Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach their limits. 2.5D/3D heterogeneous integration of smaller chiplets using advanced packaging has emerged as a promising paradigm for addressing this limit and meeting performance demands. These approaches offer a significant cost reduction and higher manufacturing yield than monolithic 2D integrated circuits. However, the compact arrangement and high compute density of these systems exacerbate thermal management challenges, potentially compromising performance. Addressing these thermal modeling challenges is critical, especially as system sizes grow and different design stages require varying levels of accuracy and speed. Since no single thermal modeling technique meets all these needs, this article introduces MFIT, a range of multi-fidelity thermal models that effectively balance accuracy and speed. These multi-fidelity models can enable efficient design space exploration and runtime thermal management. Our extensive testing on systems with 16, 36, and 64 2.5D integrated chiplets and 16×3 3D integrated chiplets demonstrates that these models can reduce execution times from days to mere seconds and milliseconds with negligible loss in accuracy.

Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and scalability, making them well-suited to AI workloads. Processing-in-Memory (PIM) has emerged as a promising solution for AI inference, leveraging technologies such as ReRAM, SRAM, and FeFET, each offering unique advantages and tradeoffs. A heterogeneous chiplet-based PIM architecture can harness the complementary strengths of these technologies to enable higher performance and energy efficiency. However, scheduling AI workloads across such a heterogeneous system is challenging due to competing performance objectives, dynamic workload characteristics, and power and thermal constraints. To address this need, we propose THERMOS, a thermally-aware, multi-objective scheduling framework for AI workloads on heterogeneous multi-chiplet PIM architectures. THERMOS trains a single multi-objective reinforcement learning (MORL) policy that is capable of achieving Pareto-optimal execution time, energy, or a balanced objective at runtime, depending on the target preferences. Comprehensive evaluations show that THERMOS achieves up to 89% faster average execution time and 57% lower average energy consumption than baseline AI workload scheduling algorithms with only 0.14% runtime and 0.022% energy overhead.

Heterogeneous integration using 2.5D chiplet platforms provides a new avenue for compact scale-out implementations of emerging applications, such as deep learning (DL). Integrating multiple small chiplets using a Network-on-Interposer (NoI) offers not only significant cost reductions and higher manufacturing yield compared to 2D ICs but also better thermal efficiency than 3D ICs and easier heterogeneous integration. However, dense integration and substantial compute density exacerbate thermal design problems, threatening to undermine the potential performance and cost benefits. Due to the significant role of temperature in the operation and reliability of integrated systems, it is critical to understand the role of heat in this emerging design area. However, little work has considered the thermal consequences of closely packaging a large number of computational elements. This paper overviews the thermal modeling challenges for chiplet-based 2.5D platforms, overviews existing approaches, and discusses the opportunities enabled by fast and accurate thermal models.

Graph neural networks (GNNs) are used for predictive analytics on graph-structured data, and they have become very popular in diverse real-world applications. Resistive random-access memory (ReRAM)-based PIM architectures can accelerate GNN training. However, GNN training on ReRAM-based architectures is both compute- and data intensive in nature. In this work, we propose a framework calledSlimGNNthat synergistically combines both graph and model pruning to accelerate GNN training on ReRAM-based architectures. The proposed framework reduces the amount of redundant information in both the GNN model and input graph(s) to streamline the overall training process. This enables fast and energy-efficient GNN training on ReRAM-based architectures. Experimental results demonstrate that using this framework, we can accelerate GNN training by up to$ {4}. {5} {\times }$while using$ {6}. {6} {\times }$less energy compared to the unpruned counterparts.

Recent advances in 2.5D chiplet platforms provide a new avenue for compact scale-out implementations of emerging compute- and data-intensive applications including machine learning. Network-on-Interposer (NoI) enables integration of multiple chiplets on a 2.5D system. While these manycore platforms can deliver high computational throughput and energy efficiency by running multiple specialized tasks concurrently, conventional NoI architectures have a limited computational throughput due to their inherent multi-hop topologies. In this paper, we propose Floret, a novel NoI architecture based on space-filling curves (SFCs). The Floret architecture leverages suitable task mapping, exploits the data flow pattern, and optimizes the inter-chiplet data exchange to extract high performance for multiple types of convolutional neural network (CNN) inference tasks running concurrently. We demonstrate that the Floret architecture reduces the latency and energy up to 58% and 64%, respectively, compared to state-of-the-art NoI architectures while executing datacenter-scale workloads involving multiple CNN tasks simultaneously. Floret achieves high performance and significant energy savings with much lower fabrication cost by exploiting the data-flow awareness of the CNN inference tasks.