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Haoyu Jie

dblp:426/5514 · DBLP profile ↗
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1ranked-venue papers
0as first author
1since 2021 · last 2026
0009-0004-8792-8537ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 80% Reconfigurable computing and FPGAs · 20%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › physical design › placement
congestion-aware placement
1.012026
TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement · FPGA 2026
Reconfigurable computing and FPGAs
multi-FPGA system
1.012026
TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement · FPGA 2026
Electronic design automation
physical design
1.012026
TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement · FPGA 2026
Electronic design automation › physical design › floorplanning
pin assignment
1.012026
TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement · FPGA 2026
Electronic design automation › physical design
placement
1.012026
TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement · FPGA 2026

Methods — techniques the papers use, named apart from their topics

time-division multiplexing · 1.0global placement · 1.0
YearPublicationVenuePosition
2026 TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement
abstract
Large-scale multi-FPGA systems are widely used in modern emulation systems. As a critical part of the multi-FPGA system design flow, TDM signal grouping and package pin assignment directly impact the final placement and routing in the FPGA physical implementation. Poor pin assignments cause severe congestion and timing degradation at the logic-element level, while existing approaches lack accurate congestion modeling during system-level partitioning. This paper presents Chimew, a novel pin assignment methodology that leverages placement prototyping to predict logic-element-level congestion before physical implementation precisely. The proposed method co-optimizes signal grouping and pin placement through iterative refinement guided by congestion-aware cost functions derived from fast global placement. Experimental results demonstrate a 28% congestion reduction and up to 2.87ns less worst negative slack (WNS) compared to industrial tools while achieving a 100% success rate across diverse multi-FPGA benchmarks.
Runzhe Tao, Jing Mai, Xun Jiang 0002, Cuiliu Yang, Haoyu Jie, Kan Huang, Richard Y. Sun, Yibo Lin
FPGA7