The relentless growth of large-scale artificial intelligence (AI) has created unprecedented demand for computational power, straining the energy, bandwidth, and scaling limits of conventional electronic platforms. Electronic-photonic integrated circuits (EPICs) have emerged as a compelling platform for nextgeneration AI systems, offering inherent advantages in ultra-high bandwidth, low latency, and energy efficiency for computing and interconnection. Beyond performance, EPICs also hold unique promises for sustainability. Fabricated in relaxed process nodes with fewer metal layers and lower defect densities, photonic devices naturally reduce embodied carbon footprint (CFP) compared to advanced digital electronic integrated circuits, while delivering orders-of-magnitude higher computing performance and interconnect bandwidth. To further advance the sustainability of photonic AI systems, we explore how electronic-photonic design automation (EPDA) and cross-layer co-design methodologies can amplify these inherent benefits. We present how advanced EPDA tools enable more compact layout generation, reducing both chip area and metal layer usage. We will also demonstrate how cross-layer device-circuit-architecture co-design unlocks new sustainability gains for photonic hardware: ultracompact photonic circuit designs that minimize chip area cost, reconfigurable hardware topology that adapts to evolving AI workloads, and intelligent resilience mechanisms that prolong lifetime by tolerating variations and faults. By uniting intrinsic photonic efficiency with EPDA- and co-design-driven gains in area efficiency, reconfigurability, and robustness, we outline a vision for lifelong-sustainable electronic-photonic AI systems. This perspective highlights how EPIC AI systems can simultaneously meet the performance demands of modern AI and the urgent imperative for sustainable computing.

Growing global concerns about climate change highlight the need for environmentally sustainable computing. The ecological impact of computing, including operational and embodied, is crucial. Field Programmable Gate Arrays (FPGAs) stand out as promising sustainable computing platforms due to their reconfigurability across various applications. This paper introduces GreenFPGA, a tool estimating the total carbon footprint (CFP) of FPGAs over their lifespan, considering design, manufacturing, reconfigurability, operation, disposal, and recycling. Using GreenFPGA, the paper evaluates scenarios where the ecological benefits of FPGA reconfigurability outweigh operational and embodied carbon costs, positioning FPGAs as an environmentally sustainable choice for hardware acceleration compared to Application-specific integrated circuits (ASICs). Experimental results show that FPGAs have lower CFP than ASICs for multiple low-volume applications or short application lifespans.

Decades of progress in energy-efficient and low-power design have successfully reduced the operational carbon footprint in the semiconductor industry. However, this has led to increased embodied emissions, arising from design, manufacturing, and packaging. While existing research has developed tools to analyze embodied carbon for traditional monolithic systems, these tools do not apply to near-mainstream heterogeneous integration (HI) technologies. HI systems offer significant potential for sustainable computing by minimizing carbon emissions through two key strategies: “reducing” computation by “reusing” pre-designed chiplet IP blocks and adopting hierarchical approaches to system design. The reuse of chiplets across multiple designs, even spanning multiple generations of ICs, can substantially reduce carbon emissions throughout the lifespan. This paper introduces ECO-CHIP, a carbon analysis tool designed to assess the potential of HI systems toward sustainable computing by considering scaling, chip let, and packaging yields, design complexity, and even overheads associated with advanced packaging techniques. Experimental results from ECO-CHIP demonstrate that HI can reduce embodied carbon emissions by up to 30% compared to traditional monolithic systems. ECO-CHIP is integrated with other chiplet simulators and is applied to chiplet disaggregation considering other metrics such as power, area, and cost. ECO-CHIP suggests that HI can pave the way for sustainable computing practices.