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Silu Xiong

dblp:357/4995 · DBLP profile ↗
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2ranked-venue papers
0as first author
2since 2021 · last 2024
0000-0002-4112-9818ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 2 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Electronic design automation · 83% Interconnection networks and networks-on-chip · 13% Hardware accelerators and domain-specific architectures · 4%

Topics — the 7 heaviest of 7, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
physical design
1.422024
Obstacle-Aware Length-Matching Routing for Any-Direction Traces in Printed Circuit Board · DAC 2024
TRouter: Thermal-Driven PCB Routing via Nonlocal Crisscross Attention Networks · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Electronic design automation › physical design › routing › timing-driven routing
length-matching routing
0.812024
Obstacle-Aware Length-Matching Routing for Any-Direction Traces in Printed Circuit Board · DAC 2024
Electronic design automation › physical design
routing
0.812024
Obstacle-Aware Length-Matching Routing for Any-Direction Traces in Printed Circuit Board · DAC 2024
Electronic design automation › physical design › routing
printed circuit board routing
0.712023
TRouter: Thermal-Driven PCB Routing via Nonlocal Crisscross Attention Networks · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Electronic design automation
thermal analysis
0.712023
TRouter: Thermal-Driven PCB Routing via Nonlocal Crisscross Attention Networks · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Interconnection networks and networks-on-chip › routing algorithms
thermal-aware routing
0.712023
TRouter: Thermal-Driven PCB Routing via Nonlocal Crisscross Attention Networks · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Hardware accelerators and domain-specific architectures
machine learning accelerator
0.212023
TRouter: Thermal-Driven PCB Routing via Nonlocal Crisscross Attention Networks · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023

Methods — techniques the papers use, named apart from their topics

obstacle-aware detailed routing · 0.8multi-scale dynamic time warping · 0.8task graph parallelism · 0.7nonlocal crisscross attention · 0.7gradient-guided routing · 0.7conflict graph · 0.7
YearPublicationVenuePosition
2024 Obstacle-Aware Length-Matching Routing for Any-Direction Traces in Printed Circuit Board
abstract
Emerging applications in Printed Circuit Board (PCB) routing impose new challenges on automatic length matching, including adaptability for any-direction traces with their original routing preserved for interactiveness. The challenges can be addressed through two orthogonal stages: assign non-overlapping routing regions to each trace and meander the traces within their regions to reach the target length. In this paper, mainly focusing on the meandering stage, we propose an obstacle-aware detailed routing approach to optimize the utilization of available space and achieve length matching while maintaining the original routing of traces. Furthermore, our approach incorporating the proposed Multi-Scale Dynamic Time Warping (MSDTW) method can also handle differential pairs against common decoupled problems. Experimental results demonstrate that our approach has effective length-matching routing ability and compares favorably to previous approaches under more complicated constraints.
Weijie Fang, Longkun Guo, Silu Xiong, Jianli Chen
DAC4
2023 TRouter: Thermal-Driven PCB Routing via Nonlocal Crisscross Attention Networks
abstract
In this article, we propose TRouter, a thermal-driven printed circuit board (PCB) routing framework via a machine-learning model. The model is designed to capture the long-range spatial information from the PCB layout and predict thermal distribution. The information contains pads, vias, components and wire segments. A gradient in each grid cell obtained from the backpropagation is integrated into a full-board routing algorithm to guide thermal-aware wire detour and via punching. To achieve a significant speedup, we construct a conflict graph according to whether overlapping among convex hulls of nets. A greedy-based method is adopted to remove nonroot nodes from all nodes. Then, a task graph is constructed to improve the parallelism. We conduct experiments on open-source benchmarks to illustrate our TRouter can achieve significant speedup and lower-temperature designs, compared with a state-of-the-art PCB routing algorithm.
Tinghuan Chen, Silu Xiong, Bei Yu 0001
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2