Demo Data from EDBT 2026 / reviewers in the wild / expert
Zifei Cai
dblp:389/7197
· DBLP profile ↗
1ranked-venue papers
1as first author
1since 2021 · last 2024
0009-0007-1606-7428ORCID · reported
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1 · 1 first-author · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 67% Integrated circuit design · 33% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › technology computer-aided design
device simulation |
0.8 | 1 | 2024 | Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices · DAC 2024 |
Integrated circuit design
semiconductor device modeling |
0.8 | 1 | 2024 | Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices · DAC 2024 |
Electronic design automation
technology computer-aided design |
0.8 | 1 | 2024 | Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices · DAC 2024 |
Methods — techniques the papers use, named apart from their topics
radial basis function neural network · 0.8physics-informed neural network · 0.8
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2024 | Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor DevicesabstractTechnology Computer Aided Design (TCAD) is a crucial step in the design and manufacturing of semiconductor devices. It involves solving physical equations that describe the behavior of semiconductor devices to predict various device parameters. Traditional TCAD methods, such as finite volume and finite element methods, discretize relevant physical equations to achieve numerical simulations of devices, significantly burdening the computation resources. For the first time, this paper proposes a novel method for TCAD simulation based on Physics-Informed Neural Networks (PINNs). We proposed multi-order differential neural network (MDNN), an improved Radial Basis Function Neural Network (RBFNN) model. By training MDNN, it achieves the couple solution of the Poisson equation and drift-diffusion equation under steady-state conditions, without the need for a pre-existing dataset. To the best of our knowledge, this marks the first instance of an ML-TCAD simulation that does not require any pre-existing data. For an example of PN junction diode, this method effectively simulates the basic physical characteristics of the device, with a self-consistent solution error of less than 1×10−5. Zifei Cai, Anaoxue Huang, Yifeng Xiong, Dejiang Mu, Xiangshui Miao, Xingsheng Wang |
DAC | 1 |