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Randy Morris

dblp:42/1577 · DBLP profile ↗
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8ranked-venue papers
4as first author
0since 2021 · last 2014
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 7 · 4 first-authorComputer networks · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
3 papers
Interconnection networks and networks-on-chip · 57% Memory systems · 24% Hardware reliability and fault tolerance · 9%

Topics — the 8 heaviest of 9, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Interconnection networks and networks-on-chip
optical network-on-chip
0.322014
Three-Dimensional Stacked Nanophotonic Network-on-Chip Architecture with Minimal Reconfiguration · IEEE Trans. Computers 2014
Dynamic Reconfiguration of 3D Photonic Networks-on-Chip for Maximizing Performance and Improving Fault Tolerance · MICRO 2012
Interconnection networks and networks-on-chip
3d network-on-chip
0.212014
Three-Dimensional Stacked Nanophotonic Network-on-Chip Architecture with Minimal Reconfiguration · IEEE Trans. Computers 2014
Memory systems
cache coherence
0.212014
Extending the Performance and Energy-Efficiency of Shared Memory Multicores with Nanophotonic Technology · IEEE Trans. Parallel Distributed Syst. 2014
Interconnection networks and networks-on-chip › network-on-chip design
reconfigurable noc
0.212014
Three-Dimensional Stacked Nanophotonic Network-on-Chip Architecture with Minimal Reconfiguration · IEEE Trans. Computers 2014
Memory systems › cache coherence › cache coherence protocol
snoopy coherence
0.212014
Extending the Performance and Energy-Efficiency of Shared Memory Multicores with Nanophotonic Technology · IEEE Trans. Parallel Distributed Syst. 2014
Hardware reliability and fault tolerance › fault-tolerant architecture
fault-tolerant noc
0.112012
Dynamic Reconfiguration of 3D Photonic Networks-on-Chip for Maximizing Performance and Improving Fault Tolerance · MICRO 2012
Energy-efficient computing › energy-efficient communication
on-chip interconnect energy
0.122014
Extending the Performance and Energy-Efficiency of Shared Memory Multicores with Nanophotonic Technology · IEEE Trans. Parallel Distributed Syst. 2014
Dynamic Reconfiguration of 3D Photonic Networks-on-Chip for Maximizing Performance and Improving Fault Tolerance · MICRO 2012
Processor architecture and microarchitecture
chip multiprocessor
0.112014
Three-Dimensional Stacked Nanophotonic Network-on-Chip Architecture with Minimal Reconfiguration · IEEE Trans. Computers 2014

Methods — techniques the papers use, named apart from their topics

simulation · 0.5dynamic reconfiguration · 0.13d stacking · 0.1
YearPublicationVenuePosition
2014 Three-Dimensional Stacked Nanophotonic Network-on-Chip Architecture with Minimal Reconfiguration
abstract
As throughput, scalability, and energy efficiency in network-on-chips (NoCs) are becoming critical, there is a growing impetus to explore emerging technologies for implementing NoCs in future multicore and many-core architectures. Two disruptive technologies on the horizon are nanophotonic interconnects (NIs) and 3D stacking. NIs can deliver high on-chip bandwidth while delivering low energy/bit, thereby providing a reasonable performance-per-watt in the future. Three-dimensional stacking can reduce the interconnect distance and increase the bandwidth density by incorporating multiple communication layers. In this paper, we propose an architecture that combines NIs and 3D stacking to design an energy-efficient and reconfigurable NoC. We quantitatively compare the hardware complexity of the proposed topology to other nanophotonic networks in terms of hop count, network diameter, radix, and photonic parameters. To maximize performance, we also propose an efficient reconfiguration algorithm that dynamically reallocates channel bandwidth by adapting to traffic fluctuations. For 64-core reconfigured network, our simulation results indicate that the execution time can be reduced up to 25 percent for Splash-2, PARSEC, and SPEC CPU2006 benchmarks. Moreover, for a 256-core version of the proposed architecture, our simulation results indicate a throughput improvement of more than 25 percent and energy savings of 23 percent on synthetic traffic when compared to competitive on-chip electrical and optical networks.
Randy Morris, Avinash Karanth, Ahmed Louri, Ralph D. Whaley
IEEE Trans. Computers1
2014 Extending the Performance and Energy-Efficiency of Shared Memory Multicores with Nanophotonic Technology
abstract
As the number of cores increases exponentially on a single chip, the design and integration of both the on-chip network facilitating intercore communication, and the cache coherence protocol for enabling shared memory programming have become critical for improved energy-efficiency and overall chip performance. With traditional metal interconnects facing stringent energy constraints, researchers are currently pursuing disruptive solutions such as nanophotonics for improved energy-efficiency. Cache coherence in multicores can be enforced effectively by snoopy protocols; however, broadcasting every cache miss can limit the scalability while consuming excess energy. In this paper, we propose PULSE, a nanophotonic broadcast tree-based network for snoopy cache coherent multicores. To limit the energy-penalty from broadcasting (and thereby splitting) optical signals, we direct the optical signal from the external laser such that only the subset of requesters can receive the optical signal. Furthermore, as cache blocks are shared by a few cores, we propose a multicast version of PULSE called multi-PULSE that predicts the sharers' for each L2 miss and morphing the broadcast to a multicast network. We evaluate the energy and performance using CACTI and SIMICS on 16-core and 64-core versions of PULSE and multi-PULSE for Splash-2, PARSEC, and SPEC CPU2006 benchmarks and compare to electrical networks, optical networks, and another cache filtering techniques. Our results indicate that PULSE outperforms competitive electrical/optical networks by 60 percent in terms of execution time, and multi-PULSE reduces average energy from 10 to 80 percent even with a few mispredictions.
Randy Morris, Evan Jolley, Avinash Karanth
IEEE Trans. Parallel Distributed Syst.1
2013 Extending the Energy Efficiency and Performance With Channel Buffers, Crossbars, and Topology Analysis for Network-on-Chips
abstract
Network-on-chips (NoCs) have emerged as a scalable solution to the wire delay constraints, thereby providing a high-performance communication fabric for future multicores. Research has shown that power, area, and performance of the NoC architecture are tightly integrated with the design and optimization of the link, router (buffer and crossbar), and topology. Recent work has shown that adaptive channel buffers (on-link storage) can considerably reduce power consumption and area overhead by reducing or replacing the power-hungry router buffers. However, channel buffer design can lead to head-of-line (HoL) blocking, which eventually reduces the throughput of the network. In this paper, we design channel buffers and router crossbars to improve the performance (latency, throughput) while reducing the power consumption. In addition, we implement the proposed channel buffers and crossbar organizations in a concentrated torus (CTorus) topology which is a dual network without the additional area overhead. We compare other dual networks with leading topologies such as mesh2X, concentrated mesh2X (CMesh2X), and flattened butterfly2X (FBfly2X), each implemented with channel buffers. Our proposed designs analyze the power-performance-area tradeoff in designing channel buffers for NoC architectures while alleviating HoL blocking through buffer organizations and crossbar optimizations. Results using Synopsys design compiler showed that the buffer and crossbar organizations for an 8 × 8 mesh architecture can reduce power consumption by 25%-40%, improve throughput and reduce latency by 525%, while occupying 4%-13% more area when compared to the baseline architecture for both synthetic as well as real benchmark traces such as Princeton Application Repository for Shared-Memory Computers (PARSEC) and Standard Performance Evaluation Corporation (SPEC). CPU2006. When the energy-efficient buffer and crossbar organization was inserted into our CTorus topology, we further reduced energy dissipation by 32% and area by 53%, on average, over mesh2X, CMesh2X, and FBfly2X.
Dominic DiTomaso, Randy Morris, Avinash Karanth, Ashwini Sarathy, Ahmed Louri
IEEE Trans. Very Large Scale Integr. Syst.2
2012 3D-NoC: Reconfigurable 3D photonic on-chip interconnect for multicores
abstract
The power dissipation of metallic interconnects in future multicore architectures is projected to be a major bottleneck as we scale to sub-nanometer regime. This has motivated researchers to develop alternate power-efficient technology solutions to the performance limitations of future multicores. Nanophotonic interconnects (NIs) is a disruptive technology solution that is capable of delivering the communication bandwidth at low power dissipation when the number of cores is scaled to large numbers. Similarly, 3D stacking is another interconnect technology solution that can lead to low energy/bit for communication. In this paper, we propose to combine NIs with with 3D stacking to develop a scalable, reconfigurable, power-efficient and high-performance interconnect for future many-core systems called 3D-NoC. We propose to develop a multi-layer NIs that can dynamically reconfigure without system intervention and allocate channel bandwidth from less utilized links to more utilized communication links. Our simulation results indicate that the performance can be further improved by 10%-25% for Splash-2, PARSEC and SPEC CPU2006 benchmarks.
Randy Morris, Avinash Karanth, Ahmed Louri
ICCD1
2012 Dynamic Reconfiguration of 3D Photonic Networks-on-Chip for Maximizing Performance and Improving Fault Tolerance
abstract
As power dissipation in future Networks-on-Chips (NoCs) is projected to be a major bottleneck, researchers are actively engaged in developing alternate power-efficient technology solutions. Photonic interconnects is a disruptive technology solution that is capable of delivering the communication bandwidth at low power dissipation when the number of cores is scaled to large numbers. Similarly, 3D stacking is another interconnect technology solution that can lead to low energy/bit for communication. In this paper, we propose to combine photonic interconnects with 3D stacking to develop a scalable, reconfigurable, power-efficient and high-performance interconnect for future many-core systems, called R-3PO (Reconfigurable 3D-Photonic Networks-on-Chip). We propose to develop a multi-layer photonic interconnect that can dynamically reconfigure without system intervention and allocate channel bandwidth from less utilized links to more utilized communication links. In addition to improving performance, reconfiguration can re-allocate bandwidth around faulty channels, thereby increasing the resiliency of the architecture and gracefully degrading performance. For 64-core reconfigured network, our simulation results indicate that the performance can be further improved by 10%-25% for Splash-2, PARSEC and SPEC CPU2006 benchmarks, where as simulation results for 256-core chip indicate a performance improvement of more than 25% while saving 6%-36% energy when compared to state-of-the-art on-chip electrical and optical networks.
Randy Morris, Avinash Karanth, Ahmed Louri
MICRO1
2011 Co-design of channel buffers and crossbar organizations in NoCs architectures
abstract
Network-on-Chips (NoCs) have emerged as a scalable solution to the wire delay constraints, thereby providing a high-performance communication fabric for future multicores. Research has shown that power, area and performance of Network-on-Chips (NoCs) architecture are tightly integrated with the design and optimization of the link and router (buffer and crossbar). Recent work has shown that adaptive channel buffers (on-link storage) can considerably reduce power consumption and area overhead by reducing or replacing the power hungry router buffers. However, channel buffer design can lead to Head-of-Line (HoL) blocking which eventually reduces the throughput of the network. In this paper, we explore the design space of organizing channel buffers and router crossbars to improve the performance (latency, throughput) while reducing the power consumption. Our proposed designs analyze the power-performance-area trade-off in designing channel buffers for NoC architectures while overcoming HoL blocking through crossbar optimizations. Our simulation and NoC design synthesis shows that for a 8 × 8 mesh architecture, we can reduce the power consumption by 25-40%, improve performance by 10-25% while occupying 4-13% more area when compared to the baseline architecture.
Avinash Karanth, Randy Morris, Dominic DiTomaso, Ashwini Sarathy, Ahmed Louri
ICCAD2
2009 Design of a scalable nanophotonic interconnect for future multicores
abstract
As communication-centric computing paradigm gathers momentum due to increased wire delays and excess power dissipation with technology scaling, researchers have focused their attention on developing alternate technology solutions for Network-on-Chips (NoCs) architectures. One potential solution is nanophotonics because of higher bandwidth, reduced power dissipation and increased wiring simplification. In this paper, we propose PROPEL, a balanced power and area-efficient on-chip photonic interconnect for future multicores. PROPEL overcomes two fundamental issues facing NoCs architectures, namely power dissipation and area overhead, by a combination of multiplexing techniques (wave-length and space) and by exploiting the recent advances in optical component design space. We also propose a scalable version of PROPEL, called E-PROPEL which can scale to 256 cores. Our results indicate that PROPEL and E-PROPEL are power, cost and area-effective networks when compared to competing on-chip optical topologies when the number of optical components and overall power loss in the network are considered. Simulation results on synthetic traffic indicate that PROPEL performs better (throughput and power) than electrical and optical topologies.
Avinash Karanth, Randy Morris
ANCS2
2009 On-Chip photonic interconnects for scalable multi-core architectures
abstract
In this paper, we propose PROPEL, a photonic network-on-chip (NoC) that improves performance and power with energy-efficient opto-electronic components for future chip multiprocessors (CMPs). Our analytical and simulation results indicate that PROPEL improves throughput and reduces power over optical and electrical networks for various traffic traces while requiring fewer photonic components and devices.
Avinash Karanth, Randy Morris, Ahmed Louri
NOCS2