Demonstration venue · read-only. Every page can be browsed; the buttons that would change it are switched off. Create an account to run TaxoReview on your own data. A simulation from public publication records: the people listed were not invited and did not agree to review.
? Tutorial for this page

Jung W. Park

dblp:40/1271 · DBLP profile ↗
← Back
3ranked-venue papers
2as first author
0since 2021 · last 2008
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Graphics, computer vision, multimedia, augmented reality and games · 3 · 2 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer graphics and multimedia
3 papers
Computational fabrication · 63% Computer animation and physical simulation · 33% Geometric modeling and processing · 4%

Topics — the 3 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Computational fabrication › machining
surface machining
0.112008
Analytical and practical investigation of surface machining · Comput. Aided Des. 2008
Computer animation and physical simulation
cutting simulation
0.112005
Hybrid cutting simulation via discrete vector model · Comput. Aided Des. 2005
Computational fabrication › numerical control
NC verification
0.011998
Modeling the surface swept by a generalized cutter for NC verification · Comput. Aided Des. 1998

Methods — techniques the papers use, named apart from their topics

analytical modeling · 0.1
YearPublicationVenuePosition
2008 Analytical and practical investigation of surface machining
Jung W. Park
Comput. Aided Des.1
2005 Hybrid cutting simulation via discrete vector model
Jung W. Park, Yang H. Shin, Yun C. Chung
Comput. Aided Des.1
1998 Modeling the surface swept by a generalized cutter for NC verification
Yun C. Chung, Jung W. Park, Hayong Shin, Byoung Kyu Choi
Comput. Aided Des.2