New FPGA deign using Dopant-Segregated Schottky MOSFET (DSS-MOSFET) and nonvolatile configuration memory (NCM) has been presented. Both of these devices can be fabricated by mature process for mass production. DSS-MOSFET has very low On-state resistance due to the high density dopant at source/drain junction. Therefore, FPGA is one of the best applications for the use of DSS-MOSFET since DSS-MOSFET can effectively improve not only CMOS logic performance but also pass-transistor logic performance. In addition, NCM with large On/Off resistance ratio, such as ionic memory, is adopted to replace SRAM-based configuration memory. Since NCM is fabricated between interconnect layers of CMOS, silicon area is smaller than in the case of SRAM. Furthermore, since NCM is a nonvolatile device, it is possible to reduce the power consumption by cutting off the power supply of unused circuit blocks. We developed a SPICE model of DSS-MOSFET to measure the delay of basic circuit in FPGA, and confirmed about 18% delay improvement for look-up-table with four to six inputs. We also designed physical layout to evaluate the area reduction of configuration memory, and verified the area of NCM is about 2.8X smaller than that of SRAM-based. Twenty largest MCNC benchmarks indicate that 26% improvement in critical path delay on average, and 15% improvement in area delay products on average can be achieved by the use of DSS-MOSFET and NCM.

Recent progress of through-silicon-via (TSV) process is so impressive that everyone can expect real 3D-IC era. The most valuable advantages of 3D-IC is decreasing interconnects. Although analysis of this advantages has been reported in some specific case study, the general theory for quantitative analysis has not been studied. In some cases, the advantage of 3D-IC has been overestimated and much different from that of real chip designs expected. This paper presents the qualitative analysis of general 3D-IC design especially for sub-65nm CMOS generation from designers' point of view. What is understood from this paper is how important IC-design is for 3D-IC and how to gain a big advantage of 3D-IC.