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Ulrich Weinert

dblp:40/2117 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 1990
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 50% Integrated circuit design · 50%
Interdisciplinary, comprehensive, and emerging computing
1 paper
Computational science and engineering · 100%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › technology computer-aided design
process simulation
0.011990
A simulation system for diffusive oxidation of silicon: a two-dimensional finite element approach · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1990
Integrated circuit design
semiconductor process modeling
0.011990
A simulation system for diffusive oxidation of silicon: a two-dimensional finite element approach · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1990
Computational science and engineering
finite element analysis
0.011990
A simulation system for diffusive oxidation of silicon: a two-dimensional finite element approach · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1990

Methods — techniques the papers use, named apart from their topics

thermodynamic modeling · 0.0finite element method · 0.0
YearPublicationVenuePosition
1990 A simulation system for diffusive oxidation of silicon: a two-dimensional finite element approach
abstract
A numerical approach to the simulation of two-dimensional local oxidation of silicon is presented. The key idea is the description of the oxidation as a three-component thermodynamic process involving silicon, silicon dioxide, and oxidant molecules. This results in a reactive layer of finite width, in contrast to the sharp interface between silicon and dioxide in the conventional formulation. The numerical approximation takes advantage of this description in a finite-element approach which models silicon, dioxide, and reactive layer as a whole, removing the necessity of tracking the interface with element edges. It is shown that a suitable parameter identification results in an interface motion equivalent to that of the Deal-Grove model. Numerical examples show the advantages of the approach.>
Ernst Rank, Ulrich Weinert
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.2