EDBT 2026 Demo / reviewers in the wild / expert
Michael D. Deal
dblp:35/1330
· DBLP profile ↗
1ranked-venue papers
1as first author
0since 2021 · last 1989
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 87% Integrated circuit design · 13% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › technology computer-aided design › process simulation
ion implantation modeling |
0.0 | 1 | 1989 | SUPREM 3.5-process modeling of GaAs integrated circuit technology · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989 |
Electronic design automation › technology computer-aided design
process modeling and simulation |
0.0 | 1 | 1989 | SUPREM 3.5-process modeling of GaAs integrated circuit technology · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989 |
Integrated circuit design
gaas integrated circuits |
0.0 | 1 | 1989 | SUPREM 3.5-process modeling of GaAs integrated circuit technology · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1989 |
Methods — techniques the papers use, named apart from their topics
empirical parameter fitting · 0.0Pearson IV distribution · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1989 | SUPREM 3.5-process modeling of GaAs integrated circuit technologyabstractA computer program SUPREM 3.5, has been developed to simulate processes used to manufacture ion-implanted GaAs integrated circuits. The processes modelled in the present version of the simulator include ion implantation, diffusion, and activation. The simulator includes a routine to calculate the threshold voltage of a MESFET device based on the simulated processing results and on substrate properties. The models used for each dopant and process are based on physical mechanisms when possible, but empirical parameter fitting is sometimes used. Pearson IV distributions are used for the implantation modeling, concentration-independent diffusivities are used for n-type dopants, concentration-dependent diffusivities are used for p-type dopants, and concentration-dependent activation efficiencies are used for all dopants. The simulator models each process individually, as well as integrating the various processes and models together.> Michael D. Deal, S. E. Hansen, Thomas W. Sigmon |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 1 |