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Wei-Hsu Chen

dblp:357/2608 · DBLP profile ↗
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2ranked-venue papers
1as first author
2since 2021 · last 2023
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 1 first-author · 2 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 100%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › physical design › lithography
directed self-assembly lithography
0.712023
Graph-Based Simultaneous Placement and Routing for Two-Dimensional Directed Self-Assembly Technology · DAC 2023
Electronic design automation
physical design
0.712023
Graph-Based Simultaneous Placement and Routing for Two-Dimensional Directed Self-Assembly Technology · DAC 2023
Electronic design automation › physical design
placement and routing
0.712023
Graph-Based Simultaneous Placement and Routing for Two-Dimensional Directed Self-Assembly Technology · DAC 2023
Electronic design automation › physical design
routing
0.712023
Graph-Based Simultaneous Placement and Routing for Two-Dimensional Directed Self-Assembly Technology · DAC 2023
Electronic design automation › physical design
lithography
0.212023
Graph-Based Simultaneous Placement and Routing for Two-Dimensional Directed Self-Assembly Technology · DAC 2023

Methods — techniques the papers use, named apart from their topics

graph modeling · 0.7broadcast-based cost function · 0.7
YearPublicationVenuePosition
2023 Graph-Based Simultaneous Placement and Routing for Two-Dimensional Directed Self-Assembly Technology
abstract
Two-dimensional directed self-assembly (2D-DSA) is an emerging lithography technology for advanced process nodes. We can determine the orientations of double posts to guide block copolymers to form feasible 2D guiding template patterns by the 2D-DSA process. This paper presents the first work to handle the 2D-DSA simultaneous placement and routing problem. We first propose a novel graph to model feasible guiding templates with a constant-time update scheme for each double-post assignment. Based on a graph model, we then present an algorithm for 2D-DSA simultaneous placement and routing, with a broadcast-based cost function for 2D-DSA cell placement and a graph-based scheme for DSA-compliant routing. Finally, we employ a strongly effective region property to minimize the cuts in the final layout. Experimental results show that our algorithm can efficiently generate a 2D-DSA placement and routing solution with high routability and a low cut number.
Wei-Hsu Chen, Yao-Wen Chang
DAC1
2023 Invited Paper: 2023 ICCAD CAD Contest Problem B: 3D Placement with Macros
abstract
2023 ICCAD CAD Contest Problem B is an extended problem from 2022 ICCAD CAD Contest Problem B [1]–[2] for addressing more complex real world 3D implementation constraints. In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small, chiplet, dies. By having the multiple small, chiplet, dies with die-to-die (D2D) vertical connections, the benefits including: 1) better yield, 2) better timing/performance, 3) better cost, and 4) faster time-to-market. How to do the netlist partitioning, cell placement for both the standard cells and the macros in each of the chiplet dies, and nevertheless how to determine the location of the D2D inter-connection terminals becomes a new topic. To address this chiplet era physical implementation problem, ICCAD-2023 contest encourages the research in the techniques of multi-die netlist partitioning and placement of both standard cells and macros with D2D vertical connections. We provided (i) a set of benchmarks and (ii) an evaluation metric of multiple objectives that facilitate contestants to develop, test, and evaluate their new algorithms.
Kai-Shun Hu, Hao-Yu Chi, I-Jye Lin, Yi-Hsuan Wu, Wei-Hsu Chen
ICCAD5