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Xingmao Yu

dblp:359/0730 · DBLP profile ↗
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1ranked-venue papers
1as first author
1since 2021 · last 2025
0009-0009-0275-5670ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 first-author · 1 since 2021Software engineering, systems software and programming languages · 1 · 1 first-author · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Cloud and datacenter computing · 30% Parallel and multicore computing · 30% Hardware accelerators and domain-specific architectures · 30%

Topics — the 3 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Cloud and datacenter computing
datacenter architecture
0.912025
Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale Chip · ISCA 2025
Parallel and multicore computing › multiprocessor system
wafer-scale computing
0.912025
Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale Chip · ISCA 2025
Memory systems
on-chip memory
0.312025
Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale Chip · ISCA 2025

Methods — techniques the papers use, named apart from their topics

vertical stacking · 0.9reliability prediction · 0.9co-exploration · 0.9
YearPublicationVenuePosition
2025 Cramming a Data Center into One Cabinet, a Co-Exploration of Computing and Hardware Architecture of Waferscale Chip
abstract
The rapid advancements in large language models (LLMs) have significantly increased hardware demands.Wafer-scale chips, which integrate numerous compute units on an entire wafer, offer a highdensity computing solution for data centers and can extend Moore's Law at system level.However, current wafer-scale data center architectures face inefficiencies, such as uncoordinated resource allocation and lack of co-optimization for system area, preventing optimal integration density and performance within given cost and physical constraints.We propose a co-exploration approach of computing and hardware architectures to bridge this gap.We first develop an optimized wafer-scale single-cabinet data center model, integrating configurable on-chip memory dies and employing a vertically stacked hardware architecture.Based on this model, we introduce Titan, an automated exploration framework for intra-chip and inter-chip architecture design and optimization.Based on the architecture features of wafer-scale systems with optimal integration density, Titan establishes parameter dependencies to co-design the computing and hardware architectures.To reduce the design cycle for wafer-scale systems, Titan introduces vertical area constraints and pre-checks physical limits by integrating a series of reliability prediction models.It also integrates hardware
Xingmao Yu, Dingcheng Jiang, Jinyi Deng, Chao Li 0009, Shouyi Yin, Yang Hu 0001
ISCA1