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Baokang Peng

dblp:362/4113 · DBLP profile ↗
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3ranked-venue papers
1as first author
3since 2021 · last 2026
0000-0002-9778-4184ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 3 · 1 first-author · 3 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Integrated circuit design · 85% Performance modeling and evaluation · 15%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design › semiconductor device modeling
compact modeling
1.722026
PHIMO-NN: Compact Modeling by Fusing Device Physics and Neural Networks for One-Shot Parameterization · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Statistical Compact Modeling With Artificial Neural Networks · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023
Integrated circuit design › analog and mixed-signal circuits
device modeling
1.012026
PHIMO-NN: Compact Modeling by Fusing Device Physics and Neural Networks for One-Shot Parameterization · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Integrated circuit design › semiconductor device modeling
transistor modeling
1.012026
PHIMO-NN: Compact Modeling by Fusing Device Physics and Neural Networks for One-Shot Parameterization · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026
Performance modeling and evaluation › statistical analysis
statistical modeling
0.712023
Statistical Compact Modeling With Artificial Neural Networks · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2023

Methods — techniques the papers use, named apart from their topics

neural network · 1.0device physics fusion · 1.0variational neuron selection · 0.7backward propagation of variance · 0.7artificial neural network · 0.7
YearPublicationVenuePosition
2026 PHIMO-NN: Compact Modeling by Fusing Device Physics and Neural Networks for One-Shot Parameterization
Baokang Peng, Fangxing Zhang, Wu Dai, Guoyao Cheng, Runsheng Wang, Mansun Chan, Lining Zhang
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1
2025 Orthrus: Dual-Loop Automated Framework for System-Technology Co-Optimization
abstract
With the diminishing return from Moore’s Law, system-technology co-optimization (STCO) has emerged as a promising approach to sustain the scaling trends in the VLSI industry. By bridging the gap between system requirements and technology innovations, STCO enables customized optimizations for application-driven system architectures. However, existing research lacks sufficient discussion on efficient STCO methodologies, particularly in addressing the information gap across design hierarchies and navigating the expansive cross-layer design space. To address these challenges, this paper presents Orthrus, a dual-loop automated framework that synergizes system-level and technology-level optimizations. At the system level, Orthrus employs a novel mechanism to prioritize the optimization of critical standard cells using system-level statistics. It also guides technology-level optimization via the normal directions of the Pareto frontier efficiently explored by Bayesian optimization. At the technology level, Orthrus leverages system-aware insights to optimize standard cell libraries. It employs a neural network-assisted enhanced differential evolution algorithm to efficiently optimize technology parameters. Experimental results on 7nm technology demonstrate that Orthrus achieves 12.5% delay reduction at iso-power and 61.4% power savings at iso-delay over the baseline approaches, establishing new Pareto frontiers in STCO.
Baokang Peng, Chenhao Xue, Kairong Guo, Guoyao Cheng, Yibo Lin, Lining Zhang, Guangyu Sun 0003
ICCAD2
2023 Statistical Compact Modeling With Artificial Neural Networks
abstract
This work proposes a statistical modeling approach for the artificial neural network (ANN)-based compact model (CM). The method of retaining part of the network features of the nominal device and further finetuning the network parameters (variational neurons) is found to accurately reproduce the static variation. A mapping from process variation to network parameters is derived by combining the proposed variational neuron selection algorithm and the backward propagation of variance (BPV) method. In addition, a secondary classification of the selected variational neurons is applied to model the fabrication-induced correlation between n- and p-type devices. The neural network-based statistical modeling approach has been well implemented and verified on the GAA simulation data and the 16nm node foundry FinFET, which indicates its great potential in modeling emerging and advanced device technology.
Wu Dai, Zhao Rong, Baokang Peng, Lining Zhang, Runsheng Wang, Ru Huang 0001
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.4