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David Coenen

dblp:350/0463 · DBLP profile ↗
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2ranked-venue papers
2as first author
2since 2021 · last 2026
0000-0002-3732-1874ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 2 first-author · 2 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Performance modeling and evaluation · 36% Energy-efficient computing · 32% Emerging computing paradigms · 22%

Topics — the 6 heaviest of 6, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Performance modeling and evaluation › simulation
thermal simulation
1.722026
PINDAS: Physics-Informed Decoupled Spatiotemporal Artificial Neural Network for Dynamic Thermal Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Energy-efficient computing › thermal management
dynamic thermal analysis
1.012026
PINDAS: Physics-Informed Decoupled Spatiotemporal Artificial Neural Network for Dynamic Thermal Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Emerging computing paradigms › neural computing
physics-informed neural network
1.012026
PINDAS: Physics-Informed Decoupled Spatiotemporal Artificial Neural Network for Dynamic Thermal Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Energy-efficient computing
thermal management
0.522026
PINDAS: Physics-Informed Decoupled Spatiotemporal Artificial Neural Network for Dynamic Thermal Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Electronic design automation › thermal analysis
chip-level thermal analysis
0.312026
PINDAS: Physics-Informed Decoupled Spatiotemporal Artificial Neural Network for Dynamic Thermal Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Electronic design automation › thermal analysis
integrated circuit thermal simulation
0.212023
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023

Methods — techniques the papers use, named apart from their topics

proper orthogonal decomposition · 1.7artificial neural network · 1.7green's function · 1.0convolutional operator · 1.0radial basis functions · 0.7POD-RBF-ANN · 0.7
YearPublicationVenuePosition
2026 PINDAS: Physics-Informed Decoupled Spatiotemporal Artificial Neural Network for Dynamic Thermal Simulation
abstract
Multiscale thermal analysis in integrated circuits is required for capturing both device-level and package-level dynamics. Traditional analysis with the finite element (FE) method performs poor at multiscale tasks because of conflicting element size requirements and CPU time limitation. Machine learning (ML) algorithms can be trained with FE simulation data to perform fast and efficient temperature prediction. In this work, spatial and temporal aspects of the temperature field are treated independently and used to train two artificial neural networks (ANNs). Prior to ANN training, fundamental spatial modes (proper orthogonal decomposition, POD) are calculated to simplify the ANN structure. In the time domain a similar approach is used: the fundamental temporal modes, i.e. thermal step responses are calculated and used to train the ANN. By training the ANN on step response data, the final dynamic temperature profile can be reconstructed using the convolutional operator. Using this method, a physics-informed ML workflow is established as the step response is converted to the impulse response or Green’s function, which are a known part of the analytical solution to the heat equation. The final result is an extremely fast and accurate dynamic thermal model of a chip.
David Coenen, Herman Oprins
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
2023 Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits
abstract
Multiscale thermal analysis in integrated systems is required for capturing both device-level and circuit-level dynamics. Traditional analysis with finite element (FE) models can be accelerated by using machine learning (ML) methods. In this article, a performance benchmarking between three ML methods for thermal simulation is carried out: 1) artificial neural networks (ANNs); 2) proper orthogonal decomposition with radial basis functions (POD-RBFs); and 3) finally, POD-RBF-ANN is used as a hybrid ML method. The (dis)advantages of the different methods are demonstrated for the thermal simulation of a multiscale photonic chip. The ML models are trained with FE data for both linear and nonlinear dynamics and are tested for inter- and extra-polation prediction accuracy. A computational speed increase with a factor >7500 compared to FE is obtained. Furthermore, ANNs prove to be the best suited for the simulation of nonlinear dynamics. POD-RBF is the best method for minimizing training time and combining the best of both methods in POD-RBF-ANN creates an ML model with a short training phase and highly accurate predictions.
David Coenen, Herman Oprins, Robin Degraeve, Ingrid De Wolf
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1