Demo Data from EDBT 2026 / reviewers in the wild / expert
Xingmao Yu
dblp:359/0730
· DBLP profile ↗
1ranked-venue papers
1as first author
1since 2021 · last 2025
0009-0009-0275-5670ORCID · reported
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1 · 1 first-author · 1 since 2021Software engineering, systems software and programming languages · 1 · 1 first-author · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Cloud and datacenter computing · 30% Parallel and multicore computing · 30% Hardware accelerators and domain-specific architectures · 30% |
Topics — the 3 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Cloud and datacenter computing
datacenter architecture |
0.9 | 1 | 2025 | Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale Chip · ISCA 2025 |
Parallel and multicore computing › multiprocessor system
wafer-scale computing |
0.9 | 1 | 2025 | Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale Chip · ISCA 2025 |
Memory systems
on-chip memory |
0.3 | 1 | 2025 | Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale Chip · ISCA 2025 |
Methods — techniques the papers use, named apart from their topics
vertical stacking · 0.9reliability prediction · 0.9co-exploration · 0.9
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2025 | Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale ChipabstractThe rapid advancements in large language models (LLMs) have significantly increased hardware demands.Wafer-scale chips, which integrate numerous compute units on an entire wafer, offer a highdensity computing solution for data centers and can extend Moore's Law at system level.However, current wafer-scale data center architectures face inefficiencies, such as uncoordinated resource allocation and lack of co-optimization for system area, preventing optimal integration density and performance within given cost and physical constraints.We propose a co-exploration approach of computing and hardware architectures to bridge this gap.We first develop an optimized wafer-scale single-cabinet data center model, integrating configurable on-chip memory dies and employing a vertically stacked hardware architecture.Based on this model, we introduce Titan, an automated exploration framework for intra-chip and inter-chip architecture design and optimization.Based on the architecture features of wafer-scale systems with optimal integration density, Titan establishes parameter dependencies to co-design the computing and hardware architectures.To reduce the design cycle for wafer-scale systems, Titan introduces vertical area constraints and pre-checks physical limits by integrating a series of reliability prediction models.It also integrates hardware Xingmao Yu, Dingcheng Jiang, Jinyi Deng, Chao Li 0009, Shouyi Yin, Yang Hu 0001 |
ISCA | 1 |