EDBT 2026 Demo / reviewers in the wild / expert
Yiqun Niu
dblp:395/9813
· DBLP profile ↗
4ranked-venue papers
1as first author
4since 2021 · last 2026
0000-0003-4364-7018ORCID · reported
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1 · 1 since 2021Databases, data management, data science and information retrieval · 1 · 1 since 2021Graphics, computer vision, multimedia, augmented reality and games · 1 · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 67% High-performance computing · 33% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › circuit modeling
equivalent circuit modeling |
1.0 | 1 | 2026 | An Equivalent Multiphysics Circuit Framework for Electro-Thermal-Mechanical Coupling Simulation in Integrated Circuits by Proposing a SPICE Compatible Equivalent Mechanical Circuit Method · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 |
High-performance computing
multi-physics simulation |
1.0 | 1 | 2026 | An Equivalent Multiphysics Circuit Framework for Electro-Thermal-Mechanical Coupling Simulation in Integrated Circuits by Proposing a SPICE Compatible Equivalent Mechanical Circuit Method · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 |
Electronic design automation › circuit simulation › analog circuit simulation
SPICE simulation |
1.0 | 1 | 2026 | An Equivalent Multiphysics Circuit Framework for Electro-Thermal-Mechanical Coupling Simulation in Integrated Circuits by Proposing a SPICE Compatible Equivalent Mechanical Circuit Method · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 |
Methods — techniques the papers use, named apart from their topics
finite element method · 1.0equivalent mechanical circuit method · 1.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | An Equivalent Multiphysics Circuit Framework for Electro-Thermal-Mechanical Coupling Simulation in Integrated Circuits by Proposing a SPICE Compatible Equivalent Mechanical Circuit MethodabstractModeling and analyzing multiphysics effects has become one of the most challenging issues in integrated circuit design. Equivalent thermal circuit method is one of the most commonly used method in circuit design to simulate the electrothermal coupling effects, since it is fast and compatible with SPICE. However, it is still difficult to realize electro-thermalmechanical coupling simulation based on equivalent circuit method due to a lack of equivalent mechanical circuit method, which brings difficulties to do electro-thermal-mechanical analysis by SPICE. The equivalent mechanical circuit method is proposed based on solid mechanics equilibrium equation by deriving the electro-mechanical equivalent relation, equivalent circuit elements, equivalent circuit structure, equivalent circuit boundary condition, and the solving algorithm. The equivalent multiphysics circuit of TSV and FinFET are then further constructed to simulate the electro-thermal-mechanical coupling effects and verified with simulation results obtained from the finite element method (FEM). The results show that our proposed equivalent multiphysics circuit framework is able to simulate the electro-thermal-mechanical coupling effects by SPICE in integrated circuits. Yizhang Liu, Yiqun Niu, Yinshui Xia |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 3 |
| 2025 | Regret Optimization Experience Replay in Off-Policy Reinforcement LearningabstractExperience Replay (ER) allows Deep Reinforcement Learning (RL) agent to reuse past experience, as though recall the same Experience repeatedly. ER enables RL algorithm to be trained by reusing previous states, so that RL agent can obtain more accurate value estimations and action selections. Current policy algorithms either have a rule-based replay policy or uniformly replay past experiences, which may be suboptimal. The agent is updated based on the replay data to maximize the cumulative reward, and the replay policy is updated to provide the more valuable experience for the agent. In this work, we propose a novel experience replay algorithm Regret Minimization Experience Replay (RMER), to improve the immediate reward via sampling and ensure certain exploration capability of agent. Finally, we prove the ascendency of RMER with different off- policy algorithms on the suite of Open AI gym continuous control tasks. Jie Zhang 0152, Yirong Yao, Yiqun Niu, Chong-Jun Wang |
ICASSP | 4 |
| 2025 | Memory-Enhanced Cognitive Planning: A Framework for Improving Long-Term Planning in LLMs
Yiqun Niu, Zhongheng Wu, Chong-Jun Wang |
ICIC (10) | 1 |
| 2024 | Shapley-Optimized Reinforcement Learning for Human-Machine Collaboration Policy
Jie Zhang 0152, Yiqun Niu, Chong-Jun Wang |
DASFAA (2) | 2 |