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Hui Zhao 0014

dblp:39/6153-14 · DBLP profile ↗
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3ranked-venue papers
0as first author
0since 2021 · last 2013
0000-0003-2384-1606ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 3Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Integrated circuit design · 100%
Computer networks
1 paper
Physical-layer communications · 100%

Topics — the 3 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
low-power circuit design		 0.112011
Low power 3.1-10.6 GHz IR-UWB transmitter for Gbps wireless communications · Sci. China Inf. Sci. 2011
Integrated circuit design › analog and mixed-signal circuits
mixed-signal circuit design		 0.112011
Co-design of ESD protection and UWB RF front-end ICs · Sci. China Inf. Sci. 2011
Integrated circuit design › radio-frequency circuit design
radio frequency integrated circuits		 0.112011
Low power 3.1-10.6 GHz IR-UWB transmitter for Gbps wireless communications · Sci. China Inf. Sci. 2011

Methods — techniques the papers use, named apart from their topics

impulse radio · 0.1
YearPublicationVenuePosition
2013 Heterogeneous integration of nano enabling devices for 3D ICs
abstract
For decades, advances in integrated circuits (IC) have been driven by continuous scaling down of planar IC technologies. As IC scaling rapidly approaches to technical brick wall, 3D IC heterogeneous integration emerges as a viable solution for future integrated electronics. Future complex system-on-a-chip (SoC) requires high-performance active devices, and novel passive and supporting devices. This paper reviews recent advances in develop 3D magnetic-enhanced inductors and 3D on-chip electrostatic discharging (ESD) structures to achieve heterogeneous 3D ICs with high performance and reliability simultaneously.
Li Wang 0058, Rui Ma 0003, Chen Zhang 0017, Zongyu Dong, Xin Wang 0031, Zitao Shi, Jian Liu 0027, Lin Lin 0011, Hui Zhao 0014, Fei Lu 0004, Jing Zhan, Ru Huang 0001, Albert Wang 0001
 ISLPED9
2011 Low power 3.1-10.6 GHz IR-UWB transmitter for Gbps wireless communications
Xin Wang 0031, Lin Lin 0011, He Tang 0003, Hui Zhao 0014, Jian Liu 0027, Siqiang Fan, Albert Wang 0001, Bin Zhao 0002, Liwu Yang, Gary Zhang
 Sci. China Inf. Sci.4
2011 Co-design of ESD protection and UWB RF front-end ICs
Xin Wang 0031, He Tang 0003, Lin Lin 0011, Jian Liu 0027, Hui Zhao 0014, Albert Wang 0001, Zitao Shi, Siqiang Fan, Bin Zhao 0002, Liwu Yang
 Sci. China Inf. Sci.6