Demo Data from EDBT 2026 / reviewers in the wild / expert
Linlin Cai
dblp:40/1936
· DBLP profile ↗
4ranked-venue papers
1as first author
3since 2021 · last 2026
—ORCID · conflict
Domains — the database's venue-derived domains; a paper can count in several
Artificial intelligence and machine learning · 1Systems, architecture and hardware · 1 · 1 since 2021Human-computer interaction and ubiquitous computing · 1 · 1 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Human-computer interaction and pervasive computing
1 paper |
Personal fabrication and tangible interfaces · 77% Immersive interaction · 23% | |
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Hardware reliability and fault tolerance · 100% |
Topics — the 3 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Hardware reliability and fault tolerance › aging
electromigration reliability |
0.5 | 1 | 2021 | A physics-based electromigration reliability model for interconnects lifetime prediction · Sci. China Inf. Sci. 2021 |
Immersive interaction
mixed reality |
0.2 | 1 | 2023 | 4Doodle: 4D Printing Artifacts Without 3D Printers · CHI 2023 |
Hardware reliability and fault tolerance › reliability analysis
interconnect reliability |
0.1 | 1 | 2021 | A physics-based electromigration reliability model for interconnects lifetime prediction · Sci. China Inf. Sci. 2021 |
Methods — techniques the papers use, named apart from their topics
user study · 0.7mixed reality system · 0.7physics-based modeling · 0.5
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | Zero-temperature-coefficient-powered design technology co-optimization for temperature-immune digital circuits
Wangyong Chen, Ling Xiong, Songxuan He, Linlin Cai |
Integr. | 4 |
| 2023 | 4Doodle: 4D Printing Artifacts Without 3D Printersabstract4D printing encodes transformability over time, which empowers users to create artifacts by on-demand deformation. The creative process of 4D printing shape-changing artifacts can be challenging because of its discontinuous fabrication steps, such as digital designing, specific path planning, automatic printing and manual triggering. We hypothesize that switching from typical 4D printing reliant on 3D printers to a more “handcrafted” method can allow users to understand and continuously reflect upon the artifact and its transformability. Towards this vision, we introduce 4Doodle, a hybrid craft approach that integrates unique deformation controllability and five techniques for freehand 4D printing, using a 3D pen. To tackle the shape-changing challenges of uncertain hands-on fabrication, we develop a mixed reality system to help novices master the manual skills of 4D printing. We also demonstrate a series of 4D printed artifacts with fully human intervention. Finally, our user study shows that 4Doodle lowers the skill-acquisition barrier associated with handcrafting 4D printed artifacts, and it has great potential for creative production and spatial ability. Ye Tao 0001, Junzhe Ji, Linlin Cai, Hongmei Xia, Jinghai He, Yitao Fan, Shengzhang Pan, Jinghua Xu, Cheng Yang 0014, Lingyun Sun, Guanyun Wang |
CHI | 4 |
| 2021 | A physics-based electromigration reliability model for interconnects lifetime prediction
Linlin Cai, Wangyong Chen, Jinfeng Kang, Gang Du |
Sci. China Inf. Sci. | 1 |
| 2014 | Knowledge-based extraction of intellectual capital-related information from unstructured data
Eric Tsui, Wai Ming Wang, Linlin Cai, Chi Fai Cheung, Wing Bun Lee |
Expert Syst. Appl. | 3 |