposed formal method. We find that crosstalk noise can significantly limit the scalability of mesh-based ONoCs. For example, when the mesh-based ONoC size, using optimized crossbar, is larger than 8$\,\times\,$8, the optical signal power is smaller than the crosstalk noise power; when the network size is 16$\,\times\,$16 and the input power is 0 dBm, in the worst-case, the signal power is${-}{\rm 24.9}~{\rm dBm}$and the crosstalk noise power is${-}{\rm 11}~{\rm dBm}$.

The performance of multiprocessor systems, such as chip multiprocessors (CMPs), is determined not only by individual processor performance, but also by how efficiently the processors collaborate with one another. It is the communication architecture that determines the collaboration efficiency on the hardware side. Optical networks-on-chip (ONoCs) are emerging communication architectures that can potentially offer ultra-high communication bandwidth and low latency to multiprocessor systems. Thermal sensitivity is an intrinsic characteristic of photonic devices used by ONoCs as well as a potential issue. This paper systematically modeled and quantitatively analyzed the thermal effects in ONoCs. We used an 8$\times$8 mesh-based ONoC as a case study and evaluated the impacts of thermal effects in the average power efficiency for real MPSoC applications. We revealed three important factors regarding ONoC power efficiency under temperature variations, and proposed several techniques to reduce the temperature sensitivity of ONoCs. These techniques include the optimal initial setting of microresonator resonant wavelength, increasing the 3-dB bandwidth of optical switching elements by parallel coupling multiple microresonators, and the use of passive-routing optical router Crux to minimize the number of switching stages in mesh-based ONoCs. We gave a mathematical analysis of periodically parallel coupling of multiple microresonators and show that the 3-dB bandwidth of optical switching elements can be widened nearly linearly with the ring number. Evaluation results for different real MPSoC applications show that, on the basis of thermal tuning, the optimal device setting improves the average power efficiency by 54% to 1.2 pJ/bit when chip temperature reaches 85$^{\circ}$C. The findings in this paper can help support the further development of this emerging technology.

Crosstalk noise is an intrinsic characteristic of photonic devices used by optical networks-on-chip (ONoCs) as well as a potential issue. For the first time, this paper analyzed and modeled the crosstalk noise, signal-to-noise ratio (SNR), and bit error rate (BER) of optical routers and ONoCs. The analytical models for crosstalk noise, minimum SNR, and maximum BER in meshbased ONoCs are presented. An automated crosstalk analyzer for optical routers is developed. We find that crosstalk noise significantly limits the scalability of ONoCs. For example, due to crosstalk noise, the maximum BER is 10-3 on the 8x8 mesh-based ONoC using an optimized crossbar-based optical router. To achieve the BER of 10-9 for reliable transmissions, the maximum ONoC size is 6x6. A novel compact high-SNR optical router is proposed to improve the maximum ONoC size to 8x8.