EDBT 2026 Demo / reviewers in the wild / expert
Seokchan Yoon
dblp:412/2115
· DBLP profile ↗
2ranked-venue papers
0as first author
2since 2021 · last 2025
0000-0003-4139-9778ORCID · corroborated
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 2 · 2 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
2 papers |
Integrated circuit design · 78% Memory systems · 22% |
Topics — the 5 heaviest of 5, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design › semiconductor devices
device design |
1.1 | 2 | 2025 | Device Design Guidelines to Boost Up AC Performance of CFET (Complementary Field-Effect-Transistor)-Based Inverter · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025 Study of 3-D Line Edge Roughness (LER) in Vertical Channel Array Transistor for DRAM · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025 |
Integrated circuit design
digital circuit design |
0.9 | 1 | 2025 | Device Design Guidelines to Boost Up AC Performance of CFET (Complementary Field-Effect-Transistor)-Based Inverter · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025 |
Memory systems
DRAM |
0.9 | 1 | 2025 | Study of 3-D Line Edge Roughness (LER) in Vertical Channel Array Transistor for DRAM · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025 |
Integrated circuit design
semiconductor device modeling |
0.9 | 1 | 2025 | Study of 3-D Line Edge Roughness (LER) in Vertical Channel Array Transistor for DRAM · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025 |
Integrated circuit design › digital circuit design › logic gate design
CMOS inverter |
0.3 | 1 | 2025 | Device Design Guidelines to Boost Up AC Performance of CFET (Complementary Field-Effect-Transistor)-Based Inverter · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2025 |
Methods — techniques the papers use, named apart from their topics
mixed-mode simulation · 1.7TCAD simulation · 0.9DC/AC performance analysis · 0.9
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2025 | Device Design Guidelines to Boost Up AC Performance of CFET (Complementary Field-Effect-Transistor)-Based InverterabstractComplementary field-effect transistors (CFETs) have emerged as promising candidates for next-generation semiconductor devices. CFETs feature a structure with an nMOS (or pMOS) transistor at the bottom and a transistor of the opposite type at the top. CFETs can be classified into Fin-CFETs or GAA-CFETs based on their channel structure. In this study, we compare and analyze these two devices to determine which structure is more favorable for device scaling and which device exhibits better performance per unit area. For a reliable analysis, the threshold voltage was adjusted to be the same for all devices. Initially, to compare the DC performance, the on-state drive currents in both linear mode and saturation mode operations were extracted and compared from the$I_{\mathrm { DS}}$-versus-$V_{\mathrm { GS}}$input-transfer characteristics. Subsequently, complementary metal-oxide-semiconductor inverters were constructed to compare their AC performance. Six parameters were extracted and compared: high-to-low propagation delay ($t_{pLH}$), falling time ($t_{f}$), low-to-high propagation delay ($t_{pLH}$), rising time ($t_{r}$), overshoot voltage ($V_{ov}$), and undershoot voltage ($V_{und}$). Based on the results, we suggest which CFET structure is more suitable for device scaling. Jaehyuk Lim, Donghwan Han, Juho Sung, Seokchan Yoon, Sanghyun Kang, Gwon Kim, Hyoung Won Baac, Changhwan Shin |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 4 |
| 2025 | Study of 3-D Line Edge Roughness (LER) in Vertical Channel Array Transistor for DRAMabstractLine edge roughness (LER) is an undesirable phenomenon that arises during semiconductor fabrication processes, causing fluctuations in the characteristics of semiconductor devices and potentially leading to significant yield degradation. Consequently, LER must be meticulously considered before fabricating integrated circuits. In this study, we present an approach for implementing and analyzing LER in vertical channel array transistors (VCATs) with a gate-all-around (GAA) structure for dynamic random access memory applications. Initially, we propose a method for reliably implementing LER in GAA semiconductor devices. Next, we extend the method to more complex structures beyond the basic cylindrical GAA structure. Utilizing the proposed method, we investigate the impact of LER on various VCAT device configurations by examining DC performance metrics such as IOFF, IDS,LIN, IDS,SAT, VT,LIN, VT,SAT, IOV,LIN, and IOV,SAT. Additionally, we explore AC performance metrics (THOLD, TREAD, and TWRITE) through mixed-mode simulations. The results show that the parameters influencing LER-induced fluctuations in VCATs vary depending on the transistor’s operating region (i.e., whether the transistor is turned on or not). Jaehyuk Lim, Seokchan Yoon, Juho Sung, Sanghyun Kang, Gwon Kim, Hyoung Won Baac, Changhwan Shin |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |