Demonstration venue · read-only. Every page can be browsed; the buttons that would change it are switched off. Create an account to run TaxoReview on your own data. A simulation from public publication records: the people listed were not invited and did not agree to review.
? Tutorial for this page

Tianpei Zhang

dblp:34/5092 · DBLP profile ↗
← Back
12ranked-venue papers
7as first author
4since 2021 · last 2026
0009-0008-0406-1288ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 8 · 5 first-authorArtificial intelligence and machine learning · 2 · 1 first-author · 2 since 2021Graphics, computer vision, multimedia, augmented reality and games · 1 · 1 first-author · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Electronic design automation · 100%

Topics — the 4 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
physical design
0.222009
Substrate Topological Routing for High-Density Packages · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Topological routing to maximize routability for package substrate · DAC 2008
Electronic design automation › physical design › routing › package routing
substrate routing
0.222009
Substrate Topological Routing for High-Density Packages · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Topological routing to maximize routability for package substrate · DAC 2008
Electronic design automation › physical design
routing
0.122009
Substrate Topological Routing for High-Density Packages · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2009
Topological routing to maximize routability for package substrate · DAC 2008
Electronic design automation › physical design › routing › routability
routability optimization
0.012008
Topological routing to maximize routability for package substrate · DAC 2008

Methods — techniques the papers use, named apart from their topics

dynamic pushing · 0.2reordering and rerouting · 0.1planar routing · 0.1rip-up and reroute · 0.1
YearPublicationVenuePosition
2026 FSATFusion: Frequency-Spatial Attention Transformer for infrared and visible image fusion
Tianpei Zhang, Jufeng Zhao, Guangmang Cui, Yuhan Lyu
Comput. Vis. Image Underst.1
2026 DCGANet: Fusing selective variable convolution and dynamic content-guided attention for infrared small target detection
Yirui Chen, Shuyan Min, Zhaoqi Qiu, Anglong Hu, Tuntun Wang, Tianpei Zhang
Knowl. Based Syst.7
2025 Exploring State Space Model in Wavelet Domain: An Infrared and Visible Image Fusion Network via Wavelet Transform and State Space Model
abstract
Deep learning techniques have revolutionized the infrared and visible image fusion (IVIF), showing remarkable efficacy on complex scenarios. However, current methods do not fully combine frequency domain features with global semantic information, which will result in suboptimal extraction of global features across modalities and insufficient preservation of local texture details. To address these issues, we propose Wavelet-Mamba (W-Mamba), which integrates wavelet transform with the state-space model (SSM). Specifically, we introduce Wavelet-SSM module, which incorporates wavelet-based frequency domain feature extraction and global information extraction through SSM, thereby effectively capturing both global and local features. Additionally, we propose a cross-modal feature attention modulation, which facilitates efficient interaction and fusion between different modalities. The experimental results indicate that our method achieves both visually compelling results and superior performance compared to current state-of-the-art methods. Our code is available at https://github.com/Lmmh058/W-Mamba.
Tianpei Zhang, Jufeng Zhao, Guangmang Cui
ICME1
2025 When Clusters Meet Shape Priors: A Synergistic Framework for Cluster Infrared Small Target Detection
abstract
Infrared small target detection (IRSTD) is critical for low-visibility scenarios, but cluster IRSTD (CIRSTD) faces unique challenges: target ambiguity, background complexity, inter-cluster interference, and inadequate spatial modeling. Current deep learning approaches struggle with dense clusters due to limited fine-grained feature extraction, insufficient contextual constraints, and spatial resolution degradation. This paper proposes the Synergistic Shape-Contextual Fusion Network (SSCFNet) to address these issues. Firstly, the Shape Prior Self-Evolution (SPSE) module employs self-attention to model global spatial dependencies and generate structural priors for consistent detection. Accordingly, the Convolution-Shape Cross-Updating (CSCU) module integrates convolutional operations into shape representations to refine local geometric cues for low-contrast targets. Lastly, the Dynamic Synergistic Detection (DSD) module is designed to adaptively fuse individual and cluster-level features via attention mechanisms to preserve target boundaries and suppress noise. By bridging global structural and local shape refinement, SSCFNet effectively mitigates missed detections, false alarms, and localization errors in CIRSTD. Experimental results demonstrate that the proposed method outperforms state-of-the-art techniques in challenging scenarios. The code will be public at https://github.com/wangtuntun/SSCFNet.
Tuntun Wang, Jincheng Zhou, Yuxin Jing, Tianpei Zhang
IEEE Trans. Geosci. Remote. Sens.4
2009 Substrate Topological Routing for High-Density Packages
abstract
Off-chip substrate routing for high-density packages is on the critical path for time to market. Compared with on-chip routers, existing commercial tools for off-chip routing have lower routability and often result in a large number of unrouted nets for manual routing. In this paper, we explain why planar routing is still required with multiple routing layers for substrate routing and then propose a flexible via-staggering technique to improve routability. In addition, we develop an efficient yet effective substrate routing algorithm, applying dynamic pushing to tackle the net ordering problem and reordering and rerouting to further reduce wire length and congestion. Compared with an industrial design tool that leaves 936 nets unrouted for nine industrial designs with a total of 6100 nets, our algorithm reduces the unrouted nets to 212, a 4.5-times net number reduction, which translates to design time reduction.
Shenghua Liu, Tom Tong Jing, Lei He 0001, Tianpei Zhang, Robi Dutta, Xianlong Hong
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.5
2008 Topological routing to maximize routability for package substrate
abstract
Compared with on-chip routers, the existing commercial tools for off-chip routing have a much lower routability and often result in a large number of unrouted nets for manual routing. In this paper, we develop an effective, yet efficient, substrate routing algorithm, applying dynamic pushing to alleviate the net ordering problem and reordering and rerouting for further wire length and congestion reduction. Compared with an industrial design tool that leaves 936 nets unrouted for nine industrial designs with a total of 6100 nets, our algorithm reduces the unrouted nets to 212, a 4.5-times net number reduction and practically more design time reduction.
Shenghua Liu, Tom Tong Jing, Lei He 0001, Tianpei Zhang, Robi Dutta, Xianlong Hong
DAC5
2008 Buffering global interconnects in structured ASIC design
Tianpei Zhang, Sachin S. Sapatnekar
Integr.1
2007 Module assignment for pin-limited designs under the stacked-Vdd paradigm
abstract
This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficiently assigning modules at the floorplanning level so as to reuse currents between the Vdd domains, and minimize the power wasted during the operation of the circuit. Experimental results on a DLX architecture show that compared with assigning modules to different Vdd rails using a bin-packing technique, the circuit generated by our algorithm has 32% lower wasted power, on average. In addition, experiments on a 3D IC example show that our module assignment approach is equally effective in reducing the power waste in 3D ICs.
Yong Zhan, Tianpei Zhang, Sachin S. Sapatnekar
ICCAD2
2007 Simultaneous Shield and Buffer Insertion for Crosstalk Noise Reduction in Global Routing
abstract
As VLSI technologies scale down, interconnect performance is greatly affected by crosstalk noise due to the decreasing wire separation and increased wire aspect ratio, and crosstalk has become a major bottleneck for design closure. The effectiveness of traditional buffering and spacing techniques for noise reduction is constrained by the limited available resources on chip. In this paper, we present a method for incorporating crosstalk reduction criteria into global routing under a broad power supply network paradigm. This method utilizes power/ground wires as shields between signal wires to reduce capacitive coupling, while considering the constraints imposed by limited routing and buffering resources. An iterative procedure is employed to route signal wires, assign supply shields, and insert buffers so that both buffer/routing capacity and signal integrity goals are met. In each iteration, shield assignment and buffer insertion are considered simultaneously via a dynamic programming-like approach. Our noise calculations are based on Devgan's metric, and our work demonstrates, for the first time, that this metric shows good fidelity on average. An effective noise margin inflation technique is also proposed to compensate for the pessimism of Devgan's metric. Experimental results on testcases with up to about 10000 nets point towards an asymptotic runtime that increases linearly with the number of nets. Our algorithm achieves noise reduction improvements of up to 53% and 28%, respectively, compared to methods considering only buffer insertion or only shield insertion after buffer planning.
Tianpei Zhang, Sachin S. Sapatnekar
IEEE Trans. Very Large Scale Integr. Syst.1
2006 Temperature-aware routing in 3D ICs
abstract
3D integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious design methodology, since 3D ICs generate a significant amount of heat per unit volume. In this paper, we propose a temperature-aware 3D global routing algorithm with insertion of "thermal vias" and "thermal wires" to lower the effective thermal resistance of the material, thereby reducing chip temperature. Since thermal vias and thermal wires take up lateral routing space, our algorithm utilizes sensitivity analysis to judiciously allocate their usage, and iteratively resolve contention between routing and thermal vias and thermal wires. Experimental results show that our routing algorithm can effectively reduce the peak temperature and alleviate routing congestion.
Tianpei Zhang, Yong Zhan, Sachin S. Sapatnekar
ASP-DAC1
2005 Buffering global interconnects in structured ASIC design
abstract
Structured ASICs present an attractive alternative to reducing design costs and turnaround times in nanometer designs. As with conventional ASICs, such designs require global wires to be buffered. However via-programmable designs must prefabricate and preplace buffers in the layout. This paper proposes a novel and accurate statistical estimation technique for distributing prefabricated buffers through a layout. It employs Rent's rule to estimate the buffer distribution required for the layout, so that an appropriate structured ASIC may be selected for the design. Experimental results show that the estimation for a uniform buffer distribution is accurate and economic.
Tianpei Zhang, Sachin S. Sapatnekar
ASP-DAC1
2004 Simultaneous Shield and Buffer Insertion for Crosstalk Noise Reduction in Global Routing
abstract
We present a method for incorporating crosstalk reduction criteria into global routing under an innovative power supply architecture, while considering the constraints imposed by limited routing and buffering resources. An iterative procedure is employed to route the signal wires, assign supply shields, and insert buffers so that both buffer/routing capacity and signal integrity goals are met. In each iteration, shield assignment and buffer insertion are considered simultaneously via a dynamic programming-like approach. Our noise calculations are based on Devgan's noise metric, and our work shows, for the first time, that this metric shows good fidelity on average. Experimental results on testcases with up to about 10,000 nets point towards an asymptotic run time that increases linearly with the number of nets. Our algorithm achieves noise reduction improvements of up to 53% and 28%, respectively, compared to methods considering only buffer insertion, or only shield insertion after buffer planning.
Tianpei Zhang, Sachin S. Sapatnekar
ICCD1