EDBT 2026 Demo / reviewers in the wild / expert
John R. Camagna
dblp:40/668
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 1992
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 62% Performance modeling and evaluation · 38% |
Topics — the 4 heaviest of 5, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › technology computer-aided design
process simulation |
0.0 | 1 | 1992 | A utility-based integrated system for process simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992 |
Performance modeling and evaluation › simulation › simulation software
simulation framework |
0.0 | 1 | 1992 | A utility-based integrated system for process simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992 |
Electronic design automation
CAD framework |
0.0 | 1 | 1992 | A utility-based integrated system for process simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992 |
Electronic design automation
technology computer-aided design |
0.0 | 1 | 1992 | A utility-based integrated system for process simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 1992 |
Methods — techniques the papers use, named apart from their topics
functional utilities · 0.0cross-section format mapping · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1992 | A utility-based integrated system for process simulationabstractAn integrated process simulation system which uses functional utilities to integrate disparate 2-D simulation tools is described. The software utilities provide mechanisms for simulator input generation and user interaction, for mapping between different cross-section formats, and for output visualization. The specific utilities are described. With this approach, several process simulators for lithography, etching, deposition, and thermal processing have been integrated into a unified system, SIMPL-IPX (simulation of profiles from the layout-integrated process simulation environment with X-Windows). Simulation examples for metal l planarization, bipolar technology with a polysilicon , collector 5 plug, and advanced lithography are presented to demonstrated 7 the usefulness of this approach to technology CAD tool 8 integration. Methods for improved data management using 9 a CAD framework are described.> Edward W. Scheckler, Alexander S. Wong, Robert K. Wang, Goodwin R. Chin, John R. Camagna, Andrew R. Neureuther, Robert W. Dutton |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 5 |