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K. Madhu Kiran

dblp:402/7314 · DBLP profile ↗
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1ranked-venue papers
1as first author
1since 2021 · last 2025
0000-0002-9274-2524ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 first-author · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 67% Integrated circuit design · 33%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
3d integration
0.912025
Sampling-Biorthogonal Time-Domain Technique for Temperature-Dependent Transient Analysis of Coaxial-TGVs in 3-D Integration · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025
Electronic design automation › signal integrity
crosstalk analysis
0.912025
Sampling-Biorthogonal Time-Domain Technique for Temperature-Dependent Transient Analysis of Coaxial-TGVs in 3-D Integration · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025
Electronic design automation
signal integrity
0.912025
Sampling-Biorthogonal Time-Domain Technique for Temperature-Dependent Transient Analysis of Coaxial-TGVs in 3-D Integration · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025

Methods — techniques the papers use, named apart from their topics

transmission line modeling · 0.9sampling-biorthogonal time-domain technique · 0.9
YearPublicationVenuePosition
2025 Sampling-Biorthogonal Time-Domain Technique for Temperature-Dependent Transient Analysis of Coaxial-TGVs in 3-D Integration
abstract
A novel sampling-biorthogonal time-domain (SBTD) technique by considering the positive sampling basis and biorthogonal dual testing functions is developed to accurately model temperature-dependent crosstalk effects in circular and square coaxial-through glass vias (C-TGVs). An equivalent transmission-line model employing EM theory-based Bessel and Neumann functions to establish closed-form formulae for the frequency- and temperature-dependent resistance, inductance, capacitance, and conductance (per-unit-height) of both C-TGV configurations is presented. The efficacy of proposed SBTD technique is verified with SPICE results and conventional finite-difference time-domain (FDTD) technique. The SBTD technique proves more efficient with respect to FDTD, exhibiting less than 0.7% average error in estimating dynamic crosstalk-induced delay with lesser computational effort. Therefore, it is very useful for addressing the issues of electromagnetic interference and electromagnetic compatibility in 3-D integration.
K. Madhu Kiran, Rohit Dhiman
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1